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ESDALC6V1-5P6 |ESDALC6V15P6STN/a9000avaiESD Protection for high speed interface


ESDALC6V1-5P6 ,ESD Protection for high speed interfaceapplications where both reduced printed circuit board space and power absorption capability are req ..
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ESDALC6V1-5P6
ESD Protection for high speed interface
November 2007 Rev 3 1/8
ESDALC6V1-5P6

ESD protection for high speed interface
Features
Diode array topology Low capacitance (12 pF typical) Lead-free package
Benefits
Low capacitance uni-directional ESD
protection. Low PCB space consuming, 2.5 mm2 max.
footprint Low leakage current High reliability offered by monolithic integration
Complies with the following standards
IEC 61000-4-2 level 4: 8 kV (contact discharge) 15 kV (air discharge) MIL STD 883G-Method 3015-7: class3B Human body model
Applications

Where transient overvoltage protection in ESD
sensitive equipment is required, such as: Computers Printers Communication systems Cellular phone handsets and accessories Video equipment
Description

The ESDALC6V1-5P6 is a monolithic array
designed to protect up to 5 lines against ESD
transients.
The device is ideal for high speed interface
applications where both reduced printed circuit
board space and power absorption capability are
required.

Figure 1. ESDALC6V1-5P6 functional
diagram
Characteristics ESDALC6V1-5P6
2/8
1 Characteristics



Table 1. Absolute ratings (Tamb = 25 °C)
For a surge greater than the maximum values, the diode will fail in short-circuit.
Table 2. Electrical characteristics (T amb = 25 °C)
ΔVBR = αT x (Tamb - 25 °C) x VBR (25 °C)
ESDALC6V1-5P6 Characteristics
3/8


Figure 2. Relative variation of peak pulse
power versus initial junction
temperature
Figure 3. Peak pulse power versus
exponential pulse duration
(Tj initial = 25 °C)
Figure 4. Clamping voltage versus peak
pulse current (typical values)
Figure 5. Relative variation of leakage
current versus junction
temperature (typical values)
Figure 6. Breakdown voltage versus initial
junction temperature
Figure 7. Junction capacitance versus
reverse voltage applied
(typical values)
Characteristics ESDALC6V1-5P6
4/8


Figure 8. ESD response to IEC 61000-4-2
(air discharge +15 kV surge)
Figure 9. ESD response to IEC 61000-4-2
(air discharge -15 kV surge)
Figure 10. Frequency response curves
- all lines together
Figure 11. Crosstalk response curves
- 1/2 and 1/3
ESDALC6V1-5P6 Application information
5/8
2 Application information
Figure 12. Application schematic diagram Ordering information scheme
Figure 13. Ordering information scheme
Package information ESDALC6V1-5P6
6/8
4 Package information
Epoxy meets UL 94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOP ACK specifications are available at: .

Figure 14. SOT666 footprint (dimensions in mm)
Table 3. SOT666 dimensions
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