IRF614B ,250V N-Channel MOSFETIRF614B/IRFS614BNovember 2001IRF614B/IRFS614B250V N-Channel MOSFET
IRF614PBF ,250V Single N-Channel HEXFET Power MOSFET in a TO-220AB packagelnternatiqnal
TOR Rectifier
PD-9.47SB
IfRF614.
HEXFET® Power MOSFET
. Dynamic dv/dt Ra ..
IRF614S ,250V Single N-Channel HEXFET Power MOSFET in a D2-Pak packagePD-9.1003
IRF614S
lhternatiqnal
TOR Rectifier
HEXFET® Power MOSFET
. Surface Mount
..
IRF614S ,250V Single N-Channel HEXFET Power MOSFET in a D2-Pak packageapplications because of its low internal connection
resistance and can dissipate up to 2.0W in a t ..
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IS62LV256-70TI , 32K x 8 LOW VOLTAGE STATIC RAM
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IS62LV2568LL-70H , 256K x 8 LOW POWER and LOW Vcc CMOS STATIC RAM
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IS62LV2568LL-70HI , 256K x 8 LOW POWER and LOW Vcc CMOS STATIC RAM
IRF614B
250V N-Channel MOSFET
IRF614B/IRFS614B November 2001 IRF614B/IRFS614B 250V N-Channel MOSFET General Description Features These N-Channel enhancement mode power field effect • 2.8A, 250V, R = 2.0Ω @V = 10 V DS(on) GS transistors are produced using Fairchild’s proprietary, • Low gate charge ( typical 8.1 nC) planar, DMOS technology. • Low Crss ( typical 7.5 pF) This advanced technology has been especially tailored to • Fast switching minimize on-state resistance, provide superior switching • 100% avalanche tested performance, and withstand high energy pulse in the • Improved dv/dt capability avalanche and commutation mode. These devices are well suited for high efficiency switching DC/DC converters and switch mode power supplies. D G TO-220 TO-220F G D S G D S IRF Series IRFS Series S Absolute Maximum Ratings T = 25°C unless otherwise noted C Symbol Parameter IRF614B IRFS614B Units V Drain-Source Voltage 250 V DSS I - Continuous (T = 25°C) Drain Current 2.8 2.8 * A D C - Continuous (T = 100°C) 1.8 1.8 * A C I (Note 1) Drain Current - Pulsed 8.5 8.5 * A DM V Gate-Source Voltage ± 30 V GSS E (Note 2) Single Pulsed Avalanche Energy 45 mJ AS I Avalanche Current (Note 1) 2.8 A AR E (Note 1) Repetitive Avalanche Energy 4.0 mJ AR dv/dt Peak Diode Recovery dv/dt (Note 3) 5.5 V/ns P Power Dissipation (T = 25°C) 40 22 W D C - Derate above 25°C 0.32 0.18 W/°C T , T Operating and Storage Temperature Range -55 to +150 °C J STG Maximum lead temperature for soldering purposes, T 300 °C L 1/8" from case for 5 seconds * Drain current limited by maximum junction temperature. Thermal Characteristics Symbol Parameter IRF614B IRFS614B Units R Thermal Resistance, Junction-to-Case Max. 3.14 5.58 °C/W θJC R Thermal Resistance, Case-to-Sink Typ. 0.5 -- °C/W θCS R Thermal Resistance, Junction-to-Ambient Max. 62.5 62.5 °C/W θJA ©2001 Rev. A, November 2001
