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IR2170-IR2170S
Current Sensing IC in a 8-pin DIP package
International
TCdl Rectifier
Preliminary Data Sheet No. PD60186-C
|R2170(S)
OVER CURRENT SENSING IC
Features
Floating channel up to +600V
Monolithic integration
Overcurrent sensing through shunt resistor
Low IQBS allows the boot strap power supply
Independent fast msec overcurrent trip signal
High common mode noise immunity
Input overvoltage protection for IGBT short circuit
condition
. Open Drain outputs
Description
IR2170(S) is the monolithic over current sensing IC de-
signed for motor drive applications. It senses the motor
phase current through an external shunt resistor, de-
tects overcurrent condition, and transfers the signal to
the low side. IR's proprietary high voltage isolation tech-
nology is implemented to enable the high bandwidth)
nal processing. The dedicated overcurrent trip (OS)
signal facilitates IGBT short circuit protection. The oc
Product Summary
600Vmax
VOFFSET
Overcurrent trip
signal delay
1.5usec (typ)
Overcurrent trip level +/-260mV (typ.)
Packages
8-Lead SOIC
8-Lead PDIP
output pulse width can be programmed by the external resistor and capacitor. The open-drain outputs make easy for
any interface from 3.3V to 15V.
Typical Application
Vdd H ‘._.
=0.47 uF
(AGND) i,' Vs
a---. To Motor Phase
(DGND)
IR2170
(Circuit Common = DC Bus Negative)
(Refer to Lead Assignments for correct pin coMguration). This/These diagram(s) show electrical connections only. Please
refer to our Application Notes and DesignTips for proper circuit board layout.
IR2170(S) International
TOR Rectifier
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage
parameters are absolute voltages referenced to COM, all currents are dehned positive into any lead. The thermal
resistance and power dissipation ratings are measured under board mounted and still air conditions.
Symbol Definition Min. Max. Units
Vs High side offset voltage -0.3 600
V33 High side floating supply voltage -0.3 25
VCC Low side and logic fixed supply voltage -0.3 25
VIN Maximum input voltage between v.N+ and VIN. -5 5 V
VOC Overcurrent output voltage COM -0.3 VCC +0.3
VIN- VIN- input voltage (note 1) Vs -5 VB+ 0.3
dV/dt Allowable offset voltage slew rate - 50 V/ns
PD Package power dissipation @ TA f +25°C 8 lead SOIC - .625
8 lead PDIP - 1.0 W
RthJA Thermal resistance, junction to ambient 8 lead SOIC - 200 o
8 lead PDIP - 125 CAN
Tu Junction temperature - 150
Ts Storage temperature -55 150 ''C
TL Lead temperature (soldering, 10 seconds) - 300
Note 1: Capacitors are required between VB and Vin-, and between VB and Vs pins when bootstrap power
is used. The external power supply, when used, is required between Vs and Vin-, and between VB and Vs
Recommended Operating Conditions
The output logic timing diagram is shown in figure 1. For proper operation the device should be used within the recom-
mended conditions.
Symbol Definition Min. Max. Units
VB High side floating supply voltage Vs +13.0 Vs +20
Vs High side floating supply offset voltage note 2 600
Voc Overcurrentoutput voltage COM VCC V
VCC Low side and logic foted supply voltage 9.5 20
VIN Input voltage between V|N+ and VIN. -260 +260 mV
TA Ambient temperature -40 125 ''C
Note 2: Logic operation for Vs of -5 to +600V. Logic state held for Vs of -5V to NBS. (Please referto the Design
Tip DT97-3 for more details).
2
