DIP-40 ,Thermal Data
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DIP40-DIP-40
Thermal Data
Thermal Data
DIP 40
40leads
PACKAGE MATERIAL LIST
item # material thickness thermal
conductivity
leadframe copper 0.25 mm 2.61 W/cm°C
die attach epoxy glue 10-40 pm 0.01 W/cm°C
( silver filler)
molding epoxy resin 3.8 mm 0.0063W/cm°C
compound
Charts enclosed :
1) Rth(j-a) vs power dissipation
2) Zth(j-a) vs time
September 1999 1/2
Thermal Data Dip 40
Rth(j-a) (°C/W)
die size 35000 sq. mils
60 dissipating area 2000 sq. mils
2 s 1 Oz. board
_ ""ss,
50lllllllllll''ll''lllllll
0 0.5 1 1.5 2 2.5 3
dissipated power ( Watt )
Zth(°CNV)
10 _---------------
:iiiiiijiiijiiiijii,,iiiiiiidiesize350008Q-mils
_------------------ dissipating area 2000 sq. mils
""""""""""""""" 2s1Oz.board
_------------------------- 2 w single square pulse
111111|1J |l|1|11|| ||1|111|1 11111111‘ slllllsll Illlllll
0.001 0.01 0.1 1 10 100 1,000
Time (s)
2/2 /iTfr,,',
