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BUK7511-55B
Trenchmos (tm) standard level FET
BUK75/76/7E11-55B renchMOS™ standard level FET
Rev. 02 — 11 November 2003 Product data Product profile
1.1 DescriptionN-channel enhancement mode field-effect power transistorina plastic package using
Philips High-Performance Automotive (HPA) TrenchMOS™ technology.
1.2 Features
1.3 Applications
1.4 Quick reference data Pinning information[1] It is not possible to make connection to pin 2 of the SOT404 package. Very low on-state resistance � Q101 compliant 175 °C rated � Standard level compatible. Automotive systems � 12 V and 24 V loads Motors, lamps and solenoids � General purpose power switching. EDS(AL)S≤ 173 mJ � RDSon= 9.9 mΩ (typ) ID≤75A � Ptot≤ 157W.
Table 1: Pinning - SOT78, SOT404, and SOT226 simplified outlines and symbol gate (g)
SOT78 (TO-220AB) SOT404 (D2 -PAK) SOT226 (I2 -PAK) drain (d) [1] source (s) mounting base,
connected to
drain (d)
MBK106
MBK116
MBK112
123MBB076
Philips Semiconductors BUK75/76/7E11-55B
TrenchMOS™ standard level FET Ordering information Limiting values[1] Current is limited by power dissipation chip rating.
[2] Continuous current is limited by package.
Table 2: Ordering informationBUK7511-55B TO-220AB Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead
TO-220AB
SOT78
BUK7611-55B D2 -PAK Plastic single-ended surface mounted package (Philips versionofD2 -PAK);
3 leads (one lead cropped)
SOT404
BUK7E11-55B I2 -PAK Plastic single-ended package (Philips version of I2-P AK); low-profile 3 lead
TO-220AB
SOT226
Table 3: Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).
VDS drain-source voltage (DC) - 55 V
VDGR drain-gate voltage (DC) RGS =20kΩ -55 V
VGS gate-source voltage (DC) - ±20 V drain current (DC) Tmb =25 °C; VGS =10V;
Figure2 and3
[1] -84 A
[2] -75 A
Tmb= 100 °C; VGS =10V; Figure2 [1] -59 A
IDM peak drain current Tmb =25 °C; pulsed; tp≤10 μs;
Figure3 338 A
Ptot total power dissipation Tmb =25 °C; Figure1 - 157 W
Tstg storage temperature −55 +175 °C junction temperature −55 +175 °C
Source-drain diodeIDR reverse drain current (DC) Tmb =25°C [1] -84 A
[2] -75 A
IDRM peak reverse drain current Tmb =25 °C; pulsed; tp≤10μs - 338 A
Avalanche ruggednessEDS(AL)S non-repetitive drain-source avalanche
energy
unclamped inductive load; ID =75A;
VDS≤55 V; VGS=10 V; RGS =50Ω;
starting Tmb =25°C 173 mJ
Philips Semiconductors BUK75/76/7E11-55B
TrenchMOS™ standard level FET
Philips Semiconductors BUK75/76/7E11-55B
TrenchMOS™ standard level FET Thermal characteristics
5.1 Transient thermal impedance
Table 4: Thermal characteristicsRth(j-mb) thermal resistance from junctionto mounting
base
Figure4 - - 0.95 K/W
Rth(j-a) thermal resistance from junction to ambient
SOT78 (TO-220AB) vertical in still air - 60 - K/W
SOT404 (D2-PAK) minimum footprint; mounted on a
printed-circuit board 50 - K/W
SOT226 (I2-PAK) vertical in still air - 60 - K/W
Philips Semiconductors BUK75/76/7E11-55B
TrenchMOS™ standard level FET Characteristics
Table 5: Characteristics =25 °C unless otherwise specified.
Static characteristicsV(BR)DSS drain-source breakdown
voltage= 0.25 mA; VGS =0V =25 °C55 - - V= −55 °C50 - - V
VGS(th) gate-source threshold voltageID=1 mA; VDS =VGS;
Figure9 =25 °C2 3 4 V= 175 °C1 - - V= −55°C - - 4.4 V
IDSS drain-source leakage current VDS=55 V; VGS =0V =25°C - 0.02 1 μA= 175°C - - 500 μA
IGSS gate-source leakage current VGS= ±20 V; VDS=0V - 2 100 nA
RDSon drain-source on-state
resistance
VGS =10V; ID =25A;
Figure7 and8 =25°C - 9.9 11 mΩ= 175 °C- - 22 mΩ
Dynamic characteristicsQg(tot) total gate charge VGS =10V; VDD =44V; =25A; Figure14
-37 - nC
Qgs gate-source charge - 9 - nC
Qgd gate-drain (Miller) charge - 12 - nC
Ciss input capacitance VGS =0V; VDS =25V;=1 MHz; Figure12 1953 2604 pF
Coss output capacitance - 375 450 pF
Crss reverse transfer capacitance - 167 230 pF
td(on) turn-on delay time VDD=30 V; RL= 1.2Ω;
VGS =10V; RG =10Ω
-11 - ns rise time - 45 - ns
td(off) turn-off delay time - 41 - ns fall time - 27 - ns internal drain inductance from drain lead 6 mm from
package to center of die 4.5 - nH
from contact screw on
mounting base to center of
die SOT78 3.5 - nH
from upper edge of drain
mounting base to center of
die SOT404/SOT226 2.5 - nH internal source inductance from source lead6 mm from
package to source bond pad 7.5 - nH
Philips Semiconductors BUK75/76/7E11-55B
TrenchMOS™ standard level FET
Source-drain diodeVSD source-drain (diode forward)
voltage=25 A; VGS =0V;
Figure15 0.85 1.2 V
trr reverse recovery time IS =20A; dIS/dt= −100 A/μs
VGS= −10 V; VDS =30V
-60 - ns recovered charge - 58 - nC
Table 5: Characteristics…continued =25 °C unless otherwise specified.
Philips Semiconductors BUK75/76/7E11-55B
TrenchMOS™ standard level FET
Philips Semiconductors BUK75/76/7E11-55B
TrenchMOS™ standard level FET
