CRF02 ,Super fast-recovery diodeElectrical Characteristics (Ta = 25°C) Characteristics Symbol Test Condition Min Typ. MaxUnitPeak f ..
CRF03 ,Super fast-recovery diodeabsolute maximum ratings, which are rated values and must not be exceeded during operation, even fo ..
CRG01 ,Rectifier Silicon Diffused Type General Purpose Rectifier ApplicationsApplications Unit: mm Average forward current: I = 0.7 A F (AV) Repetitive peak reverse volt ..
CRG02 ,Rectifier Silicon Diffused Type General Purpose Rectifier ApplicationsCRG01,CRG02 TOSHIBA Rectifier Silicon Diffused Type CRG01, CRG02 General Purpose Rectifier
CRG03 ,General-purpose diodeabsolute maximum ratings, which are rated values and must not be exceeded during operation, even fo ..
CRG04 ,General-purpose diodeabsolute maximum ratings are rated values and must not be exceeded during operation, even for an in ..
CX20188 , DOLBY B-C TYPE NOISE REDUCTION SYSTEM
CX20188 , DOLBY B-C TYPE NOISE REDUCTION SYSTEM
CX20206 , 8 BIT 35 MSPS RGB 3-CHANNEL D/A CONVERTER
CX2038 , BROADBAND: RF & WIRELESS
CX20493-31 , SmartV.XX Modem
CX20493-31 , SmartV.XX Modem
CRF02
Super fast-recovery diode
CRF02 TOSHIBA Fast Recovery Diode Silicon Diffused Type
CRF02 Power Supply Applications
Strobo Flasher Applications Repetitive peak reverse voltage: VRRM = 800 V Average forward current: IF (AV) = 0.5 A Low forward voltage: VFM = 3.0 V (max.) Very fast reverse-recovery time: trr = 100 ns (max.) Suitable for compact assembly due to its small surface-mount
package, the “S−FLATTM ” (Toshiba package name)
Absolute Maximum Ratings (Ta = 25°C) Note 1: Ta = 84°C: Device mounted on a ceramic board Board size: 50 mm × 50 mm, Soldering Land size: 2 mm × 2 mm Board thickness: 0.64 t
Rectangular waveform (α = 180°)
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Unit: mm
Weight: 0.013 g (typ.)
