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BTB24-800BRG-BTB24-800BWRG
24A standard and Snubberless™ Triacs
July 2007 Rev 10 1/12
A24, BTB24, BTA25
BTA26, BTB26, T2525 A standard and Snubberless™ triacs
Features High current triac Low thermal resistance with clip bonding High commutation (4 quadrant) or very high
commutation (3 quadrant) capability BTA series UL1557 certified (File ref: 81734) Packages are RoHS (2002/95/EC) compliant
ApplicationsApplications include the ON/OFF function in
applications such as static relays, heating
regulation, induction motor starting circuits, etc.,
or for phase control operation in light dimmers,
motor speed controllers, and silmilar.
The snubberless versions (BTA/BTB...W and T25
series) are especially recommended for use on
inductive loads, due to their high commutation
performances. The BTA series provides an
insulated tab (rated at 2500 VRMS).
DescriptionAvailable either in through-hole or surface-mount
packages, the BTA24, BTB24, BTA25, BTA26,
BTB26 and T25 triac series is suitable for general purpose mains power AC switching.
TM: Snubberless is a trademark of STMicroelectronics
Table 1. Device summary Insulated packages 600 V version available only with IGT = 50 mA (Snubberless and Standard)
Characteristics BTA24, BTB24, BTA25, BTA26, BTB26, T252/12
1 Characteristics
Table 2. Absolute maximum ratings
Table 3. Electrical characteristics (Tj = 25° C, unless otherwise specified), Snubberless and
logic level (3 quadrants) T25, BTA/BTB24...W, BTA25...W, BTA26...W minimum IGT is guaranted at 5% of IGT max. for both polarities of A2 referenced to A1.
BTA24, BTB24, BTA25, BTA26, BTB26, T25 Characteristics 3/12
Table 4. Electrical characteristics (Tj = 25° C, unless otherwise specified),
standard (4 quadrants), BTB24...B, BTA25...B, BTA26...B, BTB26...B minimum IGT is guaranted at 5% of IGT max. for both polarities of A2 referenced to A1.
Table 5. Static characteristics for both polarities of A2 referenced to A1.
Table 6. Thermal resistance S = Copper surface under tab.
Characteristics BTA24, BTB24, BTA25, BTA26, BTB26, T254/12
Figure 3. D2 PAK RMS on-state current versus
ambient temperature (printed
circuit board FR4, copper
thickness: 35µm) (full cycle)
Figure 4. Relative variation of thermal
impedance versus pulse
duration
Figure 5. On-state characteristics
(maximum values)
Figure 6. Surge peak on-state current
versus number of cycles
BTA24, BTB24, BTA25, BTA26, BTB26, T25 Characteristics 5/12
Figure 7. Non-repetitive surge peak on-state
current for a sinusoidal pulse with
width tp < 10 ms and corresponding
value of I2t
Figure 8. Relative variation of gate trigger
current, holding current and
latching current versus junction
temperature (typical values)
Figure 9. Relative variation of critical rate of
decrease of main current versus
(dV/dt)c (typical values)
Figure 10. Relative variation of critical rate of
decrease of main current versus Tj
Figure 11.D2 PAK thermal resistance junction to
ambient versus copper surface under
tab (printed circuit board FR4, copper
thickness: 35 µm)
Ordering information scheme BTA24, BTB24, BTA25, BTA26, BTB26, T256/12
Ordering information scheme
Figure 12. BTA and BTB series
Figure 13. T25 series
