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ESDALC6V1-5T6
Low capacitance Transil" arrays for ESD protection
March 2011 Doc ID 16741 Rev 2 1/11
ESDALC6V1-5T6Low capacitance T ransil™ arrays for ESD protection
Features 5 unidirectional Transil diodes Breakdown voltage VBR = 6.1 V min. Low diode capacitance: 7 pF typ. Low leakage current < 100 nA Very small PCB area: 1.0 mm² 350 µm pitch micro-package Lead-free and RoHS package
Complies with the following standards IEC 61000-4-2: 15 kV (air discharge) 8 kV (contact discharge) MIL STD 883G- Method 3015-7: class3B: >8 kV (human body model)
ApplicationsWhere transient overvoltage protection in ESD
sensitive equipment is required, such as: Cellular phone handsets and accessories Computers Printers Communication systems Video equipment Set top boxes
DescriptionThe ESDALC6V1-5T6 is monolithic arrays
designed to protect up to 5 lines against ESD
transients.
The device is ideal for applications where both
reduced print circuit board space and high ESD
protection level are required.
Figure 1. Functional diagram (top view)
TM: Transil is a trademark of STMicroelectronics
Characteristics ESDALC6V1-5T62/11 Doc ID 16741 Rev 2
1 Characteristics
Figure 2. Electrical characteristics (definitions)
Table 2. Electrical characteristics (values, Tamb = 25 °C)
Table 1. Absolute maximum ratings (Tamb = 25 °C) For a surge greater than the maximum values, the diode will fail in short-circuit.
ESDALC6V1-5T6 CharacteristicsDoc ID 16741 Rev 2 3/11
Figure 3. Relative variation of peak pulse
power versus initial junction
temperature
Figure 4. Peak pulse power versus
exponential pulse duration
Figure 5. Clamping voltage versus peak
pulse current (typical values,
exponential waveform)
Figure 6. Forward voltage drop versus peak
forward current (typical values)
Figure 7. Junction capacitance versus
reverse voltage applied
(typical values)
Figure 8. Relative variation of leakage
current versus junction
temperature (typical values)
Ordering information scheme ESDALC6V1-5T64/11 Doc ID 16741 Rev 2
Ordering information scheme
Figure 13. Ordering information scheme
Figure 9. S21 attenuation measurement
results of each channel
Figure 10. Analog crosstalk measurements
between channels
Figure 11. ESD response to IEC 61000-4-2
(+15 kV air discharge) on each
channel
Figure 12. ESD response to IEC 61000-4-2
(-15 kV air discharge) on each
channel
ESDALC6V1-5T6 Package informationDoc ID 16741 Rev 2 5/11
3 Package information Epoxy meets UL94, V0 Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOP ACK®
specifications, grade definitions and product status are available at: .
ECOPACK® is an ST trademark.
Note: Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no
case should this product marking be used to orient the component for its placement on a
PCB. Only pin 1 mark is to be used for this purpose.
Table 3. Micro DFN 1.0 x 1.0-6L dimensions
Figure 14. Footprint dimensions (in mm) Figure 15. Marking
Package information ESDALC6V1-5T66/11 Doc ID 16741 Rev 2
Figure 16. Tape and reel specifications
