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FDD2612FAIRCHILN/a25200avai200V N-Channel PowerTrench MOSFET


FDD2612 ,200V N-Channel PowerTrench MOSFETApplications• Fast switching speed• DC/DC converter• Low gate charge (8nC typical)DDGGSTO-252SoAbso ..
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FN1L3M-T1B ,Compound transistorNEC DATA SH E ET ELECTRON DEVICE " , SILICON TRANSISTOR FN1L3M MEDIUM SPEED SWIT ..
FN1L3N ,MEDIUM SPEED SWITCHING RESISTOR BUILT-IN TYPE PNP TRANSISTOR MINI MOLDDATA SH E ET NEC SILICON TRANSISTOR or"''"""" d __ qt-ri-- . . F FN1lllL3lllNl MEDIUM SPEED ..
FN1L3N-T1B ,Compound transistorDATA SH E ET NEC SILICON TRANSISTOR or"''"""" d __ qt-ri-- . . F FN1lllL3lllNl MEDIUM SPEED ..
FN1L3N-T2B ,Compound transistorDATA SH E ET NEC SILICON TRANSISTOR or"''"""" d __ qt-ri-- . . F FN1lllL3lllNl MEDIUM SPEED ..
FN1L3Z ,MEDIUM SPEED SWITCHING RESISTOR BUILT-IN TYPE PNP TRANSISTOR MINI MOLDFEATURES in millimeters ( O Resistor Built-in TYPE T C B 2.8+,0.2 R1 = 4.7 k9 . _ R1 _ -0.15 C ..
FN1L3Z-T1B ,Compound transistorDATA SHEET SILICON TRANSISTOR MEDIUM SPEED SWITCHING RESISTOR BUILT-IN TYPE PNP TRANSISTOR ..


FDD2612
200V N-Channel PowerTrench MOSFET
FDD2612 August 2001 FDD2612     200V N-Channel PowerTrench MOSFET General Description Features This N-Channel MOSFET has been designed • 4.9 A, 200 V. R = 720 mΩ @ V = 10 V DS(ON) GS specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional • High performance trench technology for extremely switching PWM controllers. It has been optimized for low R DS(ON) low gate charge, low R and fast switching speed. DS(ON) • High power and current handling capability Applications • Fast switching speed • DC/DC converter • Low gate charge (8nC typical) D D G G S TO-252 S o Absolute Maximum Ratings T =25 C unless otherwise noted A Symbol Parameter Ratings Units V Drain-Source Voltage 200 V DSS V Gate-Source Voltage ± 20 V GSS ID Drain Current – Continuous (Note 1a) 4.9 A – Pulsed 10 P Power Dissipation (Note 1) 42 W D (Note 1a) 3.8 (Note 1b) 1.6 T , T Operating and Storage Junction Temperature Range J STG −55 to +175 °C Thermal Characteristics R Thermal Resistance, Junction-to-Case (Note 1) 3.5 °C/W θJC R Thermal Resistance, Junction-to-Ambient (Note 1a) 40 °C/W θJA Thermal Resistance, Junction-to-Ambient (Note 1b) 96 R °C/W θJA Package Marking and Ordering Information Device Marking Device Reel Size Tape width Quantity FDD2612 FDD2612 13’’ 16mm 2500 units 2001 FDD2612 Rev B1 (W)
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