BAS16L ,High-speed diodeGeneral descriptionHigh-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD)p ..
BAS16LT1 ,CASE 31808, STYLE 8 SOT23 (TO236AB)THERMAL CHARACTERISTICS1Characteristic Symbol Max UnitA6 D2Total Device Dissipation FR−5 Board PD S ..
BAS16PT , SWITCHING DIODE VOLTAGE 100 Volts CURRENT 0.15 Ampere
BAS16T ,Switching DiodesFeaturesn High switching speed: t ≤4ns n Low capacitancerrn Low leakage current n Reverse voltage: ..
BAS16T ,Switching DiodesELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)ACharacteristic Symbol Min Max UnitForw ..
BAS16T ,Switching Diodes
BCR141T ,Digital TransistorsCharacteristics at T = 25°C, unless otherwise specifiedAParameter Symbol Values Unitmin. typ. max.D ..
BCR141W ,NPN Silicon Digital Transistor (Switching circuit, inverter, interface circuit, driver circuit)BCR141...NPN Silicon Digital Transistor• Switching circuit, inverter, interface circuit, driver c ..
BCR142 ,NPN Silicon Digital Transistor (Switching circuit, inverter, interface circuit, drver circuit)Characteristics50 - -Collector-emitter breakdown voltage V V(BR)CEOI = 100 µA, I = 0 C BCollector-b ..
BCR142W ,NPN Silicon Digital Transistor (Switching circuit, inverter, interface circuit, driver circuit)BCR142...NPN Silicon Digital Transistor• Switching circuit, inverter, interface circuit, driver c ..
BCR146 ,Digital TransistorsCharacteristics50 - -Collector-emitter breakdown voltage V V(BR)CEOI = 100 µA, I = 0 C BCollector-b ..
BCR146F ,Single digital (Built-In Resistor) AF-Transistors in TSFP-3 PackageBCR146...NPN Silicon Digital Transistor• Switching circuit, inverter, interface circuit, driver c ..
BAS16H-BAS16J-BAS16L-BAS16T-BAS16VV-BAS16VY-BAS16W-BAS316-BAS316---BAS516
High-speed switching diodes
Product profile1.1 General descriptionHigh-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD)
plastic packages.
1.2 Features
1.3 Applications High-speed switching General-purpose switching
BAS16 series
High-speed switching diodes
Rev. 05 — 25 August 2008 Product data sheet
Table 1. Product overviewBAS16 SOT23 - TO-236AB single small
BAS16H SOD123F - - single small and flat lead
BAS16J SOD323F SC-90 - single very small andflat
lead
BAS16L SOD882 - - single leadless ultra
small
BAS16T SOT416 SC-75 - single ultra small
BAS16VV SOT666 - - triple isolated ultra small and flat
lead
BAS16VY SOT363 SC-88 - triple isolated very small
BAS16W SOT323 SC-70 - single very small
BAS316 SOD323 SC-76 - single very small
BAS516 SOD523 SC-79 - single ultra small andflat
lead High switching speed: trr≤ 4ns n Low capacitance Low leakage current n Reverse voltage: VR≤ 100V Repetitive peak reverse voltage:
VRRM≤ 100V Small SMD plastic packages
NXP Semiconductors BAS16 series
High-speed switching diodes
1.4 Quick reference data[1] When switched from IF=10 mA to IR=10 mA; RL= 100 Ω; measured at IR=1 mA.
Pinning information[1] The marking bar indicates the cathode.
Table 2. Quick reference data
Per diode reverse voltage - - 100 V reverse current VR=80V - - 0.5 μA
trr reverse recovery time [1] --4 ns
Table 3. Pinning
BAS16; BAS16T; BAS16W anode not connected cathode
BAS16H; BAS16J; BAS316; BAS516 cathode [1] anode
BAS16L cathode [1] anode
BAS16VV; BAS16VY anode (diode1) anode (diode2) anode (diode3) cathode (diode3) cathode (diode2) cathode (diode1)
006aaa144
006aaa764
001aab540
006aab0401
Transparent
top view
006aab0401
001aab555
006aab106
NXP Semiconductors BAS16 series
High-speed switching diodes Ordering information Marking[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
Table 4. Ordering informationBAS16 - plastic surface-mounted package; 3 leads SOT23
BAS16H - plastic surface-mounted package; 2 leads SOD123F
BAS16J SC-90 plastic surface-mounted package; 2 leads SOD323F
BAS16L - leadless ultra small plastic package; 2 terminals;
body 1.0× 0.6× 0.5 mm
SOD882
BAS16T SC-75 plastic surface-mounted package; 3 leads SOT416
BAS16VV - plastic surface-mounted package; 6 leads SOT666
BAS16VY SC-88 plastic surface-mounted package; 6 leads SOT363
BAS16W SC-70 plastic surface-mounted package; 3 leads SOT323
BAS316 SC-76 plastic surface-mounted package; 2 leads SOD323
BAS516 SC-79 plastic surface-mounted package; 2 leads SOD523
Table 5. Marking codesBAS16 A6*
BAS16H A1
BAS16J AR
BAS16L S2
BAS16T A6
BAS16VV 53
BAS16VY 16*
BAS16W A6*
BAS316 A6
BAS516 6
NXP Semiconductors BAS16 series
High-speed switching diodes Limiting values
Table 6. Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).
Per diodeVRRM repetitive peak reverse
voltage 100 V reverse voltage - 100 V forward current
BAS16 [1]- 215 mA
BAS16H
BAS16L
[2]- 215 mA
BAS16T [1]- 155 mA
BAS16VV
BAS16VY
[1][3]- 200 mA
BAS16W [1]- 175 mA
BAS16J
BAS316
BAS516
[1]- 250 mA
IFRM repetitive peak forward
current≤ 0.5 μs; 0.25 500 mA
IFSM non-repetitive peak forward
current
square wave [4] =1 μs- 4 A =1ms - 1 A=1s - 0.5 A
Ptot total power dissipation
BAS16 Tamb≤25°C [1]- 250 mW
BAS16H Tamb≤25°C [2][5]
[6]- 380 mW
[5][6]
[7]- 830 mW
BAS16J Tamb≤25°C [5][6]
[7]- 550 mW
BAS16L Tamb≤25°C [2][5]
[6]- 250 mW
BAS16T Tsp≤90°C [1]- 170 mW
BAS16VV Tamb≤25°C [1][3]
[5][8]- 180 mW
BAS16VY Tsp≤85°C [1][3]
[8]- 250 mW
BAS16W Tamb≤25°C [1]- 200 mW
BAS316 Tsp≤90°C [1][6]- 400 mW
BAS516 Tsp≤90°C [1][5]
[6]- 500 mW
NXP Semiconductors BAS16 series
High-speed switching diodes[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Device mounted on an FR4 PCB with 60 μm copper strip line.
[3] Single diode loaded.
[4] Tj =25 °C prior to surge.
[5] Reflow soldering is the only recommended soldering method.
[6] Soldering point of cathode tab.
[7] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[8] Soldering points at pins 4, 5 and6.
Thermal characteristics
Per device junction temperature - 150 °C
Tamb ambient temperature −65 +150 °C
Tstg storage temperature −65 +150 °C
Table 6. Limiting values …continuedIn accordance with the Absolute Maximum Rating System (IEC 60134).
Table 7. Thermal characteristicsRth(j-a) thermal resistance from
junction to ambient
in free air
BAS16 [1]- - 500 K/W
BAS16H [2][3]- - 330 K/W
[3][4]- - 150 K/W
BAS16J [3][4]- - 230 K/W
BAS16L [2][3]- - 500 K/W
BAS16VV [2][3]
[5]- - 700 K/W
[3][4]
[5]- - 410 K/W
BAS16W [1]- - 625 K/W
Rth(j-t) thermal resistance from
junction to tie-point
BAS16 - - 330 K/W
BAS16W - - 300 K/W
NXP Semiconductors BAS16 series
High-speed switching diodes[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB with 60 μm copper strip line.
[3] Reflow soldering is the only recommended soldering method.
[4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[5] Single diode loaded.
[6] Soldering point of cathode tab.
[7] Soldering points at pins 4, 5 and6.
Characteristics[1] Pulse test: tp≤ 300μs;δ≤ 0.02.
[2] When switched from IF=10 mA to IR=10 mA; RL= 100 Ω; measured at IR=1 mA.
[3] When switched from IF=10 mA; tr =20ns.
Rth(j-sp) thermal resistance from
junction to solder point
BAS16H [6] --70 K/W
BAS16J [6] --55 K/W
BAS16T - - 350 K/W
BAS16VY [5][7]- - 260 K/W
BAS316 [6]- - 150 K/W
BAS516 [6]- - 120 K/W
Table 7. Thermal characteristics …continued
Table 8. CharacteristicsTamb =25 °C unless otherwise specified.
Per diode forward voltage [1]=1 mA - - 715 mV=10 mA - - 855 mV=50 mA --1 V= 150 mA - - 1.25 V reverse current VR=25V --30 nA=80V - - 0.5 μA=25 V; Tj= 150°C --30 μA=80 V; Tj= 150°C --50 μA diode capacitance f=1 MHz; VR =0V
BAS16; BAS16H;
BAS16J; BAS16L;
BAS16T; BAS16VV;
BAS16VY; BAS16W;
BAS316 - 1.5 pF
BAS516 - - 1 pF
trr reverse recovery time [2] --4 ns
VFR forward recovery voltage [3]- - 1.75 V
NXP Semiconductors BAS16 series
High-speed switching diodes
NXP Semiconductors BAS16 series
High-speed switching diodes Test information Package outline
NXP Semiconductors BAS16 series
High-speed switching diodes
NXP Semiconductors BAS16 series
High-speed switching diodes
10. Packing information[1] For further information and the availability of packing methods, see Section14.
[2] T1: normal taping
[3] T2: reverse taping
Table 9. Packing methodsThe indicated -xxx are the last three digits of the 12NC ordering code.[1]
BAS16 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235
BAS16H SOD123F 4 mm pitch, 8 mm tape and reel -115 - - -135
BAS16J SOD323F 4 mm pitch, 8 mm tape and reel -115 - - -135
BAS16L SOD882 2 mm pitch, 8 mm tape and reel - - - -315
BAS16T SOT416 4 mm pitch, 8 mm tape and reel -115 - - -135
BAS16VV SOT666 2 mm pitch, 8 mm tape and reel - - -315 - mm pitch, 8 mm tape and reel - -115 - -
BAS16VY SOT363 4 mm pitch, 8 mm tape and reel; T1 [2] -115 - - -135 mm pitch, 8 mm tape and reel; T2 [3] -125 - - -165
BAS16W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135
BAS316 SOD323 4 mm pitch, 8 mm tape and reel -115 - - -135
BAS516 SOD523 2 mm pitch, 8 mm tape and reel - - -315 - mm pitch, 8 mm tape and reel -115 - - -135
