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BTA16-700BWRG
16A TRIACS
1/7
BTA/BTB16 and T16 Series
SNUBBERLESS™ , LOGIC LEVEL & STANDARD 16A TRIACS
October 2002 - Ed: 6A
MAIN FEATURES:
DESCRIPTIONAvailable either in through-hole or surface-mount
packages, the BTA/BTB16 and T16 triac series is
suitable for general purpose AC switching. They
can be used as an ON/OFF function in applications
such as static relays, heating regulation, induction
motor starting circuits... or for phase control
operation in light dimmers, motor speed
controllers, ...
The snubberless versions (BTA/BTB...W and T16
series) are specially recommended for use on
inductive loads, thanks to their high commutation
performances. By using an internal ceramic pad,
the BTA series provides voltage insulated tab
(rated at 2500V RMS) complying with UL
standards (File ref.: E81734).
ABSOLUTE MAXIMUM RATINGS
BTA/BTB16 and T16 Series2/7
ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified) SNUBBERLESS™ and LOGIC LEVEL (3 Quadrants) STANDARD (4 Quadrants)
STATIC CHARACTERISTICS
Note 1: minimum IGT is guaranted at 5% of IGT max.
Note 2: for both polarities of A2 referenced to A1
BTA/BTB16 and T16 Series3/7
THERMAL RESISTANCESS: Copper surface under tab
PRODUCT SELECTOR
BTA/BTB16 and T16 Series4/7
OTHER INFORMATION
Note: xxx = voltage, y = sensitivity, z = type
Fig. 1: Maximum power dissipation versus RMSon-state current (full cycle).
Fig. 2-1: RMS on-state current versus case
temperature (full cycle).
Fig. 2-2: D²PAK RMS on-state current versus
ambient temperature (printed circuit board FR4,
copper thickness: 35 μm), full cycle.
Fig. 3: Relative variation of thermal impedance
versus pulse duration.
BTA/BTB16 and T16 Series5/7
Fig. 4: On-state characteristics (maximum
values)
Fig. 5: Surge peak on-state current versus
number of cycles.
Fig. 6: Non-repetitive surge peak on-state
current for a sinusoidal pulse with width< 10ms, and corresponding value of I²t.
Fig. 7: Relative variation of gate trigger current,holding current and latching current versus
junction temperature (typical values).
Fig. 8: Relative variation of critical rate of
decrease of main current versus (dV/dt)c (typical
values).
Fig. 9: Relative variation of critical rate of
decrease of main current versus junction
temperature.
BTA/BTB16 and T16 Series6/7
Fig. 10:D²PAK Thermal resistance junction to
ambient versus copper surface under tab (printed
circuit board FR4, copper thickness: 35 μm).
PACKAGE MECHANICAL DATATO-220AB (Plastic)
