LVDS Dual High Speed Differential Driver# DS90LV027ATM Technical Documentation
## 1. Application Scenarios
### Typical Use Cases
The DS90LV027ATM is a dual LVDS (Low-Voltage Differential Signaling) driver designed for high-speed data transmission applications. Typical use cases include:
- High-Speed Serial Data Transmission : Converts 3.3V LVCMOS/LVTTL signals to LVDS signals for transmission over controlled impedance media
- Point-to-Point Communication Links : Ideal for connecting processors to displays, sensors, or other processing units
- Backplane Interconnects : Provides robust data transmission across backplanes in telecommunications and networking equipment
- Clock Distribution Systems : Capable of distributing high-frequency clock signals with minimal jitter
### Industry Applications
- Automotive Infotainment Systems : Dashboard displays, rear-seat entertainment, and navigation systems
- Industrial Automation : Machine vision systems, robotics control interfaces, and process control instrumentation
- Medical Imaging : Ultrasound equipment, digital X-ray systems, and patient monitoring devices
- Telecommunications : Base station equipment, network switches, and routing hardware
- Consumer Electronics : High-resolution displays, gaming consoles, and digital signage
### Practical Advantages and Limitations
Advantages:
- Noise Immunity : Differential signaling provides excellent common-mode noise rejection
- Low Power Consumption : Typically 40mA maximum supply current at 3.3V operation
- High-Speed Operation : Supports data rates up to 400 Mbps per channel
- EMI Reduction : Low output voltage swing (typically 350mV) minimizes electromagnetic interference
- Wide Common-Mode Range : ±1V receiver input voltage range
Limitations:
- Point-to-Point Only : Not suitable for multi-drop configurations without additional components
- Distance Constraints : Optimal performance typically limited to 10-15 meters depending on cable quality
- Termination Required : Requires precise 100Ω differential termination at receiver end
- Power Sequencing : Sensitive to improper power-up sequences in mixed-voltage systems
## 2. Design Considerations
### Common Design Pitfalls and Solutions
Pitfall 1: Improper Termination
- Issue : Missing or incorrect termination resistors causing signal reflections
- Solution : Place 100Ω differential termination resistor as close as possible to the receiver inputs
Pitfall 2: Ground Bounce
- Issue : Inadequate decoupling leading to power supply noise
- Solution : Use 0.1μF ceramic capacitors placed within 5mm of each power pin
Pitfall 3: Signal Integrity Degradation
- Issue : Long stub lengths or impedance discontinuities
- Solution : Maintain controlled impedance (typically 100Ω differential) throughout the transmission path
Pitfall 4: ESD Damage
- Issue : Susceptibility to electrostatic discharge during handling
- Solution : Implement proper ESD protection circuits and follow handling procedures
### Compatibility Issues with Other Components
Voltage Level Compatibility:
- Input Compatibility : Compatible with 3.3V LVCMOS/LVTTL logic families
- Output Compatibility : Requires LVDS-compliant receivers (such as DS90LV028ATM)
- Mixed Voltage Systems : Use level translators when interfacing with 5V or lower voltage systems
Timing Considerations:
- Propagation Delay : 1.7ns typical, must be accounted for in timing-critical applications
- Channel-to-Channel Skew : 200ps maximum, important for parallel data transmission
### PCB Layout Recommendations
Differential Pair Routing:
- Maintain consistent 100Ω differential impedance
- Keep trace lengths matched within 5mm for differential pairs
- Route differential pairs as close as possible with minimal spacing variations
Power Distribution:
- Use separate power and ground
