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IR2166-IR2166S
PFC Ballast Control in a 16-pin DIP package
Data Sheet No. P060198 revF
International
IsaR Rectifier IR2166(S)8(PbF)
PFC & BALLAST CONTROL IC
Features .
. . . o Programmable dead time
q PFC, Ballast control and half-bridge driver In one IC . Internal ignition ramp
q Critical conduction mode boost type PFC . Internal fault counter
o No PFC current sense resistor required . DC bus under-voltage reset
q Programmable preheat frequency . Shutdown pin with hysteresis
q Programmable preheat time . Internal 15.6V zener clamp diode on Vcc
q Programmable run frequency . Micropowerstartup (150PA)
o Programmable over-current protection . Latch immunity and ESD protection
q Programmable end-of-life protection . Parts also available LEAD-FREE
Description Packages
The IR2166 is a fully integrated, fully protected 600V ballast control IC designed to
drive all types of fluorescent lamps. PFC circuitry operates in critical conduction mode
and provides for high PF, low THD and DC Bus regulation. The IR2166 features in-
clude programmable preheat and run frequencies, programmable preheattime, pro-
grammable dead-time, programmable over-current protection, and programmable end-
of-life protection. Comprehensive protection features such as protection from failure of
a lamp to strike, filament failures, end-of-life protection, DC bus undervoltage reset as
well as an automatic restart function, have been included in the design. The IR2166 is
available in both 16-lead PDIP and 16-lead (narrow body) SOIC packages.
16-Lead PDIP
IR2166 Application Diagram
l Daus
+ Rectified AC Line . 'l
Raus ' .
" Qyisuppr,
_ cmm Luis
Cm Ft,
- Rectifed AC Line
*Please note that this data sheet contains advanced information that could change before the product is released to production.
1
International
TOR Rectifier
IR2166 & (PbF)
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage
parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal
resistance and power dissipation ratings are measured under board mounted and still air conditions.
Symbol Definition Min. Max. Units
VB High side floating supply voltage -O.3 625
1/s High side floating supply offset voltage VB - 25 VB + 0.3
VH0 High side floating output voltage Vs - 0.3 V3 + 0.3 V
VLO Low side output voltage -0.3 Vcc + 0.3
Vch PFC gate driver output voltage -0.3 Vcc + 0.3
IOMAX Maximum allowable output current (HO, LO, PFC) -500 500 mA
due to external power transistor miller effect
VBUS VBUS pin voltage -0.3 VCC + 0.3
VCT CT pin voltage -0.3 Vcc + 0.3 V
ICpH CPH pin current -5 5
lRpH RPH pin current -5 5 mA
VRpH RPH pin voltage -0.3 Vcc + 0.3 V
IRT RT pin current -5 5 mA
VRT RT pin voltage -0.3 VCC + 0.3
VCS Current sense pin voltage -O.3 5.5 V
Ics Current sense pin current -5
ISD/EOL Shutdown pin current -5
ICC Supply current (Note 1) -20 20 mA
sz PFC inductor current, zero crossing detection input current -5
ICOMp PFC error compensation current -5
dV/dt Allowable offset voltage slew rate -50 50 V/ns
PD Package power dissipation a TA 3 +25°C (16-Pin PDIP) - 1.80
PD = (TJMAx-TA)/RthJA (16-Pin SOIC) - 1.40 W
RthJA Thermal resistance, junction to ambient (16-Pin PDIP) - 7O °C/W
(16-Pin SOIC) - 86
TJ Junction temperature -55 150
Ts Storage temperature -55 150 °C
TL Lead temperature (soldering, 10 seconds) - 300
Note 1: This IC contains a zener clamp structure between the chip Vcc and COM which has a nominal breakdown
voltage of 15.6V. Please note that this supply pin should not be driven by a DC, low impedance power source
greater than the VCLAMP specified in the Electrical Characteristics section.
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