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BTA08-600
8A TRIACS
1/10
BTA/BTB08 and T8 Series
SNUBBERLESS™, LOGIC LEVEL & STANDARD 8A TRIACS
April 2002 - Ed: 5A
MAIN FEATURES:
DESCRIPTIONAvailable either in through-hole or surface-mount
packages, the BTA/BTB08 and T8 triac series is
suitable for general purpose AC switching. They
can be used as an ON/OFF function in
applications such as static relays, heating
regulation, induction motor starting circuits... or for
phase control operation in light dimmers, motor
speed controllers,...
The snubberless versions (BTA/BTB...W and T8
series) are specially recommended for use on
inductive loads, thanks to their high commutation
performances. By using an internal ceramic pad,
the BTA series provides voltage insulated tab
(rated at 2500V RMS) complying with UL
standards (File ref.: E81734)
ABSOLUTE MAXIMUM RATINGS
BTA/BTB08 and T8 Series2/10
ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified) SNUBBERLESS™ and LOGIC LEVEL (3 Quadrants) STANDARD (4 Quadrants)
STATIC CHARACTERISTICS
Note 1: minimum IGT is guaranted at 5% of IGT max.
Note 2: for both polarities of A2 referenced to A1
BTA/BTB08 and T8 Series3/10
THERMAL RESISTANCESS = Copper surface under tab
PRODUCT SELECTORBTB: non insulated TO-220AB package
4/10
OTHER INFORMATION
Note: xxx = voltage, yy = sensitivity, z = type
BTA/BTB08 and T8 Series5/10
Fig. 1: Maximum power dissipation versus RMSon-state current (full cycle).
Fig. 2-1: RMS on-state current versus case
temperature (full cycle).
Fig. 2-2: RMS on-state current versus ambient
temperature (printed circuit board FR4, copper
thickness: 35μm),full cycle.
Fig. 3: Relative variation of thermal impedanceversus pulse duration.
Fig. 4: On-state characteristics (maximum
values).
Fig. 5: Surge peak on-state current versus
number of cycles.
BTA/BTB08 and T8 Series6/10
Fig. 6: Non-repetitive surge peak on-state
current for a sinusoidal pulse with width< 10ms, and corresponding value of I²t.
Fig. 7: Relative variation of gate trigger current,holding current and latching current versus
junction temperature (typical values).
Fig. 8-1: Relative variation of critical rate ofdecrease of main current versus (dV/dt)c (typical
values). Snubberless & Logic Level Types
Fig. 8-2: Relative variation of critical rate of
decrease of main current versus (dV/dt)c (typical
values). Standard Types
Fig. 9: Relative variation of critical rate of
decrease of main current versus junction
temperature.
Fig. 10: DP AK and D2 PAK Thermal resistance
junction to ambient versus copper surface under
tab (printed circuit board FR4, copper thickness: μm).
