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IPD09N03LA
Low Voltage MOSFETs
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optiMosh Power-Transistor
Product Summary
Features VDS 25 V
. Ideal for high-frequency dc/dc converters RDSWmax (SMD version) 8.6 mn
. Qualified according to JEDECI) for target application
l 50 A
. N-channel, logic level
. Excellent gate charge x RDSM product (FOM) 31;
. Superior thermal resistance gate
. 175 ''C operating temperature
Source
Type IPD09N03LA IPF09N03LA |P809N03LA |PU09N03LA
1.9 P.I/ (tab) tttiii-lip.:;,", " 1 253g; l E /
Package P-T0252-3-1 1 P-T0252-3-23 P-TO251-3-1 1 P-T0251-3-21
Ordering Code Q67042-S4154 Q67042-S4199 Q67042-S Q67042-S4155
Marking 09NO3LA 09N03LA 09N03LA 09N03LA
Maximum ratings, at Tj=25 "C, unless otherwise specified
Parameter Symbol Conditions Value Unit
Continuous drain current ID TC=25 °C2) 50 A
Tc=100 ''C 45
Pulsed drain current ste TC=25 oC3) 350
Avalanche energy, single pulse E AS I 0:45 A, RGS=25 Q 75 mJ
I 0:50 A, VDS=20 V,
Reverse diode dv/dt dv/dt di/dt=200 Alps, 6 kV/ps
Trmax=175 ''C
Gate source voltage“ VGS :20 V
Power dissipation Ptot TC=25 ''C 63 w
Operating and storage temperature Ti, Tstg -55 ... 175 "C
IEC climatic category; DIN IEC 68-1 55/175/56
Rev. 1.5 page 1 2004-03-22
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Infin eon IPD09N03LA IPF09N03LA
e C h n o l o i e s
I 9 IPS09N03LA IPU09N03LA
Parameter Symbol Conditions Values Unit
min. typ. max.
Thermal characteristics
Thermal resistance, junction - case Rm - - 2.4 K/W
SMD version, device on PCB RNA minimal footprint - - 75
6 cm2 cooling area5) - - 50
Electrical characteristics, at Tj=25 "C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage V(BR)DSS VGS=0 V, ID=1 mA 25 - - V
Gate threshold voltage Vsath) VDS=VGS, ID=20 pA 1.2 1.6 2
V =25 V, V =0 V,
Zero gate voltage drain current loss Is, 0 GS - 0.1 1 HA
Tr=25 C
VDS=25 V, VGS=0 V,
Tr=125 "C - 10 100
Gate-source leakage current less Vss--20 V, VDS=0 V - 10 100 nA
Drain-source on-state resistance Rosmn) VGS=4.5 V, I 0:30 A - 12 15 m9
Vss=4.5 V, [0:30 A,
SMD version - 11.8 14.8
Vss=10 V, ID=30 A - 7.4 8.8
VGS=10 V, ID=30 A,
SMD version - 7.2 8.6
Gate resistance RG - 1 - 9
V >2ll R ,
Transconductance " I 33' I DI DS(on)max 23 46 - S
ID--30 A
1) J-STD20 and JESD22
2) Current is limited by bondwire; with an Rch=2.4 KNVthe chip is able to carry 67 A.
3) See figure 3
4) Trmax=150 ''C and duty cycle D
5) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 pm thick) copper area for drain
connection. PCB is vertical in still air.
Rev. 1.5
page 2
