MUN5213-T1 ,Bias Resistor Transistor NPNELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted) (Continued)ACharacteristic Symbol Min ..
MUN5213T1G ,NPN SILICON BIAS RESISTOR TRANSISTORSTHERMAL CHARACTERISTICS8x = Specific Device CodeCharacteristic Symbol Max Unitx = (See Marking Tabl ..
MUN5214 ,Bias Resistor Transistor NPNMaximum ratings applied to the device are individual stress limit values (noton page 2 of this data ..
MUN5214DW1 ,Dual Bias Resistor TransistorELECTRICAL CHARACTERISTICS(T = 25°C unless otherwise noted, common for Q and Q ) (Continued)A 1 2Ch ..
MUN5214DW1T1 ,Dual Bias Resistor TransistorMUN5211DW1T1 SeriesPreferred DevicesDual Bias ResistorTransistorsNPN Silicon Surface Mount Transist ..
MUN5214DW1T1G , Dual Bias Resistor Transistors
NC7S00P5X ,TinyLogic HS 2-Input NAND GateNC7S00 TinyLogic HS 2-Input NAND GateOctober 1995Revised May 2003NC7S00TinyLogic HS 2-Input NAND ..
NC7S02L6X ,TinyLogic HS 2-Input NOR GateNC7S02 TinyLogic HS 2-Input NOR GateOctober 1995Revised August 2004NC7S02TinyLogic HS 2-Input NOR ..
NC7S02M5 ,TinyLogic HS 2-Input NOR GateElectrical Characteristics V T = +25°CT = −40°C to +85°CCC A ASymbol Parameter Units Conditions(V) ..
NC7S02M5 ,TinyLogic HS 2-Input NOR GateFeaturesThe NC7S02 is a single 2-Input high performance CMOS
DTC123J-MUN5211-MUN5211T1-MUN5212-MUN5212T1-MUN5213-MUN5213T1-MUN5213-T1-MUN5214-MUN5214T1-MUN5215-MUN5215T1-MUN5231-MUN5232-MUN5232T1-MUN5233-MUN5233T1-MUN5234-MUN5234DW1T1-MUN5236T1-MUN5237T1
Bias Resistor Transistor NPN
MUN5211T1 Series
Bias Resistor T ransistor
NPN Silicon Surface Mount Transistorwith Monolithic Bias Resistor NetworkThis new series of digital transistors is designed to replace a single
device and its external resistor bias network. The BRT (Bias Resistor
Transistor) contains a single transistor with a monolithic bias network
consisting of two resistors; a series base resistor and a base−emitter
resistor. The BRT eliminates these individual components by
integrating them into a single device. The use of a BRT can reduce
both system cost and board space. The device is housed in the
SC−70/SOT−323 package which is designed for low power
surface mount applications. Simplifies Circuit Design Reduces Board Space Reduces Component Count The SC−70/SOT−323 package can be soldered using wave or reflow.
The modified gull−winged leads absorb thermal stress during
soldering eliminating the possibility of damage to the die. Available in 8 mm embossed tape and reel. Use the Device Number
to order the 7 inch/3000 unit reel. Pb−Free Packages are Available
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
THERMAL CHARACTERISTICSMaximum ratings are those values beyond which device damage can occur.Maximum ratings applied to the device are individual stress limit values (notnormal operating conditions) and are not valid simultaneously. If these limits areexceeded, device functional operation is not implied, damage may occur andreliability may be affected.1. FR−4 @ Minimum Pad.2. FR−4 @ 1.0 x 1.0 inch Pad.
