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BZA862AL-BZA868AL
Quadruple ESD transient voltage suppressor
Philips Semiconductors Product specification
Quadruple ESD transient voltage suppressor BZA800AL series
FEATURES ESD rating >8 kV contact discharge, according to
IEC1000-4-2 SOT353 (SC-88A) surface mount package Common anode configuration.
APPLICATIONS Computers and peripherals Audio and video equipment Communication systems.
DESCRIPTIONMonolithic transient voltage suppressor diodeina fivelead
SOT353 (SC-88A) package for 4-bit wide ESD transient
suppression.
MARKING
PINNING
LIMITING VALUESIn accordance with the Absolute Maximum Rating System (IEC 60134).
Notes DC working current limited by Ptot(max). Device mounted on standard printed-circuit board.
Philips Semiconductors Product specification
Quadruple ESD transient voltage suppressor BZA800AL series
THERMAL CHARACTERISTICS
Note Solder point of common anode (pin2).
ELECTRICAL CHARACTERISTICS =25 °C unless otherwise specified.
Philips Semiconductors Product specification
Quadruple ESD transient voltage suppressor BZA800AL series
Philips Semiconductors Product specification
Quadruple ESD transient voltage suppressor BZA800AL series
Philips Semiconductors Product specification
Quadruple ESD transient voltage suppressor BZA800AL series
APPLICATION INFORMATION
Typical common anode application quadruple transient suppressorina SOT353 (SC88A) package makesit possibleto protect four separate lines using
only one package. A simplified example is shown in Fig7.
Device placement and printed-circuit board layoutCircuit board layoutisof extreme importancein the suppressionof transients. The clamping voltageof the BZA800ALis
determined bythe peak transient current and the rateof riseof that current (di/dt). Since parasitic inductances can further
add to the clamping voltage (V=L di/dt) the series conductor lengths on the printed-circuit board should be kept to a
minimum. This includes the lead length of the suppression element.
In addition to minimizing conductor length the following printed-circuit board layout guidelines are recommended: Place the suppression element close to the input terminals or connectors Keep parallel signal paths to a minimum Avoid running protection conductors in parallel with unprotected conductors Minimize all printed-circuit board loop areas including power and ground loops Minimize the length of the transient return path to ground Avoid using shared transient return paths to a common ground point.
