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BUK7540-100A
TrenchMOS(tm) transistor Standard level FET
Philips Semiconductors Product specification
TrenchMOS transistor BUK7540-100A
Standard level FET
GENERAL DESCRIPTION QUICK REFERENCE DATAN-channel enhancement mode
SYMBOL PARAMETER MAX. UNITStandard level field-effect power
transistorina plastic envelope using VDS Drain-source voltage 100 V
’trench’ technology which features ID Drain current (DC) 37 A
very low on-state resistance.Itis Ptot Total power dissipation 138 W
intended for usein automotive and Tj Junction temperature 175 ˚C
general purpose switching RDS(ON) Drain-source on-state 40 mΩ
applications. resistance VGS = 5 V
PINNING - TO220AB PIN CONFIGURATION SYMBOL
PIN DESCRIPTION gate drain source
tab drain
LIMITING VALUESLimiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNITVDS Drain-source voltage - - 100 V
VDGR Drain-gate voltage RGS = 20 kΩ - 100 V
±VGS Gate-source voltage - - 20 V Drain current (DC) Tmb = 25 ˚C - 37 A Drain current (DC) Tmb = 100 ˚C - 26 A
IDM Drain current (pulse peak value) Tmb = 25 ˚C - 149 A
Ptot Total power dissipation Tmb = 25 ˚C - 138 W
Tstg, Tj Storage & operating temperature - - 55 175 ˚C
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNITRth j-mb Thermal resistance junction to - - 1.1 K/W
mounting base
Rth j-a Thermal resistance junction to in free air 60 - K/W
ambient123
tab
Philips Semiconductors Product specification
TrenchMOS transistor BUK7540-100A
Standard level FET
STATIC CHARACTERISTICSTj= 25˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNITV(BR)DSS Drain-source breakdown VGS = 0 V; ID = 0.25 mA; 100 - - V
voltage Tj = -55˚C 89 - - V
VGS(TO) Gate threshold voltage VDS = VGS; ID = 1 mA 2 3 4 V
Tj = 175˚C 1 - - V
Tj = -55˚C - - 4.4 V
IDSS Zero gate voltage drain current VDS = 100 V; VGS = 0 V; - 0.05 10 μA
Tj = 175˚C - - 500 μA
IGSS Gate source leakage current VGS = ±20 V; VDS = 0 V - 2 100 nA
RDS(ON) Drain-source on-state VGS = 10 V; ID = 40 A - 30 40 mΩ
resistance Tj = 175˚C - - 108 mΩ
DYNAMIC CHARACTERISTICSTmb = 25˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNITCiss Input capacitance VGS = 0 V; VDS = 25 V; f = 1 MHz - 1720 2293 pFoss Output capacitance - 216 259 pFrss Feedback capacitance - 133 182 pF
td on Turn-on delay time VDD = 30 V; Rload =1.2Ω; - 12 18 ns Turn-on rise time VGS = 5 V; RG = 10 Ω - 5583ns
td off Turn-off delay time - 48 67 ns Turn-off fall time - 30 42 ns Internal drain inductance Measured from contact screw on - 3.5 - nH
tab to centre of die Internal drain inductance Measured from drain lead 6 mm - 4.5 - nH
from package to centre of die Internal source inductance Measured from source lead 6 mm - 7.5 - nH
from package to source bond pad
REVERSE DIODE LIMITING VALUES AND CHARACTERISTICSTj = 25˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNITIDR Continuous reverse drain - - 37 A
currentDRM Pulsed reverse drain current - - 149 A
VSD Diode forward voltage IF = 25 A; VGS = 0 V - 0.85 1.2 V
IF = 37 A; VGS = 0 V - 1.1 - V
trr Reverse recovery time IF = 37 A; -dIF/dt = 100 A/μs; - 70 - ns
Qrr Reverse recovery charge VGS = -10 V; VR = 30 V - 0.24 - μC
Philips Semiconductors Product specification
TrenchMOS transistor BUK7540-100A
Standard level FET
AVALANCHE LIMITING VALUE
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNITWDSS1 Drain-source non-repetitive ID = 26 A; VDD ≤ 25 V; - - 31 mJ
unclamped inductive turn-off VGS = 5 V; RGS = 50 Ω; Tmb = 25 ˚C
energy
Fig.1. Normalised power dissipation.
PD% = 100⋅PD/PD 25 ˚C = f(Tmb)
Fig.2. Normalised continuous drain current.
ID% = 100⋅ID/ID 25 ˚C = f(Tmb); VGS ≥ 10 V
Fig.3. Safe operating area
ID & IDM = f(VDS); IDM single pulse; parameter tp
Fig.4. Transient thermal impedance.
Zth j-mb = f(t); parameter D = tp/T 20 40 60 80 100 120 140 160 180
Tmb / C
PD% Normalised Power Derating120
110
100
90
80
70
60
50
40
30
20
10 1
ID/A 100 1000
VDS/V 20 40 60 80 100 120 140 160 180
Tmb / C
ID% Normalised Current Derating120
110
100
90
80
70
60
50
40
30
20
10
1E-07 1E-05 1E-03 1E-01 1E+01
t/s
Zth/(K/W)
Philips Semiconductors Product specification
TrenchMOS transistor BUK7540-100A
Standard level FETFig.5. Typical output characteristics, Tj = 25 ˚C.
ID = f(VDS)
Fig.6. Typical on-state resistance, Tj = 25 ˚C.
RDS(ON) = f(ID)
Fig.7. Typical on-state resistance, Tj = 25 ˚C.
Fig.8. Typical transfer characteristics.
ID = f(VGS)
Fig.9. Typical transconductance, Tj = 25 ˚C.
gfs = f(ID)
Fig.10. Normalised drain-source on-state resistance.
0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
Drain-Source Voltage, VDS (V)
Drain Current, ID (A)
012345 6789 10
Gate-source voltage, VGS (V)
Drain current, ID (A)
0.1 5 10 15 20 25 30 35 40 45 50Drain Current, ID (A)
Drain-Source On Resistance, RDS(on) (Ohms) 1020 3040ID/A
gfs/S
VGS/V
RDS(ON) Ohm
-100 -50 0 50 100 150 200
Tmb / degC Rds(on) normalised to 25degC
Philips Semiconductors Product specification
TrenchMOS transistor BUK7540-100A
Standard level FETFig.11. Gate threshold voltage.
VGS(TO) = f(Tj); conditions: ID = 1 mA; VDS = VGS
Fig.12. Sub-threshold drain current.D = f(VGS) ; conditions: Tj = 25 ˚C; VDS = VGS
Fig.14. Typical turn-on gate-charge characteristics.
VGS = f(QG)
Fig.15. Typical reverse diode current.
IF = f(VSDS); conditions: VGS = 0 V; parameter Tj
-100 -50 0 50 100 150 2000
Tj / C 10 203040QG / nC
VGS / V 23 451E-06
1E-05
1E-04
1E-03
1E-02
1E-01 Sub-Threshold Conduction
0.10.20.30.40.50.60.70.80.91 1.11.21.31.41.5
Source-Drain Voltage, VSDS (V)
Source-Drain Diode Current, IF (A)0.01 0.1 1 10 100
VDS/V
tan
e / 40 60 80 100 120 140 160 180
Tmb / C
120
110
100
90
80
70
60
50
40
30
20
10
WDSS%
Philips Semiconductors Product specification
TrenchMOS transistor BUK7540-100A
Standard level FETFig.17. Avalanche energy test circuit.
Fig.18. Maximum permissible repetitive avalanche
current(IAV) versus avalanche time(tAV) for unclamped
inductive loads.
Fig.19. Switching test circuit.
T.U.T.
VDD
VGS
VDDVGSDSS= 0.5⋅LID ⋅BVDSS /(BVDSS−VDD)
0.001 0.01 0.1 1 10
Avalanche Time, tAV (ms)
IAV