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BCM857BSNXPN/a30000avai45V MATCHED PAIR PNP SMALL SIGNAL TRANSISTOR IN SOT363
BCM857BVNXPN/a30000avai45V MATCHED PAIR PNP SMALL SIGNAL TRANSISTOR IN SOT563
BCM857DSPHILIPSN/a6000avaiPNP/PNP matched double transistors


BCM857BS ,45V MATCHED PAIR PNP SMALL SIGNAL TRANSISTOR IN SOT363General descriptionPNP/PNP matched double transistors in small Surface-Mounted Device (SMD) plastic ..
BCM857BV ,45V MATCHED PAIR PNP SMALL SIGNAL TRANSISTOR IN SOT563BCM857BV; BCM857BS;BCM857DSPNP/PNP matched double transistorsRev. 06 — 28 August 2009 Product data ..
BCM857DS ,PNP/PNP matched double transistorsLimiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter C ..
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BCM857BS-BCM857BV-BCM857DS
PNP/PNP matched double transistors
Product profile1.1 General description
PNP/PNP matched double transistors in small Surface-Mounted Device (SMD) plastic
packages. The transistors are fully isolated internally.
1.2 Features
Current gain matching Base-emitter voltage matching Drop-in replacement for standard double transistors
1.3 Applications
Current mirror Differential amplifier
1.4 Quick reference data
BCM857BV; BCM857BS;
BCM857DS
PNP/PNP matched double transistors
Rev. 06 — 28 August 2009 Product data sheet
Table 1. Product overview

BCM857BV SOT666 - BCM847BV BC857BV
BCM857BS SOT363 SC-88 BCM847BS BC857BS
BCM857DS SOT457 SC-74 BCM847DS -
Table 2. Quick reference data
Per transistor

VCEO collector-emitter voltage open base - - −45 V collector current - - −100 mA
hFE DC current gain VCE= −5V;= −2mA
200 290 450
NXP Semiconductors BCM857BV/BS/DS
PNP/PNP matched double transistors

[1] The smaller of the two values is taken as the numerator.
[2] The smaller of the two values is subtracted from the larger value. Pinning information Ordering information Marking
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
Per device

hFE1/hFE2 hFE matching VCE= −5V;= −2mA
[1] 0.9 1 -
VBE1−VBE2 VBE matching VCE= −5V;= −2mA
[2] --2 mV
Table 2. Quick reference data …continued
Table 3. Pinning
emitter TR1 base TR1 collector TR2 emitter TR2 base TR2 collector TR1 001aab555
sym0181 36
TR1
TR2
Table 4. Ordering information

BCM857BV - plastic surface-mounted package; 6 leads SOT666
BCM857BS SC-88 plastic surface-mounted package; 6 leads SOT363
BCM857DS SC-74 plastic surface-mounted package (TSOP6); 6 leads SOT457
Table 5. Marking codes

BCM857BV 3B
BCM857BS A9*
BCM857DS R8
NXP Semiconductors BCM857BV/BS/DS
PNP/PNP matched double transistors Limiting values

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method. Thermal characteristics
Table 6. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).
Per transistor

VCBO collector-base voltage open emitter - −50 V
VCEO collector-emitter voltage open base - −45 V
VEBO emitter-base voltage open collector - −5V collector current - −100 mA
ICM peak collector current single pulse;≤ 1ms −200 mA
Ptot total power dissipation Tamb≤25°C
SOT666 [1][2]- 200 mW
SOT363 [1]- 200 mW
SOT457 [1]- 250 mW
Per device

Ptot total power dissipation Tamb≤25°C
SOT666 [1][2]- 300 mW
SOT363 [1]- 300 mW
SOT457 [1]- 380 mW junction temperature - 150 °C
Tamb ambient temperature −65 +150 °C
Tstg storage temperature −65 +150 °C
Table 7. Thermal characteristics
Per transistor

Rth(j-a) thermal resistance from
junction to ambient
in free air
SOT666 [1][2]- - 625 K/W
SOT363 [1]- - 625 K/W
SOT457 [1]- - 500 K/W
NXP Semiconductors BCM857BV/BS/DS
PNP/PNP matched double transistors

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method. Characteristics
Per device

Rth(j-a) thermal resistance from
junction to ambient
in free air
SOT666 [1][2]- - 416 K/W
SOT363 [1]- - 416 K/W
SOT457 [1]- - 328 K/W
Table 7. Thermal characteristics …continued
Table 8. Characteristics

Tamb =25 °C unless otherwise specified
Per transistor

ICBO collector-base cut-off
current
VCB= −30V; =0A −15 nA
VCB= −30V; =0A;= 150°C −5 μA
IEBO emitter-base cut-off
current
VEB= −5V; =0A −100 nA
hFE DC current gain VCE= −5V;= −10μA 250 -
VCE= −5V;= −2mA
200 290 450
VCEsat collector-emitter
saturation voltage= −10 mA;= −0.5 mA −50 −200 mV= −100 mA;= −5mA −200 −400 mV
VBEsat base-emitter
saturation voltage= −10 mA;= −0.5 mA
[1]- −760 - mV= −100 mA;= −5mA
[1]- −920 - mV
VBE base-emitter voltage VCE= −5V;= −2mA
[2] −600 −650 −700 mV
VCE= −5V;= −10 mA
[2] -- −760 mV collector capacitance VCB= −10V; =ie =0A;
f=1MHz - 2.2 pF emitter capacitance VEB= −0.5V; =ic =0A;
f=1MHz
-10 - pF
NXP Semiconductors BCM857BV/BS/DS
PNP/PNP matched double transistors

[1] VBEsat decreases by about 1.7 mV/K with increasing temperature.
[2] VBE decreases by about 2 mV/K with increasing temperature.
[3] The smaller of the two values is taken as the numerator.
[4] The smaller of the two values is subtracted from the larger value. transition frequency VCE= −5V;= −10 mA;= 100 MHz
100 175 - MHz noise figure VCE= −5V;= −0.2 mA; =2kΩ;=10 Hz to
15.7 kHz 1.6 - dB
VCE= −5V;= −0.2 mA; =2kΩ;=1 kHz;= 200Hz 3.1 - dB
Per device

hFE1/hFE2 hFE matching VCE= −5V;= −2mA
[3] 0.9 1 -
VBE1−VBE2 VBE matching VCE= −5V;= −2mA
[4] -- 2 mV
Table 8. Characteristics …continued

Tamb =25 °C unless otherwise specified
NXP Semiconductors BCM857BV/BS/DS
PNP/PNP matched double transistors
NXP Semiconductors BCM857BV/BS/DS
PNP/PNP matched double transistors
NXP Semiconductors BCM857BV/BS/DS
PNP/PNP matched double transistors Application information Package outline
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