EMIF06-HMC01F2 ,6 LINES EMI FILTER INCLUDING ESD PROTECTIONPin Configuration (ball side)■ Lead Free package■ Very thin package: 0.65 mm■ High efficiency in ES ..
EMIF06-VID01C2 ,6 LINES LOW CAPACITANCE EMI FILTER AND ESD PROTECTIONPin Configuration (ball side)15 kV. 98 7 6 5 4 32 1BENEFITS■ High efficiency EMI filtering (-40db @ ..
EMIF06-VID01F2 ,6-line EMI filter and ESD protection for display interfacesFeatures■ High efficiency EMI filtering (-40 dB @ 900 MHz)■ Low line capacitance suitable for high ..
EMIF08-1005M16 ,8-line low capacitance EMI filter and ESD protectionFeatures1■ EMI symmetrical (I/O) low-pass filter■ High efficiency in EMI filtering:– Greater than - ..
EMIF08-1502M16 ,8-line low capacitance EMI filter and ESD protectionFeatures1■ EMI (I/O) low-pass filter■ High efficiency in EMI filtering:– Greater than 30 dB attenua ..
EMIF08-2005QEJ ,EMI FILTER INCLUDING ESD PROTECTIONPIN CONFIGURATIONn EMI symmetrical low-pass filter2n Low PCB space consuming: 9 mmLow-pass FilterIn ..
ES1H ,1.0A Ultra Fast Recovery Rectifierapplications. • Glass passivated junction. • Low profile package.• Easy pick and place.• Built-in s ..
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ESAB82-004 ,SCHOTTKY BARRIER DIODEFeatures
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ESAB82-004 ,SCHOTTKY BARRIER DIODEApplications
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ESAB82M-006 ,SCHOTTKY BARRIER DIODEApplications
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EMIF06-HMC01F2
6 LINES EMI FILTER INCLUDING ESD PROTECTION
1/7
EMIF06-HMC01F26 LINES EMI FILTER
INCLUDING ESD PROTECTION
REV. 1January 2005
IPAD™
Figure 1: Pin Configuration (ball side)
TM: IPAD is a trademark of STMicroelectronics.
Table 1: Order Code
MAIN APPLICATION High Speed MultiMediaCard™
DESCRIPTIONThe EMIF06-HMC01F2 is a highly integrated array
designed to suppress EMI / RFI noise for High
Speed MultiMediaCard™ port filtering.
The EMIF06-HMC01F2 Flip-Chip packaging
means the package size is equal to the die size.
Additionally, this filter includes an ESD protection
circuitry which prevents the protected device from
destruction when subjected to ESD surges up to
15 kV.
BENEFITS 6 lines low-pass-filter High efficiency in EMI filtering Very low PCB space consuming: < 4.4 mm2 Lead Free package Very thin package: 0.65 mm High efficiency in ESD suppression High reliability offered by monolithic integration High reducing of parasitic elements through
integration & wafer level packaging
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC61000-4-2Level 4 on external pins15kV (air discharge) 8kV (contact discharge)
MIL STD 883E - Method 3015-6 Class 3
Figure 2: Configuration
Table 2: Ball configuration
EMIF06-HMC01F2
Table 3: Absolute Maximum Ratings (Tamb = 25°C))
Table 4: Electrical Characteristics (T amb = 25°C)
EMIF06-HMC01F23/7
Figure 3: S21 (dB) attenuation measurement Figure 4: Analog crosstalk measurement
Figure 5: ESD response to IEC61000-4-2
(+15kV air discharge) on one input V(in) and on
one output (Vout)
Figure 6: ESD response to IEC61000-4-2 (-15kV
air discharge) on one input V(in) and on one
output (Vout)
Figure 7: Junction capacitance versus reverse
voltage applied (typical values)
EMIF06-HMC01F2
Figure 8: Aplac model device structure
Figure 9: Aplac model parameters
EMIF06-HMC01F25/7
Figure 10: Ordering Information Scheme
Figure 12: Foot Print Recommendations Figure 13: Marking
EMIF06-HMC01F2
Figure 14: FLIP-CHIP Tape and Reel Specification
Table 5: Ordering Information
Note: More packing informations are available in the application noteAN1235: “Flip-Chip: Package description and recommendations for use”
Table 6: Revision History
