ADP3301AR-5 ,High Accuracy anyCAP⑩ 100 mA Low Dropout Linear RegulatorCHARACTERISTICS A IN IN OUT Parameter Symbol Conditions Min Typ Max UnitsOUTPUT VOLTAGE V V = Nom V ..
ADP3301AR-5-REEL ,High Accuracy anyCAP® 100 mA Low Dropout Linear RegulatorSpecifications subject to change without notice.REV. 0–2–ADP3301ABSOLUTE MAXIMUM RATINGS* PIN FUNCT ..
ADP3302 ,High Precision anyCAP?Dual Low Dropout Linear RegulatorSPECIFICATIONSParameter Symbol Conditions Min Typ Max UnitsGROUND CURRENT I I = I = 100 mA 2 4 mAGN ..
ADP3302AR1 ,High Precision anyCAP⑩ Dual Low Dropout Linear RegulatorSPECIFICATIONSParameter Symbol Conditions Min Typ Max UnitsGROUND CURRENT I I = I = 100 mA 2 4 mAGN ..
ADP3302AR4 ,High Precision anyCAP⑩ Dual Low Dropout Linear Regulatorfeatures an error flag that signals when either of theOFFtwo regulators is about to lose regulation ..
ADP3302AR5 ,High Precision anyCAP⑩ Dual Low Dropout Linear RegulatorSPECIFICATIONS otherwise noted)Parameter Symbol Conditions Min Typ Max UnitsOUTPUT VOLTAGE V or V = ..
AK4120VF , Sample Rate Converter with Mixer and Volume
AK4121AVF , Asynchronous Sample Rate Converter
AK4124VF , 192KHZ/ 24BIT HIGH PERFORMANCE ASYNCHRONOUS SRC
AK4125VF , 192kHz / 24Bit High Performance Asynchronous SRC
AK4126VQ , 6ch 192kHz / 24-Bit Asynchronous SRC
AK4181AVT , TOUCH SCREEN CONTROLLER
ADP3301AR-3-ADP3301AR5-ADP3301AR-5
High Accuracy anyCAP⑩ 100 mA Low Dropout Linear Regulator
REV.0
GENERAL DESCRIPTIONThe ADP3301 is a member of the ADP330x family of precision
low dropout anyCAP™* voltage regulators. The ADP3301
stands out from the conventional LDOs with a novel architec-
ture, an enhanced process and a new package. Its patented
design includes a noninverting wideband driver and a stage that
permits the use of an internal “pole splitting” capacitor to
stabilize the feedback loop with a single output capacitor as
small as 0.47 μF. This device is stable with any type of capacitor
regardless of its ESR (Equivalent Serial Resistance) value,
including ceramic types (MLCC) for space restricted applica-
tions. The ADP3301 achieves exceptional accuracy of ±0.8% at
room temperature and ±1.4% overall accuracy over tempera-
ture, line and load regulations. The dropout voltage of the
ADP3301 is only 100 mV (typical) at 100 mA.
In addition to the new architecture and process, ADI’s new
proprietary thermally enhanced package (Thermal Coastline)
can handle 1 W of power dissipation without external heat sink
or large copper surface on the PC board. This keeps PC board
real estate to a minimum and makes the ADP3301 very
attractive for use in portable equipment.
High Accuracy anyCAP™*
100 mA Low Dropout Linear Regulator
FEATURES
High Accuracy (Over Line and Load Regulations
at +258C):60.8%
Ultralow Dropout Voltage:100 mV Typical @ 100 mA
Requires Only CO = 0.47 mF for Stability
anyCAP™* = Stable with All Types of Capacitors
Current and Thermal Limiting
Low Noise
Dropout Detector
Low Shutdown Current:1mA
Several Fixed Voltage Options
3.0 V to 12 V Supply Range
–208C to +858C Ambient Temperature Range
Thermally Enhanced SO-8 Package
Excellent Line and Load Regulations
APPLICATIONS
Cellular Telephones
Notebook, Palmtop Computers
Battery Powered Systems
Portable Instruments
Post Regulator for Switching Supplies
Bar Code ScannersThe ADP3301 operates with a wide input voltage range from
3 V to 12 V and delivers a load current in excess of 100 mA. It
features an error flag that signals when the device is about to
lose regulation or when the short circuit or thermal overload
protection is activated. Other features include shutdown and
optional noise reduction capabilities. The ADP330x anyCAP™*
LDO family offers a wide range of output voltages and output
current levels from 50 mA to 300 mA:
ADP3300 (50 mA, SOT-23)
ADP3302 (100 mA, Dual Output)
ADP3304 (100 mA, Dual Output with Separate Grounds)
ADP3303 (200 mA)
ADP3306 (300 mA)
EOUT
VOUT = +5V
GND
0.47µF
VINFigure 1. Typical Application Circuit
FUNCTIONAL BLOCK DIAGRAM*anyCAP is a trademark of Analog Devices Inc.
ADP3301–xx–SPECIFICATIONS
ELECTRICAL CHARACTERISTICSNOTESAmbient temperature of +85°C corresponds to a typical junction temperature of +125°C under typical full load test conditions.
Specifications subject to change without notice.
(@ TA = –208C to +858C, VIN = 7 V, CIN = 0.47mF, COUT = 0.47 mF, unless otherwise noted)
1
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADP3301 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
PIN FUNCTION DESCRIPTIONS
PIN CONFIGURATION
PIN FOR 5V DEVICE
OUT
OUT
GND
ERR
ABSOLUTE MAXIMUM RATINGS*
Input Supply Voltage . . . . . . . . . . . . . . . . . . . –0.3 V to +16 V
Shutdown Input Voltage . . . . . . . . . . . . . . . . –0.3 V to +16 V
Error Flag Output Voltage . . . . . . . . . . . . . . . –0.3 V to +16 V
Noise Bypass Pin Voltage . . . . . . . . . . . . . . . . –0.3 V to +5 V
Power Dissipation . . . . . . . . . . . . . . . . . . . Internally Limited
Operating Ambient Temperature Range . . . –55°C to +125°C
Operating Junction Temperature Range . . . –55°C to +125°C
θJA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
θJC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55°C/W
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300°C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
*This is a stress rating only; functional operation of the device at these or any other
conditions above those indicated in the operation section of this specification is not
implied. Exposure to absolute maximum rating conditions for extended periods
may affect device reliability.
ORDERING GUIDE
Contact the factory for the availability of other output voltage options.
*SO = Small Outline.
Other Members of anyCAP™* Family1
NOTES
1See individual data sheets for detailed ordering information.
2SO = Small Outline, SOT = Surface Mount, TSSOP = Thin Shrink Small
Outline.
ADP3301
–Typical Performance Characteristics
INPUT VOLTAGE – Volts
OUTPUT VOLTAGE – Volts
Figure 2. Line Regulation: Output
Voltage vs. Input Voltage
OUTPUT LOAD – mA
GROUND CURRENT – µA370101002030405060708090
770
Figure 5. Quiescent Current vs. Load
Current
OUTPUT LOAD – mA
INPUT-OUTPUT VOLTAGE – mV
Figure 8. Dropout Voltage vs. Output
Current
OUTPUT LOAD – mA
OUTPUT VOLTAGE – Volts
4.996255.00000
Figure 3. Output Voltage vs. Load
Current Up to 200 mA
TEMPERATURE – °C
OUTPUT VOLTAGE – %
–0.3
Figure 6. Output Voltage Variation %
vs. Temperature
INPUT VOLTAGE – Volts03043211
INPUT-OUTPUT VOLTAGE – Volts
Figure 9. Power-Up/Power-Down
INPUT VOLTAGE – Volts
GROUND CURRENT – mA
0.7
Figure 4. Quiescent Current vs. Sup-
ply Voltage
TEMPERATURE – °C
GROUND CURRENT – µA
125
Figure 7. Quiescent Current vs.
Temperature
TIME – µs0100200
INPUT-OUTPUT VOLTAGE – Volts6080120140160180
Figure 10. Power-Up Overshoot
TIME – µs
Volts
Figure 11. Line Transient Response
TIME – µs
Volts3.300500100200300400
100
Figure 14. Load Transient for 10 mA
to 100 mA Pulse
TIME – µs
Volts501015202530354045
Figure 17. Turn-Off
TIME – µs
Volts
Figure 12. Line Transient Response
Volts
TIME – sec
200
Figure 15. Short Circuit Current
FREQUENCY – Hz
RIPPLE REJECTION – dB
–1001010010M1k10k100k1M
–40
Figure 18. Power Supply Ripple
Rejection
Figure 13. Load Transient for 1 mA
to 100 mA Pulse
TIME – µs2004080120160
Volts
Figure 16. Turn-On
FREQUENCY – Hz
VOLTAGE NOISE SPECTRAL DENSITY – µV/ Hz
1001k100k10k
0.1
Figure 19. Output Noise Density
ADP3301
APPLICATION INFORMATION
anyCAP™*
The ADP3301 is very easy to use. The only external component
required for stability is a small 0.47 μF bypass capacitor on the
output. Unlike the conventional LDO designs, the ADP3301 is
stable with virtually any type of capacitors (anyCAP™*) indepen-
dent of the capacitor’s ESR (Effective Series Resistance) value.
In a typical application, if the shutdown feature is not used, the
shutdown pin (Pin 5) should be tied to the input pin. Pins 7
and 8 must be tied together, as well as Pins 1 and 2, for proper
operation.
Capacitor Selection
Output Capacitors:as with any micropower device, output
transient response is a function of the output capacitance. The
ADP3301 is stable with a wide range of capacitor values, types
and ESR (anyCAP™*). A capacitor as low as 0.47 μF is all that
is needed for stability. However, larger capacitors can be used if
high output current surges are anticipated. The ADP3301 is
stable with extremely low ESR capacitors (ESR ≈ 0), such as
multilayer ceramic capacitors (MLCC) or OSCON.
Input Bypass Capacitor:an input bypass capacitor is not
required; however, for applications where the input source is
high impedance or far from the input pins, a bypass capacitor is
recommended. Connecting a 0.47 μF capacitor from the input
pins (Pins 7 and 8) to ground reduces the circuit’s sensitivity to
PC board layout. If a bigger output capacitor is used, the input
capacitor should be 1 μF minimum.
Low ESR capacitors offer better performance on a noisy supply;
however, for less demanding requirements a standard tantalum
or aluminum electrolythic capacitor is adequate.
Noise Reduction
A noise reduction capacitor (CNR) can be used to further reduce
the noise by 6 dB–10 dB (Figure 20). Low leakage capacitors in
the 10 nF–100 nF range provide the best performance. Since
the noise reduction pin (NR) is internally connected to a high
impedance node, any connection to this node should be carefully
done to avoid noise pickup from external sources. The pad
connected to this pin should be as small as possible. Long PC
board traces are not recommended.
GND5
OFF
EOUT
1µF
VOUT = 5VVIN
Figure 20.Noise Reduction Circuit
Thermal Overload Protection
The ADP3301 is protected against damage due to excessive
power dissipation by its thermal overload protection circuit,
which limits the die temperature to a maximum of 165°C.
Under extreme conditions (i.e., high ambient temperature and
high power dissipation) where die temperature starts to rise
above 165°C, the output current is reduced until die tempera-
ture has dropped to a safe level. Output current is restored when
the die temperature is reduced.
Current and thermal limit protections are intended to protect
the device against accidental overload conditions. For normal
operation, device power dissipation should be externally limited
so that junction temperatures will not exceed 125°C.
Calculating Junction Temperature
Device power dissipation is calculated as follows :
PD = (VIN – VOUT) ILOAD + (VIN) IGND
Where ILOAD and IGND are load current and ground current, VIN
and VOUT are input and output voltages respectively.
Assuming ILOAD = 100 mA, IGND = 2 mA, VIN = 9 V and
VOUT = 5.0 V, device power dissipation is:
PD = (9V – 5V) 100 mA + (9 V) 2 mA = 418 mW
The proprietary package used in ADP3301 has a thermal
resistance of 96°C/W, significantly lower than a standard
8-pin SOIC package at 170°C/W.
Junction temperature above ambient temperature will be
approximately equal to :
0.418W × 96°C/W = 40.1°C
To limit the maximum junction temperature to 125°C, maxi-
mum ambient temperature must be lower than:
TA(MAX) = 125°C – 40.1°C = 84.9°C
Printed Circuit Board Layout Consideration
All surface mount packages rely on the traces of the PC board to
conduct heat away from the package.
In standard packages the dominant component of the heat
resistance path is the plastic between the die attach pad and the
individual leads. In typical thermally enhanced packages, one or
more of the leads are fused to the die attach pad, significantly
decreasing this component. However, to make the improvement
meaningful, a significant copper area on the PCB has to be
attached to these fused pins.
The ADP3301’s patented thermal coastline lead frame design
uniformly minimizes the value of the dominant portion of the
thermal resistance. It ensures that heat is conducted away by all
pins of the package. This yields a very low 96°C/W thermal
resistance for an SO-8 package, without any special board
layout requirements, relying on the normal traces connected to
the leads. The thermal resistance can be decreased by approxi-
mately an additional 10% by attaching a few square cm of
copper area to the VIN pin of the ADP3301 package.
