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GL34AxxN/a85000avaiTECHNICAL SPECIFICATIONS OF SURFACE MOUNT SILICON RECTIFIER
GL34BSIEMENSN/a2500avaiTECHNICAL SPECIFICATIONS OF SURFACE MOUNT SILICON RECTIFIER
GL34BN/a2500avaiTECHNICAL SPECIFICATIONS OF SURFACE MOUNT SILICON RECTIFIER
GL34BVISHAYN/a2500avaiTECHNICAL SPECIFICATIONS OF SURFACE MOUNT SILICON RECTIFIER
GL34GGSN/a10300avaiTECHNICAL SPECIFICATIONS OF SURFACE MOUNT SILICON RECTIFIER
GL34JVISHAYN/a40000avaiTECHNICAL SPECIFICATIONS OF SURFACE MOUNT SILICON RECTIFIER


GL34A ,TECHNICAL SPECIFICATIONS OF SURFACE MOUNT SILICON RECTIFIERapplications2nd BAND High temperature metallurgically bonded construction Cavity-free glass passi ..
GL34B ,TECHNICAL SPECIFICATIONS OF SURFACE MOUNT SILICON RECTIFIER®GL34A thru GL34JVishay Semiconductorsformerly General SemiconductorSurface Mount Glass Passivated ..
GL34B ,TECHNICAL SPECIFICATIONS OF SURFACE MOUNT SILICON RECTIFIERThermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.Standard rec ..
GL34B ,TECHNICAL SPECIFICATIONS OF SURFACE MOUNT SILICON RECTIFIER27-Feb-02 1Patented*GL34A thru GL34JVishay Semiconductorsformerly General SemiconductorRatings and ..
GL34G ,TECHNICAL SPECIFICATIONS OF SURFACE MOUNT SILICON RECTIFIERElectrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.Maximum i ..
GL34J ,TECHNICAL SPECIFICATIONS OF SURFACE MOUNT SILICON RECTIFIERFeatures Plastic package has Underwriters Laboratory SOLDERABLE ENDSFlammability Classification 94 ..
H0001 , 10/100 PC CARD LAN MAGNETICS MODULES
H0002 , 10/100 PC CARD LAN MAGNETICS MODULES
H0002 , 10/100 PC CARD LAN MAGNETICS MODULES
H0013 , 10/100 PC CARD LAN MAGNETICS MODULES
H0013 , 10/100 PC CARD LAN MAGNETICS MODULES
H0013 , 10/100 PC CARD LAN MAGNETICS MODULES


GL34A-GL34B-GL34G-GL34J
TECHNICAL SPECIFICATIONS OF SURFACE MOUNT SILICON RECTIFIER
GL34A thru GL34J
Vishay Semiconductors
formerly General Semiconductor
Reverse Voltage
50 to 600V
Forward Current
0.5A
Maximum Ratings & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Features
Plastic package has Underwriters Laboratory
Flammability Classification 94V-0 For surface mount applications High temperature metallurgically bonded construction Cavity-free glass passivated junction Capable of meeting environmental standards of MIL-S-19500 Fast switching for high efficiency High temperature soldering guaranteed: 450°C/5 seconds
at terminals. Complete device submersible temperature of
260°C for 10 seconds in solder bath
Mechanical Data
Case:
JEDEC DO-213AA, molded plastic over glass body
Terminals:
Plated terminals, solderable per
MIL-STD-750, Method 2026
Polarity:
Two bands indicate cathode end – 1st band
denotes device type and 2nd band denotes repetitive peak
reverse voltage rating
Mounting Position:
Any
Weight:
0.0014 oz., 0.036 g
Patent No.3,996,602 and brazed-lead assembly to Patent No.3,930,306
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