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CP3SP33SMSNSN/a3200avaiCP3SP33 Connectivity Processor with Cache, DSP, and Bluetooth, USB, and Dual CAN Interfaces


CP3SP33SMS ,CP3SP33 Connectivity Processor with Cache, DSP, and Bluetooth, USB, and Dual CAN InterfacesFeaturespendent system and audio peripheral clocks Capable of operating up to 96 MHz Two independ ..
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CP3SP33SMS
CP3SP33 Connectivity Processor with Cache, DSP, and Bluetooth, USB, and Dual CAN Interfaces
CP3SP33
Connec
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r wi
e, DSP,
nd Bluet
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nd Dual CAN Inte
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PRELIMINARY

September 2005
CP3SP33 Connectivity Processor with Cache, DSP , and
Bluetooth® , USB, and Dual CAN Interfaces
1.0 General Description

The CP3SP33 connectivity processor combines high per-
formance with the massive integration needed for embed-
ded Bluetooth applications. A powerful RISC core with 4K-
byte instruction cache and a Teak® DSP coprocessor pro-
vides high computing bandwidth, DMA-driven hardware
communications peripherals provide high I/O bandwidth,
and an external bus provides system expandability.
On-chip communications peripherals include: Bluetooth
Lower Link Controller, Universal Serial Bus (2.0) OTG node
and host controller, dual CAN, dual Microwire/Plus/SPI,
dual ACCESS.bus, quad UART, 10-bit A/D converter, and
telematics/audio codec. Additional on-chip peripherals in-
clude DMA controller, dual CVSD/PCM conversion module,2 S and AAI digital audio bus interfaces, Timing and Watch-
dog Unit, dual Versatile Timer Unit, dual Multi-Function Tim-
er, and Multi-Input Wake-Up (MIWU) unit.
In addition to providing the features needed for the next gen-
eration of embedded Bluetooth products, the CP3SP33 is
backed up by the software resources that designers need
for rapid time-to-market, including an operating system,
Bluetooth protocol stack implementation, peripheral drivers,
reference designs, and an integrated development environ-
ment. Combined with an external program memory and a
Bluetooth radio transceiver such as National’s LMX5252,
the CP3SP33 provides a complete Bluetooth system solu-
tion.
National Semiconductor offers a complete and industry-
proven application development environment for CP3SP33
applications, including the IAR Embedded Workbench,
iSYSTEM winIDEA and iC3000 Active Emulator, Bluetooth
Development Board, Bluetooth protocol stack, and applica-
tion examples.
Block Diagram
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