DAC312HP ,12-Bit High Speed Multiplying D/A Converterfeatures of the DAC312 along with an ex-The DAC312 combines a 9-bit master D/A converter with acell ..
DAC312HP ,12-Bit High Speed Multiplying D/A Converterfeatures of the DAC312 along with an ex-The DAC312 combines a 9-bit master D/A converter with acell ..
DAC312HS ,12-Bit High Speed Multiplying D/A ConverterFEATURES PIN CONNECTIONSDifferential Nonlinearity: 61/2 LSB20-Pin Hermetic DIP (R-Suffix),Nonlinear ..
DAC3282IRGZR ,Dual 16 bit 625MSPS Communications DAC 48-VQFN -40 to 85Features 3 DescriptionThe DAC3282 is a dual-channel 16-bit 625 MSPS1• Dual, 16-Bit, 625 MSPS DACsdi ..
DAC3282IRGZT ,Dual 16 bit 625MSPS Communications DAC 48-VQFN -40 to 85 SLAS646C–DECEMBER 2009–REVISED MAY 2015• Added text string to CONFIG18 Register table, Bit 1 Funct ..
DAC3283IRGZR ,Dual 16 bit 800MSPS Communications DAC 48-VQFN -40 to 85Electrical Characteristics – Digital Specifications..... 912.2 Trademarks..... 597.8 Timing Require ..
DLA11C ,Silicon Diffused Junction Type 1.1A Ultrahigh-Speed RectifierAbsolute Maximum Ratings at Ta = 25˚CPl arameter Ss ymbo Cs ondition Rt ating UniPV eak Reverse Vol ..
DLD101-7 , LINEAR MODE CURRENT SINK LED DRIVER
DLD101-7 , LINEAR MODE CURRENT SINK LED DRIVER
DLG1414 , 145 4-character 5 x 7 Dot Matrix Alphanumeric Intelligent Display with Memory/Decoder/Driver
DLM2HGN601SZ3L , SMD/BLOCK Type EMI Suppression Filters
DLP05LC , LOW CAPACITANCE UNIDIRECTIONAL TVS
DAC312ER-DAC312FR-DAC312HP-DAC312HS
12-Bit High Speed Multiplying D/A Converter
REV.C
12-Bit High Speed Multiplying
D/A Converter
FEATURES
Differential Nonlinearity: 61/2 LSB
Nonlinearity: 0.05%
Fast Settling Time: 250 ns
High Compliance: –5 V to +10 V
Differential Outputs: 0 to 4 mA
Guaranteed Monotonicity: 12 Bits
Low Full-Scale Tempco: 10 ppm/8C
Circuit Interface to TTL, CMOS, ECL, PMOS/NMOS
Low Power Consumption: 225 mW
Industry Standard AM6012 Pinout
Available In Die Form
PIN CONNECTIONS
20-Pin Hermetic DIP (R-Suffix),
20-Pin Plastic DIP (P-Suffix),
20-Pin SOL (S-Suffix)
GENERAL DESCRIPTIONThe DAC312 series of 12-bit multiplying digital-to-analog con-
verters provide high speed with guaranteed performance to
0.012% differential nonlinearity over the full commercial oper-
ating temperature range.
The DAC312 combines a 9-bit master D/A converter with a
3-bit (MSBs) segment generator to form an accurate 12-bit D/A
converter at low cost. This technique guarantees a very uniform
step size (up to ±1/2 LSB from the ideal), monotonicity to
12-bits and integral nonlinearity to 0.05% at its differential cur-
rent outputs. In order to provide the same performance with a
12-bit R-2R ladder design, an integral nonlinearity over tem-
perature of 1/2 LSB (0.012%) would be required.
The 250 ns settling time with low glitch energy and low power
consumption are achieved by careful attention to the circuit de-
sign and stringent process controls. Direct interface with all
popular logic families is achieved through the logic threshold
terminal.
FUNCTIONAL BLOCK DIAGRAMHigh compliance and low drift characteristics (as low as
10 ppm/°C) are also features of the DAC312 along with an ex-
cellent power supply rejection ratio of ±.001% FS/%ΔV. Oper-
ating over a power supply range of +5/–11 V to ±18 V the
device consumes 225 mW at the lower supply voltages with an
absolute maximum dissipation of 375 mW at the higher supply
levels.
With their guaranteed specifications, single chip reliability and
low cost, the DAC312 device makes excellent building blocks
for A/D converters, data acquisition systems, video display driv-
ers, programmable test equipment and other applications where
low power consumption and complete input/output versatility
are required.
DAC312–SPECIFICATIONS
ELECTRICAL CHARACTERISTICS
(@ VS = 615 V, IREF = 1.0 mA, 08C ≤ TA ≤ +708C for DAC312E and –408C ≤ TA ≤ +858C
for DAC312F, DAC312H, unless otherwise noted. Output characteristics refer
to both IOUT and IOUT.)
TYPICAL ELECTRICAL CHARACTERISTICS@ 258C; VS = 615 V, and IREF = 1.0 mA, unless otherwise noted. Output
characteristics refer to both IOUT and IOUT.
ELECTRICAL CHARACTERISTICSNOTESGuaranteed by design.TA = +25°C for DAC312H grade only.
Specifications subject to change without notice.
@ VS = 615 V, IREF = 1.0 mA, 08C ≤ TA ≤ 708C for DAC312E and –408C ≤ TA ≤ +858C for
DAC312F, DAC312H, unless otherwise noted. Output characteristics refer to both IOUT and IOUT. Continued
DAC312
DAC312
WAFER TEST LIMITSNOTE
Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed
for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.
@ VS = 615 V, IREF = 1.0 mA, TA = 258C, unless otherwise noted. Output characteristics refer to both IOUT and IOUT.
DICE CHARACTERISTICSDIE SIZE 0.141 × 0.096 inch, 13,536 sq. mils (3.58 × 2.44 mm, 8.74 sq. mm)
1. B1 (MSB)11. B11
2. B212. B12 (LSB)
3. B313. VLC/AGND
4. B414. VREF(+)
5. B515. VREF(–)
6. B616. COMP
7. B717. V–
8. B818. IO
9. B919. IO
10. B1020. V+
ORDERING GUIDE1NOTESBurn-in is available on commercial and industrial temperature range parts in
cerdip, plastic DIP, and TO-can packages.For devices processed in total compliance to MIL-STD-883, add/883 after part
number. Consult factory for 883 data sheet.
ABSOLUTE MAXIMUM RATINGS1Operating Temperature
DAC312E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0°C to +70°C
DAC312F, DAC312H . . . . . . . . . . . . . . . . . .–40°C to +85°C
Junction Temperature . . . . . . . . . . . . . . . . . . . .–65°C to +150°C
Storage Temperature (Tj) . . . . . . . . . . . . . . . . .–65°C to +125°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . . . . .300°C
Power Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±18 V
Logic Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–5 V to +18 V
Analog Current Outputs . . . . . . . . . . . . . . . . . . . .–8 V to +12 V
Reference Inputs V14, V15 . . . . . . . . . . . . . . . . . . . . . . .V– to V+
Reference Input Differential Voltage (V14, V15) . . . . . . . . . .±18 V
Reference Input Current (I14) . . . . . . . . . . . . . . . . . . . . .1.25 mA
NOTESAbsolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.θJA is specified for worst case mounting conditions, i.e., θJA is specified for device
in socket for cerdip and P-DIP packages; θJA is specified for device soldered to
printed circuit board for SOL package.
CAUTIONESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the DAC312 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
DAC312
TYPICAL PERFORMANCE CHARACTERISTICSOutput Current vs. Output Voltage
(Output Voltage Compliance)
Power Supply Current vs. Power
Supply Voltage
Reference Amplifier Small-Signal
Frequency Response
Reference Amplifier Common-Mode
Range
Power Supply Current vs.
Temperature
Reference Amplifier Large-Signal
Frequency Response
Output Compliance vs. Temperature
True and Complementary Output
Operation
Gain Accuracy vs. Reference Current
BASIC CONNECTIONSNegative Low Impedance Output Operation
Accommodating Bipolar References
Basic Positive Reference Operation
Positive Low Impedance Output Operation
Basic Negative Reference Operation
Recommended Full-Scale Adjustment Circuit
Pulsed Reference Operation
