FQI4N80TU ,800V N-Channel QFETFeaturesThese N-Channel enhancement mode power field effect 3.9A, 800V, R = 3.6Ω @V = 10 VDS(on) ..
FQI4N80TU ,800V N-Channel QFETSeptember 2000TMQFETFQB4N80 / FQI4N80800V N-Channel MOSFET
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FQI50N06TU ,60V N-Channel QFET
FQI5N60C ,600V N-Channel Advance QFET C-SeriesFeaturesThese N-Channel enhancement mode power field effect 4.5A, 600V, R = 2.5Ω @V = 10 VDS(on) ..
FQI5N60CTU ,600V N-Channel Advance QFET C-SeriesFQB5N60C / FQI5N60CTMQFETFQB5N60C / FQI5N60C600V N-Channel MOSFET
G751-2 , Digital Temperature Sensor and Thermal Watchdog with Two-Wire Interface
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G9015 , PNP EPITAXIAL PLANAR TRANSISTOR
FQI4N80TU
800V N-Channel QFET
September 2000 TM QFET FQB4N80 / FQI4N80 800V N-Channel MOSFET General Description Features These N-Channel enhancement mode power field effect 3.9A, 800V, R = 3.6Ω @V = 10 V DS(on) GS transistors are produced using Fairchild’s proprietary, Low gate charge ( typical 19 nC) planar stripe, DMOS technology. Low Crss ( typical 8.6 pF) This advanced technology has been especially tailored to Fast switching minimize on-state resistance, provide superior switching 100% avalanche tested performance, and withstand high energy pulse in the Improved dv/dt capability avalanche and commutation mode. These devices are well suited for high efficiency switch mode power supply. D D ! ! "" 33 55 "" G! ! "" G S 2 2 D -PAK I -PAK G D S ! ! FQB Series FQI Series S Absolute Maximum Ratings T = 25°C unless otherwise noted C Symbol Parameter FQB4N80 / FQI4N80 Units V Drain-Source Voltage 800 V DSS I - Continuous (T = 25°C) Drain Current 3.9 A D C - Continuous (T = 100°C) 2.47 A C I (Note 1) Drain Current - Pulsed 15.6 A DM V Gate-Source Voltage ± 30 V GSS E Single Pulsed Avalanche Energy (Note 2) 460 mJ AS I Avalanche Current (Note 1) 3.9 A AR E Repetitive Avalanche Energy (Note 1) 13 mJ AR dv/dt Peak Diode Recovery dv/dt (Note 3) 4.0 V/ns Power Dissipation (T = 25°C) * P 3.13 W A D Power Dissipation (T = 25°C) 130 W C - Derate above 25°C 1.04 W/°C T , T Operating and Storage Temperature Range -55 to +150 °C J STG Maximum lead temperature for soldering purposes, T 300 °C L 1/8" from case for 5 seconds Thermal Characteristics Symbol Parameter Typ Max Units R Thermal Resistance, Junction-to-Case -- 0.96 °C/W θJC R Thermal Resistance, Junction-to-Ambient * -- 40 °C/W θJA R Thermal Resistance, Junction-to-Ambient -- 62.5 °C/W θJA * When mounted on the minimum pad size recommended (PCB Mount) ©2000 Fairchild Semiconductor International Rev. A, September 2000 FQB4N80 / FQI4N80
