DS1336S ,Afterburner Chipapplications such as SRAM networks.When used with one of the Dallas power monitoring devices listed ..
DS1336S ,Afterburner ChipFEATURES PIN ASSIGNMENT§ Provides power switching of up to 1.5 amps at1 V /IN1OUT5 16 CCvoltages be ..
DS1336S ,Afterburner ChipPIN DESCRIPTIONV /IN1 - +5V Input and Input 1CCIN2 - IN5 - Inputs 2 - 5OUT1 - 5 - Outputs 1 - 5V - ..
DS1337 ,Serial real-time clock DS1337 Serial Real-Time Clock
DS1337 ,Serial real-time clockELECTRICAL CHARACTERISTICS (V = 1.3V to 1.8V, T = -40°C to +85°C.) CC APARAMETER SYMBOL CONDITIONS ..
DS1337 ,Serial real-time clockFEATURES The DS1337 serial real-time clock is a low-power Real-Time Clock (RTC) Counts Seconds, ..
DTC124EKAT146 , NPN 100mA 50V Digital Transistors (Bias Resistor Built-in Transistors
DTC124EKA-T146 , NPN 100mA 50V Digital Transistors (Bias Resistor Built-in Transistors
DTC124EM , NPN 100mA 50V Digital Transistors (Bias Resistor Built-in Transistors)
DTC124ES , DTA/DTC SERIES
DTC124-ES , DTA/DTC SERIES
DTC124ESA , Digital transistors (built-in resistors)
DS1336S
Afterburner Chip
FEATURESProvides power switching of up to 1.5 amps at
voltages between 3.0 and 5.0 voltsFive separate power switchesSelectable battery switches for use withbattery-backed systemsVery low on impedance of 0.7OBattery backup current of 4 mADiode-isolated battery pathAvailable in 16-pin DIP or 16-pin SOIC
surfacemount packageLow voltage drop battery pathConnects directly to a variety of Dallas
Semiconductor devices, adding increased
switching capability for large battery backup
current applications
PIN ASSIGNMENT
PIN DESCRIPTIONVCC/IN1 - +5V Input and Input 1
IN2 - IN5 - Inputs 2 - 5
OUT1 - 5 - Outputs 1 - 5
VBATIN- External Battery Input
VBAT01- Diode Protected Battery Output
VBAT02- Low Voltage Drop Battery
Output
PF, PF- Power-fail Inputs
GND - Ground
DESCRIPTIONThe DS1336 Afterburner Chip is designed to provide power switching between a primary power supply
(VCC) and a backup battery power supply (VBAT). Five VCC and two battery paths are provided which can
be used individually or in parallel to supply uninterrupted power in applications such as SRAM networks.
When used with one of the Dallas power monitoring devices listed in Table 1, the DS1336 allows a load
to be switched from its main power supply VCC to a battery backup supply when VCC falls out of
tolerance. A user may selectively tie together any combination of the output pins to provide the desired
DS1336
Afterburner Chip
www.dalsemi.com16-Pin DIP (300-mil)
See Mach. Drawings
Section
16-Pin DIP SOIC (300-mil)
See Mach. Drawings
Section
OUT5
IN5
IN2
IN4
VBATIN
VBAT02
OUT416
VCC/IN1
GND
OUT1
OUT2
OUT3
VBAT01
IN3
OUT5
IN5
IN2
IN4
VBATIN
VBAT02
OUT416
VCC/IN1
GND
OUT1
OUT2
OUT3
VBAT01
IN3
DS1336
current when VCC is out of tolerance. The DS1336 switches back to the higher current VCC from battery
current when PF and PF become inactive.
OPERATIONThe required PF or PF input which controls the switching between the main VCC and backup battery can
be supplied by any of the devices listed in Table 1. All of the devices provide the DS1336 with a PF or signal, switching between a main supply VCC and backup supply VBAT when VCC falls out of
tolerance. For applications requiring switching from the VCC supply inputs to VBAT, the required PF or input to the DS1336 can be provided by the DS1236, DS1239, DS5001, or DS5340. For applications
requiring switching from the VCC inputs to the VBAT input when VCC begins falling out of tolerance, any
of the Dallas Semiconductor devices listed in Table 1 can provide the DS1336 with the required
switching input. A typical application is shown in Figure 1. For applications where switching between
VCC and VBAT must occur at a voltage level such that VCC is still greater than VBAT, the OUT5 pin is
recommended as it provides a diode path which will provide for a gradual transition between VCC and
VBAT. OUT5 can be tied to the other OUTPUT pins to provide a gradual transition for all five current
paths. In applications where tri-state switching is desired, OUT5 should be omitted. Only the PF/PF pin
is required for switching. In cases where the PF input will not be used, it should be connected to GND.
When either PF or PF is active, either of the VBAT0X outputs is available, although they should not be tied
together (Figure 2, “DS1336 Block Diagram”). VBAT01 is recommended for sensitive applications such as
providing backup current to timekeepers, because its diode isolated path provides for increased
protection. VBAT02 is not recommended for applications where it would be tied to an OUTPUT pin
supplying a voltage greater than that of the backup battery because VBAT02 is not a diode isolated current
path.
TYPICAL APPLICATION Figure 1
DS1336
DS1336 BLOCK DIAGRAM Figure 2
DS1336
DALLAS SEMICONDUCTOR DEVICES WHICH PROVIDE PF OR PF INPUT
TO NIL Table 1
DEVICE
SWITCH >
VBAT
SWITCH AT
VBATDEVICE
SWITCH >
VBAT
SWITCH AT
VBATDS1211XDS1238XX
DS1212XDS1239XX
DS1231XDS1259X
DS1232XDS1260X
DS1233XDS1610X
DS1233AXDS1632X
DS1233DXDS1833X
DS1234XDS5001XX
DS1236XXDS5340XX
DS1237X
DS1336
ABSOLUTE MAXIMUM RATINGS*Voltage on Any Pin Relative to Ground -0.3V to +7.0V
Operating Temperature 0°C to 70°C
Storage Temperature -55°C to +125°C
Soldering Temperature 260°C for 10 secondsThis is a stress rating only and functional operation of the device at these or any other conditions
above those indicated in the operation sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods of time may affect reliability.
DC OPERATING CONDITIONS(tA = 0°C to 70°C; VCC = 5V ± 10%)
PARAMETERSYMBOLMINTYPMAXUNITSNOTESSupply VoltageVCC13.05.05.5V1
Supply CurrentICC10.251.0mA
Supply CurrentICC250100nA3
Input Low VoltageVIL0.8V1
Input High VoltageVIH2.0VCCV1
Current Output
VCC=VCC1, PF=0, PF=1ICCO300mA2
Current Output
VCC=0, PF=1, PF=0IBAT01-24.0mA4
Current, Forward Bias of
VCC5 DiodeIFB20mA
Off ImpedanceROFF15.0MΩ5
Off ImpedanceROFF210MΩ6
On ImpedanceRON10.7Ω7
On ImpedanceRON250Ω8
AC CHARACTERISTICS(tA = 0°C to 70°C; VCC = 5V ± 10%)
PARAMETERSYMBOLMINTYPMAXUNITSNOTESPropagation DelaytPD10ns9
Switch Delay Power-failtPF100ns
Switch Delay Power-ontPON100ns
Capacitance PF, PFCI7pF
NOTES:1. All voltages referenced to ground.
2. ICCO with a voltage drop of 0.2 volts from any VCCO output.
3. VCC=0, VBATIN=3.0 volts.
4. VBAT01 with a voltage drop of 1.0 volts.
5. ROFF1 applies to VCCO1, 2, 3, 4.
DS1336
7. Applies to VCCO1-5, 300 mA.
8. Applies to VBATO1-2, 4 mA.
9. VCCI3 to VCCO3 delay when used as chip enable control for write protection of a memory device. In
this application a current 8 mA source current on VCCI3 with 50 pF load on VCCO3 can be
accommodated.
