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ADP3408ARU-2.5
0.3-10.0V; GSM power management system. For GSM/DCS/PCS/CDMA handsets
REV.0
GSM Power Management System
FUNCTIONAL BLOCK DIAGRAM
FEATURES
Handles all GSM Baseband Power Management
Six LDOs Optimized for Specific GSM Subsystems
Li-Ion and NiMH Battery Charge Function
Optimized for the AD20msp430 Baseband Chipset
APPLICATIONS
GSM/DCS/PCS/CDMA Handsets
GENERAL DESCRIPTIONThe ADP3408 is a multifunction power system chip optimized
for GSM handsets, especially those based on the Analog
Devices AD20msp430 system solution. It contains six LDOs,
one to power each of the critical GSM sub-blocks. Sophisticated
controls are available for power-up during battery charging,
keypad interface, and RTC alarm. The charge circuit maintains
low current charging during the initial charge phase and provides
an end-of-charge signal when a Li-Ion battery is being charged.
The ADP3408 is specified over the temperature range of –20°C to
+85°C and is available in narrow body TSSOP-28 pin package.
ADP3408–SPECIFICATIONS1
(–20�C ≤ TA ≤ +85�C, VBAT = VBAT2 = 3 V–5.5 V, CVSIM = CVCORE = CVAN =
CVMEM = 2.2 �F, VTCXO = 0.22 �F, CVRTC = 0.1 �F, CVBAT = 10 �F, minimum loads applied on all outputs, unless otherwise noted.)
ADP3408ANALOG LDO (VAN)
ADP3408NOTESAll limits at temperature extremes are guaranteed via correlation using standard Statistical Quality Control (SQC) methods.This feature is intended to protect against catastophic failure of the device. Maximum allowed operating junction temperature is 125ºC. Operation beyond
125ºC could cause permanent damage to the device.No isolation diode present between charger input and battery.Delay set by external capacitor on the RESCAP pin.
Specifications subject to change without notice.
*RU = Thin Shrink Small Outline
PIN FUNCTION DESCRIPTIONS
PIN CONFIGURATION
ABSOLUTE MAXIMUM RATINGS*Voltage on any pin with respect to
any GND Pin . . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V to +10 V
Voltage on any pin may not exceed VBAT, with the following
exceptions: CHRIN, GATEDR, ISENSE
Storage Temperature Range . . . . . . . . . . . . .–65°C to +150°C
Operating Ambient Temperature Range . . . . .–20°C to +85°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . .125°C
θJA, Thermal Impedance (TSSOP-28)
4-Layer PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68°C/W
1-Layer PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .98°C/W
Lead Temperature Range (Soldering, 60 sec.) . . . . . . . .300°C
*This is a stress rating only; operation beyond these limits can cause the device
to be permanently damaged.
ORDERING GUIDE
CAUTIONESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADP3408 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
ADP3408
Table I. LDO Control Logic*UVLO is active only when phone is turned off.UVLO is ignored once the phone is turned on.
TPC1.Ground Current vs. Battery
Voltage
LOAD CURRENT – mA
DROPOUT VOLTAGE
mA20406080TPC4.Dropout Voltage vs. Load
Current
TPC7.Line Transient Response,
Minimum Loads
TPC2.RTC I/V Characteristic
TPC5.Line Transient Response,
Minimum Loads
TPC8.Line Transient Response,
Maximum Loads
TPC3.VRTC Reverse Leakage
Current vs. Temperature
TPC6.Line Transient Response,
Maximum Loads
TPC 9.VTCXO Load Step
ADP3408TPC 10.VSIM Load Step
TPC 13.VAN Load Step
TPC 16.Turn On Transient by
PWRONIN, Maximum Load (Part 1)
TPC 11.VMEM Load Step
TPC 14.Turn On Transient by
PWRONIN, Minimum Load (Part 1)
TPC 17.Turn On Transient by
PWRONIN, Maximum Load (Part 2)
TPC 12.VCORE Load Step
TPC 15.Turn On Transient by
PWRONIN, Minimum Load (Part 2)
TPC 18.Ripple Rejection vs. Frequency
