EMIF04-1502M8 ,4-line low capacitance EMI filter and ESD protectionPin configuration (top view)■ High reducing of parasitic elements through integration and wafer lev ..
EMIF04-1502QCF ,4 LINES LOW CAPACITANCE EMI FILTER AND ESD PROTECTIONPin Configuration (back side)BENEFITSLow-pass Filter■ EMI symmetrical (I/O) low-pass filterInput O ..
EMIF04-1502QCF ,4 LINES LOW CAPACITANCE EMI FILTER AND ESD PROTECTIONEMIF04-1502QCF®4 LINES LOW CAPACITANCE EMI FILTERAND ESD PROTECTIONIPAD™MAIN PRODUCT CHARACTERISTIC ..
EMIF04-2005QCF ,EMI FILTER INCLUDING ESD PROTECTIONPIN CONFIGURATIONn EMI symmetrical low-pass filter2n Low PCB space consuming: 4 mm Low-pass FilterI ..
EMIF06-10006C2 ,6-line EMI filter and ESD protectionPin Configuration (bump side)■ EMI symmetrical (I/O) low-pass filter■ High efficiency in EMI filte ..
EMIF06-10006F1 ,6 LINES EMI FILTER AND ESD PROTECTIONPIN CONFIGURATION (ball side)n Very low PCB space consuming:2.92mm x 1.29mmn Very thin package: 0.6 ..
ES1F ,1.0A Ultra Fast Recovery Rectifierapplications. • Glass passivated junction. • Low profile package.• Easy pick and place.• Built-in s ..
ES1H ,1.0A Ultra Fast Recovery Rectifierapplications. • Glass passivated junction. • Low profile package.• Easy pick and place.• Built-in s ..
ES1J ,1.0A Ultra Fast Recovery RectifierFeatures• For surface mount
ES3J ,3.0 UltraFast Recovery RectifierES3A - ES3J — Fast RectifiersApril 2012ES3A - ES3JFast Rectifiers
EMIF04-1502M8
4-line low capacitance EMI filter and ESD protection
January 2009 Rev 6 1/10
EMIF04-1502M84-line IP AD™
low capacitance EMI filter and ESD protection in micro QFN package
Features EMI asymmetrical (I/O) low-pass filter High efficiency in EMI filtering Very low PCB space consumption:
1.7 mm x 1.5 mm Very thin package: 0.6 mm max High efficiency in ESD suppression on input
pins (IEC 61000-4-2 level 4) High reliability offered by monolithic integration High reducing of parasitic elements through
integration and wafer level packaging Lead-free package
Complies with following standards: IEC 61000-4-2 level 4 input pins 15 kV (air discharge) 8 kV (contact discharge) MIL STD 883G - Method 3015-7 Class 3A
(all pins)
ApplicationsWhere EMI filtering in ESD sensitive equipment is
required: LCD and camera for mobile phones Computers and printers Communication systems MCU boards
DescriptionThe EMIF04-1502M8 is a 4-line, highly integrated
device designed to suppress EMI/RFI noise in all
systems exposed to electromagnetic interference.
This filter includes an ESD protection circuitry,
which prevents damage to the application when
subjected to ESD surges up to 15 kV on the input
pins.
Figure 1. Pin configuration (top view)
Figure 2. Basic cell configurationTM: IPAD is a trademark of STMicroelectronics
Characteristics EMIF04-1502M82/10
1 Characteristics
Table 1. Absolute ratings (limiting values at Tamb = 25° C unless otherwise specified)
Table 2. Electrical characteristics (Tamb = 25° C)
Figure 3. S21 attenuation measurement Figure 4. Analog cross talk measurements
EMIF04-1502M8 Ordering information scheme 3/10
Figure 7. Line capacitance versus reverse voltage applied (typical value) Ordering information scheme
Figure 8. Ordering information scheme
Figure 5. ESD response to IEC 61000-4-2
(+15 kV air discharge) on one input
(Vin) and on one output (Vout)
Figure 6. ESD response to IEC 61000-4-2 15 kV air discharge) on one input
(Vin) and on one output (Vout)
Package information EMIF04-1502M84/10
3 Package information Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOP ACK®
specifications, grade definitions and product status are available at: .
ECOPACK® is an ST trademark.
Table 3. QFN 1.7 x 1.5 package dimensions
EMIF04-1502M8 Package information 5/10
Figure 11. Tape and reel specificationNote: Product marking may be rotated by 90° for assembly plant differentiation. In no case should
this product marking be used to orient the component for its placement on a PCB. Only pin1
mark is to be used for this purpose.
Recommendation on PCB assembly EMIF04-1502M86/10
Recommendation on PCB assembly
4.1 Stencil opening design General recommendation on stencil opening design
a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).
Figure 12. Stencil opening dimensionsb) General design rule
Stencil thickness (T) = 75 ~ 125 µm
2. Reference design
a) Stencil opening thickness: 100 µm
b) Stencil opening for central exposed pad: Opening to footprint ratio is 50%.
c) Stencil opening for leads: Opening to footprint ratio is 90%.
Figure 13. Recommended stencil window positionAspect Ratio W----- 1.5≥=
Aspect Area LW×L W+ ()---------------------------- 0.66≥=
