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ADP3408
28-Lead DashDSP ROM-based Mixed Signal DSP with 5 Analog Input Channels plus 1 Dedicated Isense Input
REV.A
GSM Power Management System
FUNCTIONAL BLOCK DIAGRAM(Pin Assignment Is for TSSOP Option)
FEATURES
Handles All GSM Baseband Power Management
6 LDOs Optimized for Specific GSM Subsystems
Li-Ion and NiMH Battery Charge Function
Optimized for the AD20msp430 Baseband Chipset
APPLICATIONS
GSM/DCS/PCS/CDMA Handsets
GENERAL DESCRIPTIONThe ADP3408 is a multifunction power system chip optimized
for GSM handsets, especially those based on the Analog Devices
AD20msp430 system solution. It contains six LDOs, one to
power each of the critical GSM subblocks. Sophisticated con-
trols are available for power-up during battery charging, keypad
interface, and RTC alarm. The charge circuit maintains low
current charging during the initial charge phase and provides an
end-of-charge signal when a Li-ion battery is being charged.
The ADP3408 is specified over the temperature range of –20°C to
+85°C and is available in a narrow body TSSOP 28-lead package
or 5 mm � 5 mm LFCSP 32-lead package.
ADP3408–SPECIFICATIONS1PWRONKEY INPUT PULL-UP
(–20�C ≤ TA ≤ +85�C, VBAT = VBAT2 = 3 V–5.5 V, CVSIM = CVCORE = CVAN =
CVMEM = 2.2 �F, VTCXO = 0.22 �F, CVRTC = 0.1 �F, CVBAT = 10 �F, minimum loads applied on all outputs, unless otherwise noted.)
ADP3408
ADP3408NOTESAll limits at temperature extremes are guaranteed via correlation using standard Statistical Quality Control (SQC) methods.This feature is intended to protect against catastrophic failure of the device. Maximum allowed operating junction temperature is 125ºC. Operation beyond
125ºC could cause permanent damage to the device.No isolation diode present between charger input and battery.Delay set by external capacitor on the RESCAP pin.
Specifications subject to change without notice.
ORDERING GUIDE
ABSOLUTE MAXIMUM RATINGS*Voltage on any pin with respect to
any GND Pin . . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V to +10 V
Voltage on any pin may not exceed VBAT, with the following
exceptions: CHRIN, GATEDR, ISENSE
Storage Temperature Range . . . . . . . . . . . . .–65°C to +150°C
Operating Ambient Temperature Range . . . . .–20°C to +85°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . .125°C
�JA, Thermal Impedance (TSSOP-28)
4-Layer JEDEC PCB . . . . . . . . . . . . . . . . . . . . . . . .68°C/W
2-Layer SEMI PCB . . . . . . . . . . . . . . . . . . . . . . . . . 98°C/W
�JA, Thermal Impedance (LFCSP)
4-Layer JEDEC PCB . . . . . . . . . . . . . . . . . . . . . . . .32°C/W
2-Layer SEMI PCB . . . . . . . . . . . . . . . . . . . . . . . .108°C/W
Lead Temperature Range (Soldering, 60 sec) . . . . . . . .300°C
*This is a stress rating only; operation beyond these limits can cause the device
to be permanently damaged.
CAUTIONESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADP3408 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
ADP3408
PIN FUNCTION DESCRIPTIONSTSSOP (RU)
LFCSP (CP)
TOP VIEW
(Not to Scale)
TOP VIEW
ADP3408
ACP1112131415163128
PIN 1
INDICATOR
SIMEN
VRTCIN
VRTC
BATSNS
MVBAT
CHRDET
CHRIN
GATEIN
VAN
VBAT
VCORE
VMEM
VBAT2
VSIM
NC
GATEDR
DGND
ISENSE
EOC
CHGEN
RESCAP
RESET ROWXPWRONKEYPWRONINTCXOENAGNDREFOUTVTCXO
PIN CONFIGURATIONS
Table I. LDO Control Logic*UVLO is active only when phone is turned off.UVLO is ignored once the phone is turned on.
ADP3408TPC1.Ground Current vs. Battery
Voltage
LOAD CURRENT – mA
DROPOUT VOLTAGE – mV
020406080TPC4.Dropout Voltage vs. Load
Current
TPC7.Line Transient Response,
Minimum Loads
TPC2.RTC I/V Characteristic
TPC5.Line Transient Response,
Minimum Loads
TPC8.Line Transient Response,
Maximum Loads
TPC3.VRTC Reverse Leakage
Current vs. Temperature
TPC6.Line Transient Response,
Maximum Loads
TPC 9.VTCXO Load Step
–Typical Performance Characteristics
TPC 10.VSIM Load Step
TPC 13.VAN Load Step
TPC 16.Turn On Transient by
PWRONIN, Maximum Load (Part 1)
TPC 11.VMEM Load Step
TPC 14.Turn On Transient by
PWRONIN, Minimum Load (Part 1)
TPC 17.Turn On Transient by
PWRONIN, Maximum Load (Part 2)
TPC 12.VCORE Load Step
TPC 15.Turn On Transient by
PWRONIN, Minimum Load (Part 2)
TPC 18.Ripple Rejection vs. Frequency
ADP3408TPC 19.Ripple Rejection vs. Battery
Voltage
TPC22.Charger VOUT vs. ILOAD
(VIN = 5.0V)
TPC20.Output Noise Density
TPC23.Charger VOUT vs. VIN
TPC21.Charger VOUT vs. Tempera-
ture, VIN = 5.0V, ILOAD = 10 mA
