BTA12-600BRG ,12A TRIACSBTA/BTB12 and T12 Series®SNUBBERLESS™, LOGIC LEVEL & STANDARD 12A TRIACS MAIN
BTA12-600BW ,12A TRIACSBTA/BTB12 and T12 Series®SNUBBERLESS™, LOGIC LEVEL & STANDARD 12A TRIACS MAIN
BTA12-600BW. ,12A TRIACSABSOLUTE MAXIMUM RATINGSSymbol Parameter Value Unit²I RMS on-state current (full sine wave)Tc = 105 ..
BTA12-600BWRG ,12A TRIACSapplications such as static relays, heatingregulation, induction motor starting circuits... or forA ..
BTA12-600C ,12A TRIACSFEATURES:A2Symbol Value UnitI12 A GT(RMS)V /V 600 and 800 V A1DRM RRMA2IGT (Q ) 5 to 50 mA1DESCRIPT ..
BTA12-600C. ,12A TRIACSABSOLUTE MAXIMUM RATINGSSymbol Parameter Value Unit²I RMS on-state current (full sine wave)Tc = 105 ..
BZX79C51 ,Zener DiodeElectrical Characteristics T =25°C unless otherwise noted AZener Voltage (Note 1) Z @ I (Ω ) Le ..
BZX79C51 ,SILICON PLANAR ZENER DIODESFEATURES• Total power dissipation: max. 500 mW• Two tolerance series: ±2%, and approx. ±5%• Working ..
BZX79-C51 ,SILICON PLANAR ZENER DIODESAPPLICATIONS MAM239• Low voltage stabilizers or voltage references.DESCRIPTIONLow-power voltage reg ..
BZX79C56 ,Zener DiodeZeners BZX79C2V4 - BZX79C180ZenersBZX79C2V4 - BZX79C180Tolerance = 5%Absolute Maximum Ratings * T ..
BZX79-C56 ,Voltage regulator diodesAPPLICATIONS MAM239• Low voltage stabilizers or voltage references.DESCRIPTIONLow-power voltage reg ..
BZX79C5V1 ,Zeners
BTA12-BTA12-600BRG-BTA12-600BWRG-BTA12-600CRG-BTA12-600CWRG-BTA12-600SWRG-BTA12-600TWRG-BTA12-800BRG-BTA12-800BWRG-BTA12-800CWRG-BTA12-800SWRG-BTB12-600BRG-BTB12-600CRG-BTB12-600CWRG-BTB12-600SWRG-BTB12-600TWRG-BTB12-800BRG-BTB12-800CWRG-T1235-600G-TR
12A TRIACS
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BTA/BTB12 and T12 Series
SNUBBERLESS™, LOGIC LEVEL & STANDARD 12A TRIACS
September 2002 - Ed: 6A
MAIN FEATURES:
DESCRIPTIONAvailable either in through-hole or surface-mount
packages, the BTA/BTB12 and T12 triac series is
suitable for general purpose AC switching. They
can be used as an ON/OFF function in
applications such as static relays, heating
regulation, induction motor starting circuits... or for
phase control operation in light dimmers, motor
speed controllers,...
The snubberless versions (BTA/BTB...W and T12
series) are specially recommended for use on
inductive loads, thanks to their high commutation
performances. Logic level versions are designed
to interface directly with low power drivers such as
microcontrollers. By using an internal ceramic
pad, the BTA series provides voltage insulated tab
(rated at 2500V RMS) complying with UL
standards (File ref.: E81734)
ABSOLUTE MAXIMUM RATINGS
BTA/BTB12 and T12 Series2/7
ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified) SNUBBERLESS™ and LOGIC LEVEL (3 Quadrants) STANDARD (4 Quadrants)
STATIC CHARACTERISTICS
Note 1: minimum IGT is guaranted at 5% of IGT max.
Note 2: for both polarities of A2 referenced to A1
BTA/BTB12 and T12 Series3/7
THERMAL RESISTANCESS = Copper surface under tab
PRODUCT SELECTORBTB: non insulated TO-220AB package
BTA/BTB12 and T12 Series4/7
OTHER INFORMATION
Note: xxx = voltage, yy = sensitivity, z = type
Fig. 1: Maximum power dissipation versus RMSon-state current (full cycle).
Fig. 2-1: RMS on-state current versus case
temperature (full cycle).
Fig. 2-2: RMS on-state current versus ambient
temperature (printed circuit board FR4, copper
thickness: 35μm),full cycle.
Fig. 3: Relative variation of thermal impedanceversus pulse duration.
BTA/BTB12 and T12 Series5/7
Fig. 4: On-state characteristics (maximumvalues).
Fig. 5: Surge peak on-state current versus
number of cycles.
Fig. 6: Non-repetitive surge peak on-state
current for a sinusoidal pulse with width< 10ms, and corresponding value of I²t.
Fig. 7: Relative variation of gate trigger current,holding current and latching current versus
junction temperature (typical values).
Fig. 8-1: Relative variation of critical rate ofdecrease of main current versus (dV/dt)c (typical
values) (BW/CW/T1235).
Fig. 8-2: Relative variation of critical rate of
decrease of main current versus (dV/dt)c (typical
values) (TW).
BTA/BTB12 and T12 Series6/7
Fig. 9: Relative variation of critical rate of
decrease of main current versus junction
temperature.
Fig. 10: D²PAK Thermal resistance junction to
ambient versus copper surface under tab (printed
circuit board FR4, copper thickness: 35 μm).
PACKAGE MECHANICAL DATAD²P AK (Plastic)
FOOTPRINT DIMENSIONS (in millimeters)D²PAK (Plastic)
