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ADR293GRU
Low Noise Micropower Precision Voltage 5.0 V Reference
PIN CONFIGURATIONS
8-Lead Narrow Body SO
(R Suffix)
8-Lead TSSOP
(RU Suffix)REV.A
Low Noise Micropower
5.0 V, Precision Voltage Reference
FEATURES
6.0 V to 15 V Supply Range
Supply Current 15 �A Max
Low Noise 15 �V p–p Typ (0.1 Hz to 10 Hz)
High Output Current 5 mA
Temperature Range �40�C to �125�C
Pin Compatible with REF02/REF19x
APPLICATIONS
Portable Instrumentation
Precision Reference for 5 V Systems
A/D and D/A Converter Reference
Solar Powered Applications
Loop-Current Powered Instruments
GENERAL DESCRIPTIONThe ADR293 is a low noise, micropower precision voltage
reference that utilizes an XFET® (eXtra implanted junction
FET) reference circuit. The new XFET architecture offers sig-
nificant performance improvements over traditional bandgap
and buried Zener-based references. Improvements include: one
quarter the voltage noise output of bandgap references operating
at the same current, very low and ultralinear temperature drift,
low thermal hysteresis and excellent long-term stability.
The ADR293 is a series voltage reference providing stable and
accurate output voltage from a 6.0 V supply. Quiescent current
is only 15 µA max, making this device ideal for battery powered
instrumentation. Three electrical grades are available offering
initial output accuracy of ±3 mV, ±6 mV, and ±10 mV. Tem-
perature coefficients for the three grades are 8 ppm/°C, 15 ppm/°C
and 25 ppm/°C max. Line regulation and load regulation are
typically 30 ppm/V and 30 ppm/mA, maintaining the reference’s
overall high performance.
The ADR293 is specified over the extended industrial tempera-
ture range of –40°C to +125°C. This device is available in the
8-lead SOIC and 8-lead TSSOP packages.
XFET is a registered trademark of Analog Devices, Inc.
ADR29x Products
ADR293–SPECIFICATIONS
ELECTRICAL SPECIFICATIONSLOAD REGULATION
ELECTRICAL SPECIFICATIONSLINE REGULATION
LOAD REGULATION
ELECTRICAL SPECIFICATIONSLINE REGULATION
LOAD REGULATION
SUPPLY CURRENT
(VS = 6.0 V, TA = 25�C unless otherwise noted.)
(VS = 6.0 V, TA = –40�C ≤ TA ≤ �125�C unless otherwise noted.)
(VS = 6.0 V, TA = –25�C ≤ TA ≤ �85�C unless otherwise noted.)
ABSOLUTE MAXIMUM RATINGS1Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V
Output Short-Circuit Duration to GND. . . . . . . . . . Indefinite
Storage Temperature Range
SO, RU Package. . . . . . . . . . . . . . . . . . . �65°C to �150°C
Operating Temperature Range. . . . . . . . . . �40°C to �125°C
Junction Temperature Range
SO, RU Package. . . . . . . . . . . . . . . . . . . �65°C to �125°C
Lead Temperature (Soldering, 60 sec). . . . . . . . . . . . . 300°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2Remove power before inserting or removing units from their sockets.
CAUTIONESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADR293 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
*θJA is specified for worst-case conditions, i.e., θJA is specified for device in
socket testing; in practice, θJA is specified for a device soldered in circuit board.
ORDERING GUIDE
ADR293
PARAMETER DEFINITION
Line Regulation, the change in output voltage due to a speci-fied change in input voltage. It includes the effects of self-heating.
Line regulation is expressed in either percent-per-volt, parts-per-
million-per-volt, or microvolts-per-volt change in input voltage.
Load Regulation, the change in output voltage due to a specified
change in load current. It includes the effects of self-heating.
Load Regulation is expressed in either microvolts-per-milliam-
pere, parts-per-million-per-milliampere, or ohms of dc output
resistance.
Long-Term Stability, typical shift of output voltage of 25°C on
a sample of parts subjected to high-temperature operating life
test of 1000 hours at 125°C.
where:
VO(t0) = VO at 25°C at time 0.
VO(t1) = VO at 25°C after 1000 hours operation at 125°C.
NC = No Connect (There are in fact connections at NC pinswhich are reserved for manufacturing purposes. Users should
not connect anything at NC pins.).
Temperature Coefficient, the change of output voltage overthe operating temperature change and normalized by the output
voltage at 25°C, expressed in ppm/°C. The equation follows:
where:
VO(25°C) = VO at 25°C.
VO(T1) = VO at temperature1.
VO(T2) = VO at temperature2.
Thermal Hysteresis, is defined as the change of output voltageafter the device is cycled through temperature from +25°C to
–40°C to +85°C and back to +25°C. This is a typical value from
a sample of parts put through such a cycle.
where:
VO(25°C) = VO at 25°C.
VO_TC =VO (25°C) after temperature cycle at +25°C to
–40°C to +85°C and back to +25°C.
TEMPERATURE – �C
OUTPUT VOLTAGE – V
1251007550250–25–50TPC 1.VOUT vs. Temperature
INPUT VOLTAGE – V
SUPPLY CURRENT14121086420TPC 2.Supply Current vs. Input Voltage
TPC 3.Supply Current vs. Temperature
TPC 4.Line Regulation vs. Temperature
TPC 5.Line Regulation vs. Temperature
TPC 6.Minimum Input-Output Voltage Differential vs.
Load Current
ADR293
TEMPERATURE – �C
LOAD REGULATION
ppm/mA
1251007550250–25–50TPC 7.Load Regulation vs. Temperature
SOURCING LOAD CURRENT – mA
010
OUT
FROM NOMINALTPC 8.∆VOUT from Nominal vs. Load Current
TPC 9.Voltage Noise Density
TPC 10.Ripple Rejection vs. Frequency
TPC 11.Output Impedance vs. Frequency
TPC 12.0.1 Hz to 10 Hz Noise
