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IR2166PBF
PFC & BALLAST CONTROL IC
International
1:212 Rectifier
Data Sheet No. P060198 revE
IR2166(S) & (PbF)
Features
q PFC, Ballast control and half-bridge driver in one IC
q Critical conduction mode boost type PFC
o No PFC current sense resistor required
q Programmable preheatfrequency
o Programmable preheattime
o Programmable run frequency
q Programmable over-current protection
q Programmable end-of-lite protection
Description
The IR2166 is a fully integrated, fully protected 600V ballast control IC designed to
drive all types of fluorescent lamps. PFC circuitry operates in critical conduction mode
and provides for high PF, low THD and DC Bus regulation. The IR2166 features in-
clude programmable preheat and run frequencies, programmable preheattime, pro-
grammable dead-time, programmable over-current protection, and programmable end-
of-life protection. Comprehensive protection features such as protection from failure of
a lamp to strike, filament failures, end-of-life protection, DC bus undervoltage reset as
well as an automatic restart function, have been included in the design. The IR2166 is
PFC & BALLAST CONTROL IC
q Programmable dead time
. Internal ignition ramp
. Internalfaultcounter
I DC bus under-voltage reset
. Shutdown pin with hysteresis
q Internal 15.6V zener clamp diode on Vcc
. Micropower startup (150pA)
o Latch immunity and ESD protection
q 16-Lead PDIP also available LEAD-FREE
available in both 16-lead PDIP and 16-lead (narrow body) SOIC packages.
IR2166 Application Diagram
Packages
t"W" L "
16-Lead SOIC
(narrow body)
also available
LEAD-FREE
- Rectifted AC Line
+ Rectified AC Line
Cans Fu-,
:Cvcm -
*Please note that this data sheet contains advanced information that could change before the product is released to production.
International
TOR Rectifier
IR2166 & (PbF)
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage
parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal
resistance and power dissipation ratings are measured under board mounted and still air conditions.
Symbol Definition Min. Max. Units
VB High side floating supply voltage -0.3 625
Vs High side floating supply offset voltage VB - 25 VB + 0.3
VH0 High side floating output voltage Vs - 0.3 VB + 0.3 V
l/LO Low side output voltage -O.3 Vcc + 0.3
l/PFC PFC gate driveroutput voltage -0.3 Vcc + 0.3
IOMAX Maximum allowable output current (HO, LO, PFC) -500 500 mA
due to external power transistor miller effect
VBUS VBUS pin voltage -0.3 Vcc + 0.3
VCT CT pin voltage -O.3 Vcc + 0.3 V
IcpH CPH pin current -5 5
IRpH RPH pin current -5 5 mA
VRpH RPH pin voltage -0.3 Vcc + 0.3 V
IRT RT pin current -5 5 mA
VRT RT pin voltage -0.3 Vcc + 0.3
Vcs Current sense pin voltage -O.3 5.5 V
Ics Current sense pin current -5
ISD/EOL Shutdown pin current -5
ICC Supply current (Note 1) -20 20 mA
sz PFC inductor current, zero crossing detection input current -5 5
ICOMp PFC error compensation current -5 5
dV/dt Allowable offset voltage slew rate -50 50 V/ns
PD Package power dissipation @ TA 5 +25°C (16-Pin PDIP) - 1.80
PD = (TJMAx-TA)/RthJA (16-Pin SOIC) - 1.40 W
RthJA Thermal resistance, junction to ambient (16-Pin PDIP) - 70 °C/W
(16-Pin SOIC) - 86
TJ Junction temperature -55 150
Ts Storage temperature -55 150 °C
TL Lead temperature (soldering, 10 seconds) - 300
Note I: This IC contains a zener clamp structure between the chip Vcc and COM which has a nominal breakdown
voltage of 15.6V. Please note that this supply pin should not be driven by a DC, low impedance power source
greater than the VCLAMp specified in the Electrical Characteristics section.
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