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BZA956A
Quadruple ESD transient voltage suppressor
Philips Semiconductors Product specification
Quadruple ESD transient voltage suppressor BZA900A-series
FEATURES ESD rating >8 kV, according to IEC61000-4-2 SOT665 surface mount package Common anode configuration.
APPLICATIONS Computers and peripherals Audio and video equipment Communication systems
DESCRIPTIONMonolithic transient voltage suppressor diodeina fivelead
SOT665 package for 4-bit wide ESD transient
suppression.
MARKING
PINNING
LIMITING VALUESIn accordance with the Absolute Maximum Rating System (IEC 60134).
Notes DC working current limited by Ptot(max). Device mounted on standard printed-circuit board.
Philips Semiconductors Product specification
Quadruple ESD transient voltage suppressor BZA900A-series
THERMAL CHARACTERISTICS
Note Solder point of common anode (pin2).
ELECTRICAL CHARACTERISTICS =25 °C unless otherwise specified.
Table 1 Per type; BZ956Ato BZA968A =25 °C unless otherwise specified.
Philips Semiconductors Product specification
Quadruple ESD transient voltage suppressor BZA900A-series
GRAPHICAL DATA
Philips Semiconductors Product specification
Quadruple ESD transient voltage suppressor BZA900A-series
Philips Semiconductors Product specification
Quadruple ESD transient voltage suppressor BZA900A-series
APPLICATION INFORMATION
Typical common anode application quadruple transient suppressorina SOT665 package makesit possibleto protect four separate lines using only one
package. A simplified example is shown in Fig.7.
Device placement and printed-circuit board layoutCircuit board layoutisof extreme importancein the suppressionof transients. The clamping voltageof the BZA900Ais
determined bythe peak transient current and the rateof riseof that current (di/dt). Since parasitic inductances can further
add to the clamping voltage (V=L di/dt) the series conductor lengths on the printed-circuit board should be kept to a
minimum. This includes the lead length of the suppression element.
In addition to minimizing conductor length the following printed-circuit board layout guidelines are recommended: Place the suppression element close to the input terminals or connectors Keep parallel signal paths to a minimum Avoid running protection conductors in parallel with unprotected conductors Minimize all printed-circuit board loop areas including power and ground loops Minimize the length of the transient return path to ground Avoid using shared transient return paths to a common ground point.
