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8-Bit, High Speed, Multiplying D/A Converter (Universal Digital Logic Interface)
8-Bit, High Speed, Multiplying D/A Converter
(Universal Digital Logic Interface)
Rev. C
FEATURES
Fast settling output current: 85 ns
Full-scale current prematched to ±1 LSB
Direct interface to TTL, CMOS, ECL, HTL, PMOS
Nonlinearity to 0.1% maximum over temperature range
High output impedance and compliance: −10 V to +18 V
Complementary current outputs
Wide range multiplying capability: 1 MHz bandwidth
Low FS current drift: ±10 ppm/°C
Wide power supply range: ±4.5 V to ±18 V
Low power consumption: 33 mW @ ±5 V
Low cost
GENERAL DESCRIPTION The DAC08 series of 8-bit monolithic digital-to-analog convert-
ers provide very high speed performance coupled with low cost
and outstanding applications flexibility.
Advanced circuit design achieves 85 ns settling times with very
low “glitch” energy and at low power consumption. Monotonic
multiplying performance is attained over a wide 20-to-1
reference current range. Matching to within 1 LSB between
reference and full-scale currents eliminates the need for full-
scale trimming in most applications. Direct interface to all
popular logic families with full noise immunity is provided by
the high swing, adjustable threshold logic input.
High voltage compliance complementary current outputs are
provided, increasing versatility and enabling differential
operation to effectively double the peak-to-peak output swing.
In many applications, the outputs can be directly converted to
voltage without the need for an external op amp. All DAC08
series models guarantee full 8-bit monotonicity, and nonlineari-
ties as tight as ±0.1% over the entire operating temperature
range are available. Device performance is essentially unchanged
over the ±4.5 V to ±18 V power supply range, with 33 mW
power consumption attainable at ±5 V supplies.
The compact size and low power consumption make the DAC08
attractive for portable and military/aerospace applications;
devices processed to MIL-STD-883, Level B are available.
DAC08 applications include 8-bit, 1 µs A/D converters, servo
motor and pen drivers, waveform generators, audio encoders
and attenuators, analog meter drivers, programmable power
supplies, LCD display drivers, high speed modems, and other
applications where low cost, high speed, and complete
input/output versatility are required.
FUNCTIONAL BLOCK DIAGRAM 00268-C-001
VREF (+)14VLC(MSB)B2B3B4B5B6B7
(LSB)COMP
VREF (–)Figure 1.
TABLE OF CONTENTS Specifications.....................................................................................3
Electrical Characteristics.............................................................3
Typical Electrical Characteristics...............................................4
Absolute Maximum Ratings............................................................5
ESD Caution..................................................................................5
Pin Connections...............................................................................6
Test and Burn-In Circuits................................................................7
Typical Performance Characteristics.............................................8
Basic Connections..........................................................................11
Application Information................................................................13
Reference Amplifier Setup........................................................13
Reference Amplifier Compensation for Multiplying
Applications................................................................................13
Logic Inputs.................................................................................13
Analog Output Currents...........................................................14
Power Supplies............................................................................14
Temperature Performance.........................................................14
Multiplying Operation...............................................................14
Settling Time...............................................................................14
ADI Current Output DACs...........................................................16
Outline Dimensions.......................................................................17
Ordering Guide..........................................................................18
REVISION HISTORY
11/04—Rev. B to Rev. C Changed SO to SOIC.........................................................Universal
Removed DIE......................................................................Universal
Changes to Figure 30, Figure 31, Figure 32.................................12
Change to Figure 33.......................................................................15
Added Table 4..................................................................................16
Updated Outline Dimensions.......................................................17
Changes to Ordering Guide..........................................................18
2/02—Rev. A to Rev. B Edits to SPECIFICATIONS.............................................................2
Edits to ABSOLUTE MAXIMUM RATING................................3
Edits to ORDERING GUIDE..........................................................3
Edits to WAFER TEST LIMITS......................................................5
Edit to Figure 13...............................................................................8
Edits to Figures 14 and 15...............................................................9
SPECIFICATIONS
ELECTRICAL CHARACTERISTICS VS = ±15 V, IREF = 2.0 mA, –55°C ≤ TA ≤ +125°C for DAC08/DAC08A, 0°C ≤ TA ≤ +70°C for DAC08E and DAC08H, −40°C to +85°C for
DAC08C, unless otherwise noted. Output characteristics refer to both IOUT and IOUT.
Table 1.
1 Guaranteed by design.
TYPICAL ELECTRICAL CHARACTERISTICS VS = ±15 V, and IREF = 2.0 mA, unless otherwise noted. Output characteristics apply to both IOUT and IOUT.
Table 2. ABSOLUTE MAXIMUM RATINGS
Table 3. θJA is specified for worst-case mounting conditions, that is, θJA is specified for
device in socket for CERDIP, PDIP, and LCC packages; θJA is specified for
device soldered to printed circuit board for SOIC package.
Stresses greater than those listed under Absolute Maximum
Ratings may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
PIN CONNECTIONS 00268-C-002
VLC
IOUT
(MSB) B1
IOUT00268-C-003
VREF (+)
VREF (–)
COMP
VLC
IOUT
IOUT00268-C-004
VREF (+)V
(–)
NC = NO CONNECT
COMP
IOUT
IOUT
(MSB) B1NCB6(LSB)
DAC08TOP VIEW(Not To Scale)Figure 2. 16-Lead Dual In-Line Package
(Q and P Suffixes)
Figure 3. 16-Lead SOIC
(S Suffix)
Figure 4. DAC08RC/883 20-Lead LCC
(RC Suffix)
TEST AND BURN-IN CIRCUITS 00268-C-006
TYPICALVALUES:
RIN=5kΩ
+VIN=10V
OPTIONAL RESISTOR
FOR OFFSET INPUTS
+VREF
NO CAPFigure 5. Pulsed Reference Operation
00268-C-007
+18V
R1 = 9kΩ
C1 = 0.001µF
C2, C3 = 0.01µFFigure 6. Burn-In Circuit
TYPICAL PERFORMANCE CHARACTERISTICS 00268-C-008
2.5V
0.5V
–0.5mA
IOUT
–2.5mA
200ns/DIVISIONREQ≈ 200Ω
RL = 100Ω
CC = 0Figure 7. Fast Pulsed Reference Operation
0mA
1.0mA
2.0mA
(0000|0000)(1111|1111)IREF = 2mAFigure 8. True and Complementary Output Operation
00268-C-010
50ns/DIVISION
2.4V
0.4V0V
8µAFigure 9. LSB Switching
SETTLINGTIMEFIXTURE
IFS=2mA,RL=1kΩ
1/2LSB=4µA
50ns/DIVISION
ALL BITS SWITCHED ON2.4V
0.4V
–1/2LSB0V+1/2LSB
OUTPUT
SETTLING
Figure 10. Full-Scale Settling Time
00268-C-012
IREF, REFERENCE CURRENT (mA)
, OUTP
UT CURRE
NT (mA)Figure 11. Full-Scale Current vs. Reference Current
00268-C-013
IFS, OUTPUT FULL-SCALE CURRENT (mA)
AGATION DE
LAY
(ns
100Figure 12. LSB Propagation Delay vs. IFS
00268-C-014
FREQUENCY (MHz)
RELATIVE OUTPUT (dB)
–12Figure 13. Reference Input Frequency Response
00268-C-015
V15, REFERENCE COMMON-MODE VOLTAGE (V)
OUTP
UT CURRE
T (mA)
0.4Figure 14. Reference Amp Common-Mode Range
00268-C-016
LOGIC INPUT VOLTAGE (V)
LOGIC INPUT (Figure 15. Logic Input Current vs. Input Voltage
00268-C-017
TEMPERATURE (°C)
(V
0.4Figure 16. VTH − VLC vs. Temperature
00268-C-018
OUTPUTVOLTAGE(V)
OUTP
UT CURRE
NT (mA)
0.4Figure 17. Output Current vs. Output Voltage (Output Voltage Compliance)
00268-C-019
TEMPERATURE (°C)
–50050100150Figure 18. Output Voltage Compliance vs. Temperature
00268-C-020
LOGIC INPUT VOLTAGE (V)
OUTP
UT CURRE
NT (mA)
NOTE:B1 THROUGH B8 HAVE IDENTICAL TRANSFERCHARACTERISTICS. BITS ARE FULLY SWITCHED WITH LESSTHAN 1/2 LSB ERROR, AT LESS THAN±100mV FROM ACTUAL
THRESHOLD. THESE SWITCHING POINTS ARE GUARANTEEDTO LIE BETWEEN 0.8V AND 2.0V OVER THE OPERATINGTEMPERATURE RANGE (VLC = 0.0V). Figure 19. Bit Transfer Characteristics
00268-C-021
V+, POSITIVE POWER SUPPLY (V dc)
R S
CURRE
NT (mA)6812141618
01020Figure 20. Power Supply vs. V+
00268-C-022
V–, NEGATIVE POWER SUPPLY (V dc)
R S
CURRE
NT (mA)–2–6–8–10–12–14–16–18Figure 21. Power Supply Current vs. V−
00268-C-023
TEMPERATURE (°C)
R S
CURRE
NT (mA)
–50050100150Figure 22. Power Supply Current vs. Temperature
