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BLF6G22LS-100 |BLF6G22LS100NXPN/a150avaiPower LDMOS transistor
BLF6G22LS-100 |BLF6G22LS100NXP Pb-freeN/a50avaiPower LDMOS transistor


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BLF6G22LS-100
Power LDMOS transistor
1. Product profile
1.1 General description

100 W LDMOS power transistor for base station applications at frequencies from
2000 MHz to 2200 MHz.
[1] Test signal: 3GPP; test model 1; 64 DPCH; PAR = 7 dB at 0.01 % probability on CCDF per carrier;
carrier spacing 10 MHz.
1.2 Features and benefits
Typical 2-carrier W-CDMA performance at frequencies of 2110 MHz and 2170 MHz, a
supply voltage of 28 V and an IDq of 950 mA: Average output power=25W Gain= 18.2 dB Efficiency=29% IMD3= −37 dBc ACPR= −41 dBc Easy power control Integrated ESD protection Excellent ruggedness High efficiency Excellent thermal stability Designed for broadband operation (2000 MHz to 2200 MHz) Internally matched for ease of use Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances
(RoHS)
BLF6G22LS-100
Power LDMOS transistor
Rev. 3 — 12 November 2010 Product data sheet
Table 1. Typical performance

RF performance at Tcase = 25 °C in a common source class-AB production test circuit.
2-carrier W-CDMA 2110 to 2170 28 25 18.2 29 −37[1] −41[1]
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
NXP Semiconductors BLF6G22LS-100
Power LDMOS transistor
1.3 Applications
RF power amplifiers for W-CDMA base stations and multi carrier applications in the
2000 MHz to 2200 MHz frequency range
2. Pinning information

[1] Connected to flange.
3. Ordering information

4. Limiting values

5. Thermal characteristics

Table 2. Pinning

1drain
2gate
3source [1]
Table 3. Ordering information

BLF6G22LS-100- earless flanged LDMOST ceramic package; 2 leads SOT502B
Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).
VDS drain-source voltage - 65 V
VGS gate-source voltage −0.5 +13 V drain current - 29 A
Tstg storage temperature −65 +150 °C junction temperature - 225 °C
Table 5. Thermal characteristics

Rth(j-case) thermal resistance from junction to case Tcase =80 °C; PL=25W 0.43 K/W
NXP Semiconductors BLF6G22LS-100
Power LDMOS transistor
6. Characteristics

7. Application information

7.1 Ruggedness in class-AB operation

The BLF6G22LS-100 is capable of withstanding a load mismatch corresponding to
VSWR= 10 : 1 through all phases under the following conditions: VDS =28V;
IDq =950 mA; PL = 100 W (CW); f = 2170 MHz.
Table 6. Characteristics

Tj = 25 °C unless otherwise specified.
V(BR)DSS drain-source breakdown
voltage
VGS =0V; ID= 0.5 mA 65 --V
VGS(th) gate-source threshold voltage VDS =10 V; ID= 150 mA 1.4 1.9 2.4 V
VGSq gate-source quiescent voltage VDS =28 V; ID= 900 mA 1.76 2.26 2.76 V
IDSS drain leakage current VGS =0V; VDS=28V --5 μA
IDSX drain cut-off current VGS =VGS(th) +3.75 V;
VDS =10V 28 - A
IGSS gate leakage current VGS =11V; VDS=0V - - 450 nA
gfs forward transconductance VDS =10V; ID =7.5A - 11 - S
RDS(on) drain-source on-state
resistance
VGS =VGS(th) + 3.75V; =5.25A
-0.1 0.16 Ω
Crs feedback capacitance VGS =0V; VDS =28V;
f= 1MHz
-2.1 -pF
Table 7. Application information

Mode of operation: 2-carrier W-CDMA; PAR 7 dB at 0.01 % probability on CCDF; 3GPP test
model 1; 1-64 PDPCH; f1 = 2112.5 MHz; f2 = 2122.5 MHz; f3 = 2157.5 MHz; f4 = 2167.5 MHz; performance at VDS = 28 V; IDq = 950 mA; Tcase = 25 °C; unless otherwise specified; in a
class-AB production test circuit.
PL(AV) average output power - 25 - W power gain PL(AV) = 25 W 17 18.2 - dB
IRL input return loss PL(AV) = 25 W - −9 −7dB drain efficiency PL(AV) = 25 W 27.5 29 - %
IMD3 third-order intermodulation distortion PL(AV) = 25 W - −37 −34.5 dBc
ACPR adjacent channel power ratio PL(AV) = 25 W - −41 −38.5 dBc
NXP Semiconductors BLF6G22LS-100
Power LDMOS transistor
7.2 One-tone CW

7.3 Two-tone CW

NXP Semiconductors BLF6G22LS-100
Power LDMOS transistor
7.4 2-carrier W-CDMA

NXP Semiconductors BLF6G22LS-100
Power LDMOS transistor
8. Test information

Table 8. List of components (see Figure6)
multilayer ceramic chip capacitor 5.6 pF [1] multilayer ceramic chip capacitor 1.0 pF [1]
C3, C4, C12, C13,
C17, C18
multilayer ceramic chip capacitor 1.5 μF SMD 0805; TDK or
capacitor of same
quality
C5, C6, C10, C15 multilayer ceramic chip capacitor 100 nF SMD 0603; Murata or
capacitor of same
quality multilayer ceramic chip capacitor 1.5 pF [1] multilayer ceramic chip capacitor 0.6 pF [1]
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