EMIF06-VID01C2 ,6 LINES LOW CAPACITANCE EMI FILTER AND ESD PROTECTIONPin Configuration (ball side)15 kV. 98 7 6 5 4 32 1BENEFITS■ High efficiency EMI filtering (-40db @ ..
EMIF06-VID01F2 ,6-line EMI filter and ESD protection for display interfacesFeatures■ High efficiency EMI filtering (-40 dB @ 900 MHz)■ Low line capacitance suitable for high ..
EMIF08-1005M16 ,8-line low capacitance EMI filter and ESD protectionFeatures1■ EMI symmetrical (I/O) low-pass filter■ High efficiency in EMI filtering:– Greater than - ..
EMIF08-1502M16 ,8-line low capacitance EMI filter and ESD protectionFeatures1■ EMI (I/O) low-pass filter■ High efficiency in EMI filtering:– Greater than 30 dB attenua ..
EMIF08-2005QEJ ,EMI FILTER INCLUDING ESD PROTECTIONPIN CONFIGURATIONn EMI symmetrical low-pass filter2n Low PCB space consuming: 9 mmLow-pass FilterIn ..
EMIF08-VID01F2 ,8-line EMI filter and ESD protection for display interfacesPin configuration (Bumps side)This filter includes ESD protection circuitry, whichprevents damage t ..
ES1H ,1.0A Ultra Fast Recovery Rectifierapplications. • Glass passivated junction. • Low profile package.• Easy pick and place.• Built-in s ..
ES1J ,1.0A Ultra Fast Recovery RectifierFeatures• For surface mount
ES3J ,3.0 UltraFast Recovery RectifierES3A - ES3J — Fast RectifiersApril 2012ES3A - ES3JFast Rectifiers
ESAB82-004 ,SCHOTTKY BARRIER DIODEFeatures
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Super high speed switching.
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ESAB82-004 ,SCHOTTKY BARRIER DIODEApplications
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ESAB82M-006 ,SCHOTTKY BARRIER DIODEApplications
035$1E7Jx4~y+77
High speed power swnching.
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EMIF06-VID01C2
6 LINES LOW CAPACITANCE EMI FILTER AND ESD PROTECTION
1/6
EMIF06-VID01C16 LINES LOW CAPACITANCE EMI FILTER
AND ESD PROTECTION
REV. 1February 2005
IPAD™
Figure 1: Pin Configuration (ball side)
TM: IPAD is a trademark of STMicroelectronics.
Table 1: Order Code
MAIN APPLICATIONWhere EMI filtering in ESD sensitive equipment is
required: LCD and camera for mobile phones Computers and printers Communication systems MCU board
DESCRIPTIONThe EMIF06-VID01C1 is a 6 lines highly integrat-
ed array designed to suppress EMI / RFI noise in
all systems subjected to electromagnetic interfer-
ences.
The EMIF06-VID01C1 Flip-Chip packaging
means the package size is equal to the die size.
Additionally, this filter includes an ESD protection
circuitry which prevents the protected device from
destruction when subjected to ESD surges up to
15 kV.
BENEFITS High efficiency EMI filtering (-40db @ 900MHz) Low line capacitance suitable for high speed
data bus Low serial resistance for camera impedance
adaptation Optimized PCB space consuming:
2.92mm x 1.29mm Very thin package: 0.69 mm High efficiency in ESD suppression on inputs
pins (IEC61000-4-2 level 4) High reliability offered by monolithic integration High reducing of parasitic elements through integration & wafer level packaging
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC61000-4-2Level 4 on input pins 15kV (air discharge) 8kV (contact discharge)
MIL STD 883E - Method 3015-6 Class 3
Figure 2: Configuration
EMIF06-VID01C1
Table 2: Absolute Ratings (limiting values)
Table 3: Electrical Characteristics (T amb = 25°C)
EMIF06-VID01C13/6
Figure 3: S21 (dB) attenuation measurement Figure 4: Analog crosstalk measurement
Figure 5: ESD response to IEC61000-4-2
(+15kV air discharge) on one input V(in) and on
one output (Vout)
Figure 6: ESD response to IEC61000-4-2 (-15kV
air discharge) on one input V(in) and on one
output (Vout)
Figure 7: Junction capacitance versus reverse
voltage applied (typical values)
EMIF06-VID01C1
Figure 8: Ordering Information Scheme
Figure 9: FLIP-CHIP Package Mechanical Data
Figure 10: Foot Print Recommendations Figure 11: Marking
EMIF06-VID01C15/6
Figure 12: FLIP-CHIP Tape and Reel Specification
Table 4: Ordering Information
Note: More packing informations are available in the application noteAN1235: “Flip-Chip: Package description and recommendations for use”
AN1751: “EMI Filters: Recommendations and measurements”
Table 5: Revision History
EMIF06-VID01C1. consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
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