CRS10I30A ,Schottky barrier diodeElectrical Characteristics (Ta = 25°C) Characteristics Symbol Test Condition Min Typ. MaxUnitV I = ..
CRS10I30B ,Schottky barrier diodeElectrical Characteristics (Ta = 25°C) Characteristics Symbol Test Condition Min Typ. MaxUnitV I = ..
CRS11 ,Schottky Barrier Rectifier Schottky Barrier Type Switching Mode Power Supply Applications Portable Equipment Battery ApplicationsApplications Forward voltage: V = 0.36 V (max) FM Average forward current: I = 1.0 A F (AV) ..
CRS12 ,Schottky barrier diodeabsolute maximum ratings, which are rated values and must not be exceeded during operation, even fo ..
CRS14 ,Schottky barrier diodeElectrical Characteristics (Ta = 25°C) Characteristics Symbol Test Condition Min Typ. MaxUnitV I = ..
CRS15 ,Schottky barrier diodeElectrical Characteristics (Ta = 25°C) Characteristics Symbol Test Condition Min Typ. MaxUnitV I = ..
CX24951 , Single-Chip Cable Modem Solution
CX28394-22 , Quad/x16/Octal-T1/E1/J1 Framers
CX28394-22 , Quad/x16/Octal-T1/E1/J1 Framers
CX3225SB16000D0PESZZ , Crystal Units Surface Mount Type
CX-49F , For ECU.
CX-49F , For ECU.
CRS10I30A
Schottky barrier diode
CRS10I30A TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CRS10I30A Secondary Rectification in Switching Regulators
Reverse-Current Protection in Mobile Devices Forward voltage: VFM = 0.39 V (max) @ IFM = 0.7 A Forward current (AV): IF (AV) = 1.0 A Repetitive peak reverse voltage: VRRM = 30 V Suitable for high-density board assembly due to the use of a small
surface-mount package, “S-FLATTM”
Absolute Maximum Ratings (Ta = 25°C) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Note 1: Ta = 51°C: Device mounted on a glass-epoxy board Board size: 50 mm × 50 mm Soldering size: 6 mm × 6 mm Board thickness: 1.6 mm
Rectangular waveform (α = 180°), VR = 15 V
Unit: mm
Weight: 0.013 g (typ.)
