BTA26-600B ,25A TRIACSapplications such as static relays,A2Gheating regulation, water heaters, induction motorstarting ci ..
BTA26-600B ,25A TRIACSFEATURES:A2A2Symbol Value UnitGI25 AT(RMS)A1V /V600 and 800 VDRM RRMA1A1A2A2GGIGT (Q ) 35 to 50 mA1 ..
BTA26-600B. ,25A TRIACSABSOLUTE MAXIMUM RATINGSSymbol Parameter Value UnitI RMS on-state current (full sine wave) D²PAK AT ..
BTA26-600BRG ,25A TRIACSFEATURES:A2A2Symbol Value UnitGI25 AT(RMS)A1V /V600 and 800 VDRM RRMA1A1A2A2GGIGT (Q ) 35 to 50 mA1 ..
BTA26-600BW ,25A TRIACSFEATURES:A2A2Symbol Value UnitGI25 AT(RMS)A1V /V600 and 800 VDRM RRMA1A1A2A2GGIGT (Q ) 35 to 50 mA1 ..
BTA26-600BWRG ,25A TRIACSFEATURES:A2A2Symbol Value UnitGI25 AT(RMS)A1V /V600 and 800 VDRM RRMA1A1A2A2GGIGT (Q ) 35 to 50 mA1 ..
BZX84C13 ,350mW ZENER DIODE 3.3 VOLTS THRU 33 VOLTS 5% TOLERANCE
BZX84C13 ,350mW ZENER DIODE 3.3 VOLTS THRU 33 VOLTS 5% TOLERANCE
BZX84-C13 ,Voltage regulator diodesDISCRETE SEMICONDUCTORSDATA SHEETbook, halfpageM3D088BZX84 seriesVoltage regulator diodes1999 May 1 ..
BZX84-C13 ,Voltage regulator diodesDISCRETE SEMICONDUCTORSDATA SHEETbook, halfpageM3D088BZX84 seriesVoltage regulator diodes1999 May 1 ..
BZX84-C13 ,Voltage regulator diodesFEATURES PINNING• Total power dissipation:PIN DESCRIPTIONmax. 250 mW1 anode• Three tolerance series ..
BZX84-C13 ,Voltage regulator diodesDISCRETE SEMICONDUCTORSDATA SHEETbook, halfpageM3D088BZX84 seriesVoltage regulator diodes1999 May 1 ..
BTA24-600BW-BTA24-600CW-BTA24-800BW-BTA24-800CW-BTA25-600B-BTA26600B-BTA26-600B-BTA26-600B.-BTA26-600BW-BTA26-800B-BTA26-800CW-BTB24-600B-BTB24-600BW-BTB24-600CW-BTB24-800B-BTB24-800BW-BTB24-800CW-T2535-600G
25A TRIACS
1/9
BTA/BTB24, BTA25, BTA26
and T25 Series
SNUBBERLESS™ & STANDARD 25A TRIACS
September 2002 - Ed: 6A
MAIN FEATURES:
DESCRIPTIONAvailable either in through-hole of surface and T25
mount packages, the BTA/BTB24-25-26 triac
series is suitable for general purpose AC power
switching. They can be used as an ON/OFF
function in applications such as static relays,
heating regulation, water heaters, induction motor
starting circuits...or for phase control operation in
high power motor speed controllers, soft start
circuits...The snubberless versions (BTA/BTB...W
and T25 series) are specially recommended for
use on inductive loads, thanks to their high
commutation performances.
By using an internal ceramic pad, the BTA series
provides voltage insulated tab (rated at 2500V
RMS) complying with UL standards (File ref.:
E81734).
ABSOLUTE MAXIMUM RATINGS
BTA/BTB24, BTA25, BTA26 and T25 Series2/9
ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified) SNUBBERLESS™ (3 Quadrants) T25-G, BTA/BTB24...W, BTA25...W, BTA26...W STANDARD (4 Quadrants): BTB24...B, BTA25...B, BTA26...B
STATIC CHARACTERISTICS
Note 1: minimum IGT is guaranted at 5% of IGT max.
Note 2: for both polarities of A2 referenced to A1
BTA/BTB24, BTA25, BTA26 and T25 Series3/9
THERMAL RESISTANCESS: Copper surface under tab
PRODUCT SELECTORBTB: Non insulated TO-220AB package
ORDERING INFORMATION
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OTHER INFORMATION
Note: xxx= voltage, y = sensitivity, z = type
BTA/BTB24, BTA25, BTA26 and T25 Series5/9
Fig. 1: Maximum power dissipation versus RMSon-state current (full cycle).
Fig. 2-1: RMS on-state current versus case
temperature (full cycle).
Fig. 2-2: D²PAK RMS on-state current versusambient temperature (printed circuit board FR4,
copper thickness: 35 μm), full cycle.
Fig. 3: Relative variation of thermal impedanceversus pulse duration.
Fig. 4: On-state characteristics (maximumvalues).
Fig. 5: Surge peak on-state current versus
number of cycles.
BTA/BTB24, BTA25, BTA26 and T25 Series6/9
Fig. 6: Non-repetitive surge peak on-state
current for a sinusoidal pulse with width< 10ms, and corresponding value of I²t.
Fig. 7: Relative variation of gate trigger current,holding current and latching current versus
junction temperature (typical values).
Fig. 8: Relative variation of critical rate of
decrease of main current versus (dV/dt)c (typical
values).
Fig. 9: Relative variation of critical rate of
decrease of main current versus junction
temperature.
Fig. 10: D²PAK Thermal resistance junction to
ambient versus copper surface under tab (printed
circuit board FR4, copper thickness: 35 μm).