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HUFA75623S3SFAIRCN/a500avai22A, 100V, 0.064 Ohm, N-Channel, UltraFET?Power MOSFETs


HUFA75623S3S ,22A, 100V, 0.064 Ohm, N-Channel, UltraFET?Power MOSFETsFeaturesSOURCEDRAIN• Ultra Low On-ResistanceDRAIN (FLANGE)GATE-r = 0.064Ω, V = 10VGS DS(ON)GATE  S ..
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HUFA75623S3S
22A, 100V, 0.064 Ohm, N-Channel, UltraFET?Power MOSFETs
HUFA75623P3, HUFA75623S3ST
22A, 100V, 0.064 Ohm, N-Channel,
UltraFET® Power MOSFETs
Packaging
Symbol
Features
Ultra Low On-Resistance DS(ON) = 0.064Ω, VGS = 10V Simulation Models Temperature Compensated PSPICE® and SABER™
Electrical Models Spice and SABER Thermal Impedance Models Peak Current vs Pulse Width Curve UIS Rating Curve
This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry. For a copy
of the requirements, see AEC Q101 at:
DRAIN
(FLANGE)
DRAIN
SOURCE
GATE
HUFA75623P3
JEDEC TO-220AB JEDEC TO-263AB
HUFA75623S3ST
GATE
SOURCE
DRAIN
(FLANGE)
Ordering Information

NOTE: When ordering, use the entire part number i.e., HUFA75623P3.
Absolute Maximum Ratings
TC = 25o C, Unless Otherwise Specified
HUFA75623P3, HUFA75623S3ST UNITS

Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS 100 V
Drain to Gate Voltage (RGS = 20kΩ) (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR 100 V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS ±20 V
Drain Current
Continuous (TC = 25o C, VGS = 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID
Continuous (TC = 100o C, VGS = 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM
Figure 4
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UIS Figures 6, 14, 15
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD
Derate Above 25o C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
0.57oC
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG -55 to 175 oC
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TL
Package Body for 10s, See Techbrief TB334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg
260CC
NOTE: TJ = 25o C to 150oC.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the

device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
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