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ADT7301ARTZ-500RL7
13-Bit, ±1ºC Accurate, MicroPower Digital Temperature Sensor in 6-Lead SOT-23 and 8-Lead MSOP
13-Bit, ±0.5°C Accurate, MicroPower Digital
Temperature Sensor in 6-Lead SOT-23
Rev. PrJ
FEATURES
13-bit temperature-to-digital converter
−40°C to +150°C operating temperature range
±0.5°C typical accuracy
0.03125°C temperature resolution
Shutdown current of 1 µA
Power dissipation of 0.631 mW at VDD = 3.3 V
SPI- and DSP-compatible serial interface
Shutdown mode
Space-saving SOT-23 and MSOP packages
APPLICATIONS
Medical equipment
Automotive:
Environmental controls
Oil temperature
Hydraulic systems
Cell phones
Hard disk drives
Personal computers
Electronic test equipment
Office equipment
Domestic appliances
Process control
FUNCTIONAL BLOCK DIAGRAM Figure 1. Functional Block Diagram
GENERAL DESCRIPTION The ADT7301 is a complete temperature monitoring system
available in SOT-23 and MSOP packages. It contains a band gap
temperature sensor and a 13-bit ADC to monitor and digitize
the temperature reading to a resolution of 0.03125°C.
The ADT7301 has a flexible serial interface that allows easy
interfacing to most microcontrollers. The interface is compat-
ible with SPI®, QSPI™, and MICROWIRE™ protocols as well as
DSPs. The part features a standby mode that is controlled via
the serial interface. The ADT7301’s wide supply voltage range,
low supply current, and SPI compatible interface make it ideal
for a variety of applications, including personal computers,
office equipment, automotive, and domestic appliances. The
ADT7301 is rated for operation over the -40°C to +150°C
temperature range. It is not recommended to operate the device
at temperatures above +125°C for greater than a total of 5%
(5,000 hours) of the lifetime of the device. Any exposure
beyond this limit will affect device reliability.
PRODUCT HIGHLIGHTS 1. The ADT7301 has an on-chip temperature sensor that
allows an accurate measurement of the ambient tempera-
ture. The measurable temperature range is −40°C to
+150°C.
2. Supply voltage of 2.7 V to 5.5 V.
3. Space-saving 6-lead SOT-23 and 8-lead MSOP packages.
4. Temperature accuracy of ±0.5°C.
5. 13-bit temperature reading to 0.03125°C resolution.
6. The ADT7301 features a shutdown mode that reduces the
power consumption to 4.88 µW with VDD = 3.3 V @ 1 SPS.
TABLE OF CONTENTS Specifications.....................................................................................3
Timing Characteristics.................................................................4
Absolute Maximum Ratings............................................................5
ESD Caution..................................................................................5
Pin Configurations and Function Descriptions............................6
Typical Performance Characteristics..............................................7
Circuit Information..........................................................................8
Converter Details..........................................................................8
Temperature Value Register........................................................8
Serial Interface..............................................................................9
Microprocessor Interfacing.......................................................10
Mounting The ADT7302...........................................................12
Supply Decoupling.....................................................................12
Outline Dimensions.......................................................................13
Ordering Guide...............................................................................14
REVISION HISTORY Revision PrE: Preliminary Version
SPECIFICATIONS TA = TMIN to TMAX, VDD = 2.7 V to 5.5 V, unless otherwise noted. All specifications apply for –40°C to +150°C, unless otherwise stated
Table 1. A Grade Specifications It is not recommended to operate the device at temperatures above +125°C for greater than a total of 5% (5,000 hours) of the lifetime of the device. Any exposure
beyond this limit will affect device reliability. Thermal Time Constant is the time it takes for a starting temperature difference to change to 36.8% of it’s starting value. For example if the ADT7301 experienced a
thermal shock from 0°C to 100°C, it would take typically 2 secs for the ADT7301 to reach 63.2°C. The ADT7301 is taken out of shutdown mode and a temperature conversion is immediately performed after this write operation. Once the temperature conversion is
complete the ADT7301 is put back into shutdown mode. Guaranteed by design and characterization, not production tested.
5 Guaranteed by design and characterization, not production tested.
Specifications subject to change without notice
TIMING CHARACTERISTICS Guaranteed by design and characterization, not production tested. All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD)
and timed from a voltage level of 1.6 V.
TA = TMIN to TMAX, VDD = 2.7 V to 5.5 V, unless otherwise noted.
Table 2. 1 See Figure 13. for SPI Timing diagram.
2 Measured with the load circuit of Figure 2
1.6V
200µA
200µAIOH
IOLOUTPUT
PIN
Figure 2. Load Circuit for Data Access Time and Bus Relinquish Time
ABSOLUTE MAXIMUM RATINGS
Table 3. ADT7301 Stress Ratings 1It is not recommended to operate the ADT7301 at temperatures above 125°C
for greater than a total of 5% of the lifetime of the device. Any exposure
beyond this limit will affect device reliability. Values relate to package being used on a standard 2-layer PCB. Reference
Figure 3 for a plot of maximum power dissipation versus ambient
temperature (TA).
3TA = ambient temperature
4Junction-to-case resistance is applicable to components featuring a
preferential flow direction, e.g., components mounted on a heat sink.
Junction-to-ambient resistance is more useful for air-cooled, PCB mounted
components.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability
PO
WER
ISSI
TEMPERATURE (°C)Figure 3. Plot of Maximum Power Dissipation vs. Temperature
ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
GNDDIN
VDD
Figure 4. SOT-23
DOUT
SCLK005
Figure 5. MSOP
Table 4. Pin Function Description TYPICAL PERFORMANCE CHARACTERISTICS
ALL CAPS (Initial caps)
itial capFigure 6. Temperature Accuracy @ 3.3 V and 5 V
Figure 7.Average Operating Supply Current vs. Temperature
Figure 9. Shutdown Current vs. Supply Voltage @ 30°C
Figure 10. Temperature Accuracy vs. Supply Ripple Frequency
Time (sec)
Temp
ure (
°C)
Figure 11. Response to Thermal Shock
