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CGD942CPHIN/a975avai870 MHz, 23 dB gain power doubler amplifier
CGD942CNXPN/a1000avai870 MHz, 23 dB gain power doubler amplifier


CGD942C ,870 MHz, 23 dB gain power doubler amplifierGeneral descriptionHybrid amplifier module in a SOT115J package, operating at a supply voltage of 2 ..
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CGD942C
870 MHz, 23 dB gain power doubler amplifier
1. Product profile
1.1 General description

Hybrid amplifier module in a SOT115J package, operating at a supply voltage of V (DC), employing Hetero Field Effect Transistor (HFET) GaAs dies.
1.2 Features and benefits
High output capability Excellent linearity Extremely low noise Excellent return loss properties Rugged construction Gold metallization ensures excellent reliability
1.3 Applications
CATV systems operating in the 40 MHz to 870 MHz frequency range
1.4 Quick reference data

[1] Direct Current (DC).
CGD942C
870 MHz, 23 dB gain power doubler amplifier
Rev. 3 — 29 September 2010 Product data sheet

This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
Table 1. Quick reference data
power gain f= 870 MHz 222324dB
Itot total current VB =24V [1]- 450 - mA
NXP Semiconductors CGD942C
870 MHz, 23 dB gain power doubler amplifier
2. Pinning information

3. Ordering information

4. Limiting values

Table 2. Pinning
input
2, 3 common
5+VB
7, 8 common
9output
Table 3. Ordering information

CGD942C - rectangular single-ended package; aluminium flange;
2 vertical mounting holes; 2 × 6-32 UNC and 2 extra
horizontal mounting holes; 7 gold-plated in-line leads
SOT115J
Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). supply voltage - 30 V
Vi(RF) RF input voltage single tone - 75 dBmV
132 channels flat - 45 dBmV
Tstg storage temperature −40 +100 °C
Tmb mounting base temperature −20 +100 °C
NXP Semiconductors CGD942C
870 MHz, 23 dB gain power doubler amplifier
5. Characteristics

[1] Gp at 870 MHz minus Gp at 40 MHz.
[2] Flatness straight line (peak to valley).
[3] 79 NTSC channels (55.25 MHz to 547.25 MHz, 48 dBmV output level) + 53 NTSC channels (553.25 MHz to 997.25 MHz, 38 dBmV
output level).
[4] Vo =48dBmV.
[5] Direct Current (DC).
Table 5. Characteristics

Bandwidth to 870 MHz; VB=24 V (DC); Tmb =35 °C; unless otherwise specified. power gain f = 870 MHz 22 23 24 dB
SLsl slope straight line f = 40 MHz to 870 MHz [1] 1- 2dB flatness of frequency response f = 40 MHz to 870 MHz [2] -0.5 -dB
CTB composite triple beat 79 + 53 flat NTSC channels [3]- −68 −66 dBc
98 flat PAL channels [4]- −66 - dBc
CSO composite second-order distortion 79 + 53 flat NTSC channels [3]- −70 −67 dBc
98 flat PAL channels [4]- −66 - dBc
Xmod cross modulation 79 + 53 flat NTSC channels [3]- −66 −58 dB
RLin input return loss f = 40 MHz to 80 MHz 20 - - dB
f = 80 MHz to 160 MHz 19 - - dB
f = 160 MHz to 320 MHz 18 - - dB
f = 320 MHz to 640 MHz 18 - - dB
f = 640 MHz to 870 MHz 18 - - dB
RLout output return loss f = 40 MHz to 80 MHz 20 - - dB
f = 80 MHz to 160 MHz 19 - - dB
f = 160 MHz to 320 MHz 18 - - dB
f = 320 MHz to 640 MHz 18 - - dB
f = 640 MHz to 870 MHz 18 - - dB noise figure f = 50 MHz - 3.5 5.0 dB
f = 870 MHz - 3.5 5.0 dB
Itot total current VB =24V [5]- 450 - mA
NXP Semiconductors CGD942C
870 MHz, 23 dB gain power doubler amplifier
6. Package outline

Fig 1. Package outline SOT115J
NXP Semiconductors CGD942C
870 MHz, 23 dB gain power doubler amplifier
7. Abbreviations

8. Revision history

Table 6. Abbreviations

CATV Community Antenna TeleVision Direct Current
GaAs Gallium-Arsenide
NTSC National Television Standard Committee
PAL Phase-Alternation Line Radio Frequency
UNC UNified Coarse thread
Table 7. Revision history

CGD942C v.3 20100929 Product data sheet - CGD942C v.2
Modifications: Package outline drawings have been updated to the latest version. Legal texts have been updated.
CGD942C v.2 20091119 Product data sheet - CGD942C v.1
CGD942C v.1 20070607 Product data sheet - -
NXP Semiconductors CGD942C
870 MHz, 23 dB gain power doubler amplifier
9. Legal information
9.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://.
9.2 Definitions
Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
9.3 Disclaimers
Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial
sale, as published at http:///profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
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