CMZ15 ,Zener diodeabsolute maximum ratings, which are rated values and must not be exceeded during operation, even fo ..
CMZ16 ,Zener diodeAbsolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Power dissipation P 2.0 (No ..
CMZ18 ,Zener diodeapplications, customers must also refer to and comply with (a) the latest versions of all relevant ..
CMZ22 ,Zener diodeabsolute maximum ratings, which are rated values and must not be exceeded during operation, even fo ..
CMZ24 ,Zener diodeElectrical Characteristics (Ta = 25°C) Temperature Zener Voltage Zener Impedance Forward Voltage Re ..
CMZ27 ,Zener diodeabsolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semi ..
CS5341-CZZR , 105 dB, 192 kHz, Multi-Bit Audio A/D Converter
CS5341-DZZ , 105 dB, 192 kHz, MULTI-BIT AUDIO A/D CONVERTER
CS5341-DZZ , 105 dB, 192 kHz, MULTI-BIT AUDIO A/D CONVERTER
CS5342-CZZ , 105 dB, 192 kHz, MULTI-BIT AUDIO A/D CONVERTER
CS5342-CZZ , 105 dB, 192 kHz, MULTI-BIT AUDIO A/D CONVERTER
CS5343-CZZ , 98 dB, 96 kHz, Multi-Bit Audio A/D Converter
CMZ12-CMZ13-CMZ15-CMZ16-CMZ18-CMZ22-CMZ24-CMZ27-CMZ33-CMZ43-CMZ53
Zener diode
CMZ12~CMZ53 TOSHIBA Zener Diode Silicon Diffused Type
CMZ12~CMZ53 Applications:
Communication, Control and
Measurement Equipment
Constant Voltage Regulation
Transient Suppressors Average power dissipation : P = 2.0 W Zener voltage : VZ = 12 V ~ 53 V Suitable for compact assembly due to small surface-mount package
“M−FLATTM ” (Toshiba package name)
Absolute Maximum Ratings (Ta = 25°C) Note 1: Ta = 30°C
Device mounted on a ceramic board
Board size: 50 mm × 50 mm
Soldering size: 2 mm × 2 mm
Board thickness: 0.64 t
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Standard Soldering Pad Unit: mm
Weight: 0.023 g (typ.)
3.0
2.1
Unit: mm
