BUK9610-100B ,N-channel TrenchMOS logic level FETBUK95/9610-100BTrenchMOS™ logic level FETRev. 02 — 8 October 2002 Product data1. Product profile1.1 ..
BUK9610-55A ,N-channel TrenchMOS logic level FET
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BUK96150-55A ,TrenchMOS(tm) transistor Logic level FETLimiting values in accordance with the Absolute Maximum System (IEC 134)SYMBOL PARAMETER CONDITIONS ..
BUK9615-100A ,N-channel TrenchMOS logic level FETLIMITING VALUES AND CHARACTERISTICST = 25˚C unless otherwise specifiedjSYMBOL PARAMETER CONDITIONS ..
C25-28A , COMMUNICATION CABLE
C25P20FR , LOW FORWARD VOLTAGE DROP
C25P40FR , LOW FORWARD VOLTAGE DROP
C2611 , Collector-emitter Voltage: V(BR)CEO=400V, Collector Current: IC=0.2A
C2611 , Collector-emitter Voltage: V(BR)CEO=400V, Collector Current: IC=0.2A
C2611 , Collector-emitter Voltage: V(BR)CEO=400V, Collector Current: IC=0.2A
BUK9510-100B-BUK9610-100B
TrenchMOS(TM) logic level FET
BUK95/9610-100B renchMOS™ logic level FET
Rev. 02 — 8 October 2002 Product data Product profile
1.1 DescriptionN-channel enhancement mode field-effect power transistorina plastic package using
Philips High-Performance Automotive T renchMOS™ technology.
Product availability:
BUK9510-100B in SOT78 (TO-220AB)
BUK9610-100B in SOT404 (D2 -PAK).
1.2 Features
1.3 Applications
1.4 Quick reference data Pinning information[1] It is not possible to make connection to pin 2 of the SOT404 package. Very low on-state resistance � Q101 compliant 175 °C rated � Logic level compatible. Automotive systems � 12 V , 24 V , and 42 V loads Motors, lamps and solenoids � General purpose power switching. EDS(AL)S≤ 629 mJ � RDSon= 8.6 mΩ (typ) ID≤75A � Ptot≤ 300W.
Table 1: Pinning - SOT78 and SOT404 simplified outlines and symbol gate (g)
SOT78 (TO-220AB) SOT404 (D2 -PAK) drain (d) [1] source (s) mounting base,
connected to
drain (d)
MBK106
MBK116
MBB076
Philips Semiconductors BUK95/9610-100B
TrenchMOS™ logic level FET Limiting values[1] Current is limited by power dissipation chip rating
[2] Continuous current is limited by package
Table 2: Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).
VDS drain-source voltage (DC) - 100 V
VDGR drain-gate voltage (DC) RGS =20kΩ - 100 V
VGS gate-source voltage (DC) - ±15 V drain current (DC) Tmb =25 °C; VGS =5V;
Figure2 and3
[1]- 110 A
[2] -75 A
Tmb= 100 °C; VGS =5V; Figure2 [2] -75 A
IDM peak drain current Tmb =25 °C; pulsed; tp≤10 μs;
Figure3 438 A
Ptot total power dissipation Tmb =25 °C; Figure1 - 300 W
Tstg storage temperature −55 +175 °C junction temperature −55 +175 °C
Source-drain diodeIDR reverse drain current (DC) Tmb =25°C [1]- 110 A
[2] -75 A
IDRM peak reverse drain current Tmb =25 °C; pulsed; tp≤10μs - 438 A
Avalanche ruggednessEDS(AL)S non-repetitive drain-source avalanche
energy
unclamped inductive load; ID =75A;
VDS≤ 100 V; VGS =5V; RGS =50Ω;
starting Tmb =25°C 629 mJ
Philips Semiconductors BUK95/9610-100B
TrenchMOS™ logic level FET
Philips Semiconductors BUK95/9610-100B
TrenchMOS™ logic level FET Thermal characteristics
4.1 Transient thermal impedance
Table 3: Thermal characteristicsRth(j-mb) thermal resistance from junction to
mounting base
Figure4 - - 0.5 K/W
Rth(j-a) thermal resistance from junction to ambient
SOT78 vertical in still air - 60 - K/W
SOT404 mounted on a printed circuit board;
minimum footprint 50 - K/W
Philips Semiconductors BUK95/9610-100B
TrenchMOS™ logic level FET Characteristics
Table 4: Characteristics =25 °C unless otherwise specified.
Static characteristicsV(BR)DSS drain-source breakdown
voltage= 0.25 mA; VGS =0V =25°C 100 - - V= −55 °C89 - - V
VGS(th) gate-source threshold voltageID=1 mA; VDS =VGS;
Figure9 =25°C 1.1 1.5 2 V= 175°C 0.5 - - V= −55°C - - 2.3 V
IDSS drain-source leakage current VDS= 100 V; VGS =0V =25°C - 0.02 1 μA= 175°C - - 500 μA
IGSS gate-source leakage current VGS= ±15 V; VDS=0V - 2 100 nA
RDSon drain-source on-state
resistance
VGS =5V; ID =25A;
Figure7 and8 =25°C - 8.6 10 mΩ= 175 °C- - 25 mΩ
VGS= 4.5 V; ID =25A - - 11 mΩ
VGS =10V; ID=25A - 8.3 9.7 mΩ
Dynamic characteristicsQg(tot) total gate charge VGS =5V; VDD =80V; =25A; Figure14
-86 - nC
Qgs gate-to-source charge - 16 - nC
Qgd gate-to-drain (Miller) charge - 32 - nC
Ciss input capacitance VGS =0V; VDS =25V;=1 MHz; Figure12 8284 11045 pF
Coss output capacitance - 676 811 pF
Crss reverse transfer capacitance - 237 325 pF
td(on) turn-on delay time VDD=30 V; RL= 1.2Ω;
VGS =5V; RG =10Ω
-60 - ns rise time - 110 - ns
td(off) turn-off delay time - 250 - ns fall time - 94 - ns internal drain inductance from drain lead 6 mm from
package to center of die 4.5 - nH
from contact screw on
mounting base to center of
die SOT78 3.5 - nH
from upper edge of drain
mounting base to center of
die SOT404 2.5 - nH internal source inductance from source lead to source
bond pad 7.5 - nH
Philips Semiconductors BUK95/9610-100B
TrenchMOS™ logic level FET
Source-drain diodeVSD source-drain (diode forward)
voltage=40 A; VGS =0V;
Figure15 0.85 1.2 V
trr reverse recovery time IS =20A; dIS/dt= −100 A/μs
VGS= −10 V; VDS =30V
-78 - ns recovered charge - 268 - nC
Table 4: Characteristics…continued =25 °C unless otherwise specified.
Philips Semiconductors BUK95/9610-100B
TrenchMOS™ logic level FET
Philips Semiconductors BUK95/9610-100B
TrenchMOS™ logic level FET
