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FDD3860FSCN/a5300avai100V N-Channel PowerTrench?MOSFET


FDD3860 ,100V N-Channel PowerTrench?MOSFETApplications„ DC-AC Conversion„ Synchronous RectifierD DGGSD-PAKTO-252(TO-252)SMOSFET Maximum Ratin ..
FDD4141_F085 ,-40V P-Channel PowerTrench?MOSFETApplications„ Inverter„ Power SuppliesSDGGSD-PAKTO-252D(TO-252)MOSFET Maximum Ratings T = 25°C unl ..
FDD4243 ,-40V P-Channel PowerTrench?MOSFETGeneral Description„ Max r = 44mΩ at V = -10V, I = -6.7AThis P-Channel MOSFET has been produced usi ..
FDD4243 ,-40V P-Channel PowerTrench?MOSFETapplications.DS(on) „ RoHS CompliantApplication„ Inverter„ Power SuppliesS DGGSD-PAKTO-252(TO-252)D ..
FDD4243_F085 ,40V P-Channel PowerTrench?MOSFETFeatures„ Typ r = 36mΩ at V = -10V, I = -6.7A „ InverterDS(on) GS D„ Typ r = 48mΩ ..
FDD45AN06LA0 ,60V N-Channel PowerTrench MOSFETFDD45AN06LA0February 2004FDD45AN06LA0®N-Channel PowerTrench MOSFET60V, 22A, 45mΩ
FN1L4M ,MEDIUM SPEED SWITCHING RESISTOR BUILT-IN TYPE PNP TRANSISTOR MINI MOLDELECTRICAL CHARACTERISTICS(T8=25°C) CHARACTERISTIC SYMBOL . . . TEST CONDITIONS ( Collector C ..
FN1L4M-T1B ,Compound transistorFEATURES PAcKA.GE..PMFNsiONs . Resistors Built-in TYPE In millimeters C 28:02 B FO.1 R1 1T2 47 ..
FN1L4M-T2B ,Compound transistorELECTRICAL CHARACTERISTICS(T8=25°C) CHARACTERISTIC SYMBOL . . . TEST CONDITIONS ( Collector C ..
FN1L4Z ,MEDIUM SPEED SWITCHING RESISTOR BUILT-IN TYPE PNP TRANSISTOR MINI MOLDFEATURES ( PACKAGE DIMENSIONS ' I . I C in millimeters . tii'r O Resistor Built-in TYPE B 2.83c0 ..
FN1L4Z-T2B ,Compound transistorFEATURES ( PACKAGE DIMENSIONS ' I . I C in millimeters . tii'r O Resistor Built-in TYPE B 2.83c0 ..
FN4A4M ,RESISTOR BUILT-IN TYPE PNP TRANSISTORDATA SHEETSILICON TRANSISTORFN4xxxRESISTOR BUILT-IN TYPE PNP TRANSISTOR

FDD3860
100V N-Channel PowerTrench?MOSFET
® FDD3860 N-Channel PowerTrench MOSFET October 2008 FDD3860 tm ® N-Channel PowerTrench MOSFET 100V, 29A, 36mΩ Features General Description „ Max r = 36mΩ at V = 10V, I = 5.9A This N-Channel MOSFET is rugged gate version of Fairchild DS(on) GS D ® Semiconductor‘s advanced Power Trench process. This part is „ High performance trench technology for extremely low r DS(on) tailored for low r and low Qg figure of merit, with avalanche DS(on) „ 100% UIL tested ruggedness for a wide range of switching applications. „ RoHS Compliant Applications „ DC-AC Conversion „ Synchronous Rectifier D D G G S D-PAK TO-252 (TO-252) S MOSFET Maximum Ratings T = 25°C unless otherwise noted C Symbol Parameter Ratings Units V Drain to Source Voltage 100 V DS V Gate to Source Voltage ±20 V GS Drain Current -Continuous (Silicon limited) T = 25°C 29 C I -Continuous T = 25°C (Note 1a) 6.2 A D A -Pulsed 60 E Single Pulse Avalanche Energy (Note 3) 121 mJ AS Power Dissipation T = 25°C 69 C P W D Power Dissipation T = 25°C (Note 1a) 3.1 A T , T Operating and Storage Junction Temperature Range -55 to +150 °C J STG Thermal Characteristics R Thermal Resistance, Junction to Case 1.8 θJC °C/W R Thermal Resistance, Junction to Ambient (Note 1a) 40 θJA Package Marking and Ordering Information Device Marking Device Package Reel Size Tape Width Quantity FDD3860 FDD3860 D-PAK (TO-252) 13’’ 12mm 2500 units 1 ©2008 FDD3860 Rev.C1
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