BAT54KFILM ,Small Signal Schottky DiodeFeaturesBAT54ZFILM■ Low conduction and reverse losses(Single)■ Negligible switching lossesSOD-123■ ..
BAT54L ,SCHOTTKY BARRIER RECTIFIERS
BAT54LP-7 , SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAYS
BAT54LT1 ,30 VOLTS SILICON HOT-CARRIER DETECTOR AND SWITCHING DIODES3I , FORWARD CURRENT (mA)FC , TOATAL CAPACITANCE (pF)TI , REVERSE CURRENT (μA)RBAT54LT1INFORMATION ..
BAT54PBF , Schottky Diode, 0.2 A
BAT54PBF , Schottky Diode, 0.2 A
BCX71K ,SMD Small Signal Transistor PNP Low Noise
BCX79 ,PNP Silicon AF Transistors (High current gain Low collector-emitter saturation voltage)
BCX79 ,PNP Silicon AF Transistors (High current gain Low collector-emitter saturation voltage)
BCX79-9 , AMPLIFIER TRANSISTORS PNP SILICON
BCX79-9 , AMPLIFIER TRANSISTORS PNP SILICON
BCX79-9 , AMPLIFIER TRANSISTORS PNP SILICON
BAT54KFILM
Small Signal Schottky Diode
October 2009 Doc ID 5505 Rev 10 1/13
T54Small signal Schottky diodes
Features Low conduction and reverse losses Negligible switching losses Low forward and reverse recovery times Extremely fast switching Surface mount device Low capacitance diode
DescriptionThe BAT54 series uses 40 V Schottky barrier
diodes packaged in SOD- 23, SOD-323,
SOD-523, SOT-23, SOT-323, or SOT -666.
Table 1. Device summary
Characteristics BAT542/13 Doc ID 5505 Rev 10
1 Characteristics
Table 2. Absolute ratings (limiting values at Tj = 25 °C, unless otherwise specified)
Table 3. Thermal parameters Epoxy printed circuit board with recommended pad layout
Table 4. Static electrical characteristics Pulse test: tp = 5 ms, δ < 2 % Pulse test: tp = 380 µs, δ < 2 %
Table 5. Dynamic characteristics
BAT54 CharacteristicsDoc ID 5505 Rev 10 3/13
Figure 1. Average forward power dissipation
versus average forward current
Figure 2. Average forward current versus
ambient temperature (δ = 1)
Figure 3. Reverse leakage current versus
reverse applied voltage
(typical values)
Figure 4. Reverse leakage current versus
junction temperature
Figure 5. Junction capacitance versus
reverse applied voltage
(typical values)
Figure 6. Forward voltage drop versus
forward current (typical values)
Characteristics BAT544/13 Doc ID 5505 Rev 10
Figure 11. Relative variation of thermal impedance junction to ambient versus pulse duration
Figure 7. Thermal resistance junction to
ambient versus copper surface
under each lead (SOD-323)
Figure 8. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SOD-323)
Figure 9. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SOT-23)
Figure 10. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SOD-523)
BAT54 Ordering information schemeDoc ID 5505 Rev 10 5/13
Ordering information scheme
Figure 12. Ordering information scheme
Package information BAT546/13 Doc ID 5505 Rev 10
3 Package information Epoxy meets UL94, V0 Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOP ACK®
specifications, grade definitions and product status are available at: .
ECOPACK® is an ST trademark.
Figure 13. SOD-123 footprint (dimensions in mm)
Table 6. SOD-123 dimensions
BAT54 Package informationDoc ID 5505 Rev 10 7/13
Figure 14. SOD-323 footprint (dimensions in mm)
Table 7. SOD-323 dimensions
