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BTA312-800C
3Q Hi-Com Triac
A312-800C3Q Hi-Com Triac4 October 2012 Product data sheet Product profile
1.1 General description
Planar passivated high commutation three quadrant triac in a SOT78 (TO-220AB) plasticpackage intended for use in circuits where high static and dynamic dV/dt and high dI/dtcan occur. This "series C" triac will commutate the full RMS current at the maximum ratedjunction temperature without the aid of a snubber.
1.2 Features and benefits 3Q technology for improved noise immunity• High commutation capability with maximum false trigger immunity• High voltage capability• Less sensitive gate for high noise immunity• Planar passivated for voltage ruggedness and reliability• Triggering in three quadrants only• Very high immunity to false turn-on by dV/dt
1.3 Applications Electronic thermostats (heating and cooling)• High power motor controls e.g. washing machines and vacuum cleaners• Rectifier-fed DC inductive loads e.g. DC motors and solenoids
1.4 Quick reference data
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VDRM repetitive peak off-
state voltage - 800 V
ITSM non-repetitive peak on-
state current
full sine wave; Tj(init) = 25 °C;
tp = 20 ms; Fig. 4; Fig. 5 - 100 A
IT(RMS) RMS on-state current full sine wave; Tmb ≤ 100 °C; Fig. 1;
Fig. 2; Fig. 3 - 12 A
Static characteristics
VD = 12 V; IT = 0.1 A; T2+ G+; - 35 mAIGT gate trigger current - 35 mA
NXP Semiconductors BTA312-800C
3Q Hi-Com Triac
Symbol Parameter Conditions Min Typ Max Unit
VD = 12 V; IT = 0.1 A; T2- G-;
Tj = 25 °C; Fig. 7 - 35 mA Pinning information
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol T1 main terminal 1 T2 main terminal 2 G gate T2 mounting base; mainterminal 22
TO-220AB (SOT78)
sym051 Ordering information
Table 3. Ordering information
PackageType number
Name Description Version
BTA312-800C TO-220AB plastic single-ended package; heatsink mounted; 1 mountinghole; 3-lead TO-220AB SOT78
BTA312-800C/DG TO-220AB plastic single-ended package; heatsink mounted; 1 mounting
hole; 3-lead TO-220AB
SOT78 Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDRM repetitive peak off-state voltage - 800 V
IT(RMS) RMS on-state current full sine wave; Tmb ≤ 100 °C; Fig. 1;
Fig. 2; Fig. 3 12 A
full sine wave; Tj(init) = 25 °C;
tp = 20 ms; Fig. 4; Fig. 5 100 AITSM non-repetitive peak on-state
current 110 A
NXP Semiconductors BTA312-800C
3Q Hi-Com Triac
Symbol Parameter Conditions Min Max Unit2t I2 t for fusing tp = 10 ms; SIN - 50 A2s
dIT/dt rate of rise of on-state current IT = 20 A; IG = 0.2 A; dIG/dt = 0.2 A/µs - 100 A/µs
IGM peak gate current - 2 A
PGM peak gate power - 5 W
PG(AV) average gate power over any 20 ms period - 0.5 W
Tstg storage temperature -40 150 °C junction temperature - 125 °C
003aab686
-50 0 50 100 150Tmb(°C)
IT(RMS)
(A)
Fig. 1. RMS on-state current as a function of mountingbase temperature; maximum values
003aab687-2 10-1 1 10surge duration(s)
IT(RMS)
(A)
f = 50 Hz; Tmb = 100 °C
Fig. 2. RMS on-state current as a function of surgeduration; maximum values
003aab690 12
Ptot
(W)= 180°
120°
90°
60°
conductionangle(degrees)
formfactora60901201802.82.21.91.57
NXP Semiconductors BTA312-800C
3Q Hi-Com Triac
003aab80623-5 10-4 10-3 10-2 10-1tp(s)
ITSM
(A)
ITSM
Tj(init) = 25 °C max
(1)
tp ≤ 20 ms
(1) dIT/dt limit
Fig. 4. Non-repetitive peak on-state current as a function of pulse duration; maximum values
003aab809
120 10 102 103number of cycles (n)
ITSM
(A)
ITSM
Tj(init) = 25 °C max
1/f
f = 50 Hz
Fig. 5. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximumvalues Max Unit 1.5 K/W 2 K/W - K/W
NXP Semiconductors BTA312-800C
3Q Hi-Com Triac
003aab775
Zth(j-mb)(K/W)
tp (s)10-5 1 1010-110-210-4 10-3
(1)
(2)
(1) Unidirectional (half cycle)
(2) Bidirectional (full cycle)
Fig. 6. Transient thermal impedance from junction to mounting base as a function of pulse duration Characteristics
Table 6. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
VD = 12 V; IT = 0.1 A; T2+ G+;
Tj = 25 °C; Fig. 7 - 35 mA
VD = 12 V; IT = 0.1 A; T2+ G-;
Tj = 25 °C; Fig. 7 - 35 mA
IGT gate trigger current
VD = 12 V; IT = 0.1 A; T2- G-;
Tj = 25 °C; Fig. 7 - 35 mA
VD = 12 V; IG = 0.1 A; T2+ G+;
Tj = 25 °C; Fig. 8 - 50 mA
VD = 12 V; IG = 0.1 A; T2+ G-; - 60 mA latching current 50 mA 35 mA 1.6 V - V 1.5 V 0.5 mA
NXP Semiconductors BTA312-800C
3Q Hi-Com Triac
Symbol Parameter Conditions Min Typ Max Unit
Dynamic characteristics
dVD/dt rate of rise of off-state
voltage
VDM = 536 V; Tj = 125 °C; (VDM = 67%
of VDRM); exponential waveform; gate
open circuit
500 - - V/µs
dIcom/dt rate of change of commutating current VD = 400 V; Tj = 125 °C; IT(RMS) = 12 A;
dVcom/dt = 20 V/µs; (snubberless
condition); gate open circuit - - A/ms
Tj (°C)-50 1501000 50
003aag894
(1)
(2)
(3)
IGT
IGT(25°C)
(1) T2- G-(2) T2+ G-
(3) T2+ G+
Fig. 7. Normalized gate trigger current as a function of
junction temperature
Tj (°C)-50 1501000 50
003aag895
IL(25°C)
Fig. 8. Normalized latching current as a function ofjunction temperature

Partno	Mfg	Dc	Qty	Available	Descript
BTA312-800C \|BTA312800C	0745	N/a	850	avai	3Q Hi-Com Triac