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CPL-WB-00C2 |CPLWB00C2STN/a3000avaiWide band directional coupler with ISO port


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CPL-WB-00C2
Wide band directional coupler with ISO port
January 2010 Doc ID 15088 Rev 3 1/8
CPL-WB-00C2

Wide band directional coupler with ISO port
Features
50 Ω nominal input / output impedance Wide operating frequency range
(824 MHz to 2170 MHz) Low Insertion Loss (< 0.2 dB) 34 dB typical coupling factor High directivity (typical 25 dB) High ESD robustness
(IEC 61000-4-2 Level 4) Flip-Chip package Small footprint: 1700 x 1200 µm
Benefits
Very low profile (< 690 µm thickness) Lead-free package High RF performance RF module size reduction
Applications
Quad band power amplifier module Quad band front end module GSM / WCDMA mobile phone
Figure 1. Pin configuration (top view)
Description

The CPL-WB-00C2 is a wide band directional
coupler designed to measure RF antenna output
power in GSM / WCDMA applications. This CPL
has been customized for wide band operating
frequencies (EGSM and CELL, PCS, DCS,
WCDMA Band I) with less than 0.2 dB insertion
losses in the transmit bandwidth (824 MHz to
2170 MHz).
The CPL-WB-00C2 has been designed using
STMicroelectronics IPD (integrated passive
device) technology on non conductive glass
substrate to optimize RF performance. The device
is delivered 100% tested in tape and reel.
Characteristics CPL-WB-00C2
2/8 Doc ID 15088 Rev 3
1 Characteristics




Table 1. Absolute maximum rating (limiting values)
Table 2. Electrical characteristics (Tamb = 25 °C) - impedances
Table 3. Electrical characteristics (Tamb = 25 °C) - RF performance
CPL-WB-00C2 Characteristics
Doc ID 15088 Rev 3 3/8
1.1 RF measurement (on reference evaluation board)

Measurements done on reference evaluation board under 50 Ω, de-embedding at
CPL-WB-00C2 bumps.
Figure 2. Insertion loss
Figure 3. Coupling and isolation
Figure 4. Directivity
Reference evaluation board CPL-WB-00C2
4/8 Doc ID 15088 Rev 3 Reference evaluation board
Figure 5. CPW lines (W = 850 µm with gap to gnd = 260 µm) on top layer + GND on
bottom layer
Material: 2 layers FR4 with solder mask on top and bottom layer Substrate thickness: 0.8 mm Line lengths: 10.2 mm Extension values on short line measurement: 102 ps Through insertion loss: 0.20 dB @ 1 GHz , 0.24 dB@ 2 GHz
CPL-WB-00C2 Package information
Doc ID 15088 Rev 3 5/8
3 Package information

In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOP ACK®
specifications, grade definitions and product status are available at: .
ECOPACK® is an ST trademark.
Figure 6.

Figure 7. Footprint Figure 8. Marking
Package information CPL-WB-00C2
6/8 Doc ID 15088 Rev 3
Figure 9. Flip Chip tape and reel specifications

Note: More information is available in the application note:
AN1235: “Flip Chip: package description and recommendations for use”
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