BAT30KFILM ,Small signal Schotky diodesapplications needing low forward voltage drop diodes.BAT30SFILM(Series) Table 1. Device sum ..
BAT400D , 0.5A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
BAT400D-7 , 0.5A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
BAT40V-7 , SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAYS
BAT41 ,SMALL SIGNAL SCHOTTKY DIODEBAT41®SMALL SIGNAL SCHOTTKY DIODEDESCRIPTIONGeneral purpose metal to silicon diode featuringvery lo ..
BAT41KFILM ,Low capacitance small signal Schottky diodesFeaturesBAT41ZFILM■ Low leakage current losses(Single)■ Negligible switching losses■ Low forward an ..
BCW72 ,Surface mount Si-Epitaxial PlanarTransistorsElectrical Characteristics (T = 25°C unless otherwise noted)JParameter Symbol Test Condition Min Ty ..
BCW72LT1 ,Small Signal NPNELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted) (Continued)ACharacteristic Symbol Min ..
BCW89 ,Surface mount Si-Epitaxial PlanarTransistors
BCW89 ,Surface mount Si-Epitaxial PlanarTransistors
BCW89 ,Surface mount Si-Epitaxial PlanarTransistors
BCW97 , Medium Power Amplifiers and Switches
BAT30KFILM
Small signal Schotky diodes
April 2014 DocID12564 Rev 4 1/14
BAT30Small signal Schottky diodes
Datasheet - production data
Features Very low conduction losses Negligible switching losses Low forward and reverse recovery times Extremely fast switching Surface mount device Low capacitance diode
DescriptionThe BAT30 series uses 30 V Schottky barrier
diodes encapsulated in a wide range of packages
such as SOD-323, SOD-523, SOD-923, SOT-23,
SOT-323, or SOT-666. This device is specially
suited for switching mode applications needing
low forward voltage drop diodes.
Table 1. Device summary
Characteristics BAT302/14 DocID12564 Rev 4
1 Characteristics
Table 2. Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified)
Table 3. Thermal parameters On epoxy printed circuit board with recommended pad layout
Table 4. Static electrical characteristics Pulse test: tp = 5 ms, δ < 2 % Pulse test: tp = 380 µs, δ < 2 %
BAT30 Characteristics
Table 5. Dynamic characteristics
Figure 1. Power dissipation versus average
forward current
Figure 2. Average forward current versus
ambient temperature (δ = 1)
Figure 3. Relative variation of thermal
impedance junction to ambient versus pulse
duration
Figure 4. Relative variation of thermal
impedance junction to ambient versus pulse
duration
Characteristics BAT304/14 DocID12564 Rev 4
Figure 5. Relative variation of thermal
impedance junction to ambient versus pulse
duration
Figure 6. Relative variation of thermal
impedance junction to ambient versus pulse
duration
Figure 7. Relative variation of thermal
impedance junction to ambient versus pulse
duration
Figure 8. Thermal resistance junction to
ambient versus copper surface under each lead
(SOD-923)
Figure 9. Thermal resistance junction to
ambient versus copper surface under each lead
(SOD-323)
Figure 10. Leakage current versus reverse
applied voltage (typical values)
BAT30 Characteristics
Figure 11. Relative variation of reverse leakage
current versus junction temperature (typical
values)
Figure 12. Junction capacitance versus reverse
applied voltage (typical values)
Figure 13. Forward voltage drop versus forward
current (typical values)
Figure 14. Forward voltage drop versus forward
current (typical values)
Ordering information scheme BAT30 Ordering information scheme
Figure 15. Ordering information scheme
DocID12564 Rev 4 7/14
BAT30 Package information
3 Package information Epoxy meets UL94, V0 Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: .
ECOPACK® is an ST trademark.
Figure 16. SOD-323 footprint (dimensions in mm)
Table 6. SOD-323 dimensions