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ADP3041ARU-REEL
TFT LCD Panel Power Module
REV.D
TFT LCD Panel Power Module
FEATURES
600 kHz PWM Frequency
Fully Integrated 1.5 A Power Switch
3% Output Regulation Accuracy
Simple Compensation
Small Inductor and MLC Capacitors
300 �A Quiescent Supply Current
90% Efficiency
Undervoltage Lockout
5 Buffers
TSSOP 20-Lead Package
Pb-Free Part
APPLICATIONS
TFT LCD Bias Supplies
FUNCTIONAL BLOCK DIAGRAM
COMP
PGND
VCMO
G1O
AGND
G2O
G3O
G4O
G1I
G2I
G3I
G4I
VCMI
AVCC
GENERAL DESCRIPTIONThe ADP3041 is a fixed frequency, PWM step-up dc-to-dc
switching regulator with five buffers capable of 12 V boosted
output voltage in a TSSOP 20-lead package. It provides high
efficiency, low noise operation, and excellent dynamic response,
and is easy to use. The high switching frequency allows for small,
cost-saving, external inductive and capacitive components. The
ADP3041 operates in PWM current mode. The current limit
and the power switch are integrated completely on-chip.
Capable of operating from 2.5 V to 5.5 V input, the ADP3041
is ideal for thin-film transistor (TFT) liquid crystal display
(LCD) module applications, where local point-of-use power
regulation is required. Supporting output voltages down to 4.5 V,
the ADP3041 is ideal to generate today’s low voltage rails, pro-
viding the optimal solution in its class for delivering power
efficiently, responsively, and simply with minimal printed circuit
board area.
The ADP3041 integrates five buffers. Each buffer can deliver
35 mA output current and has rail-to-rail input and output
capability.
ADP3041–SPECIFICATIONS1(VIN = 3.3 V, TA = –40�C to +85�C, unless otherwise noted.)SOFT START
SHUTDOWN
COMPENSATION
UNDERVOLTAGE LOCKOUT
OUTPUT
ADP3041OUTPUT CHARACTERISTICS
TRANSFER CHARACTERISTICS
DYNAMIC PERFORMANCE
NOISE PERFORMANCE
NOTESAll limits at temperature extremes are guaranteed via correlation and characterization using standard Statistical Quality Control (SQC).This is the average current while switching.
Specifications subject to change without notice.
ADP3041
CAUTIONESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADP3041 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
ABSOLUTE MAXIMUM RATINGS*Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V to + 6 V
Buffer Input Voltage . . . . . . . . . . . . .–0.5 V to AVCC + 0.5 V
SW Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 V
COMP Voltage . . . . . . . . . . . . . . . . . . . . . . .–0.3 V to +2.5 V
FB Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V to +1.3 V
SD Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V to +6 V
PGND to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±200 mV
Operating Ambient Temperature Range . . . . .–40°C to +85°C
Operating Junction Temperature Range . . . .–40°C to +125°C
Storage Temperature Range . . . . . . . . . . . . .–65°C to +150°C
�JA 2-Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .143°C/W
�JA 4-Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .112°C/W
Lead Temperature Range (Soldering 60 sec) . . . . . . . . .300°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum ratings
for extended periods may affect device reliability.
PIN CONFIGURATIONFigure 1. Typical Application
PIN FUNCTION DESCRIPTIONS
ORDERING GUIDE*Z = Pb-free part.
TPC 1. Input Offset Voltage Distribution
TPC 2. Input Offset Voltage Drift Distribution
TPC 3. Input Offset Voltage vs. Temperature
TPC 4. Input Bias Current vs. Temperature
TPC 5. Input Offset Current vs. Temperature
TPC 6. Output Voltage Swing vs. Temperature
ADP3041TPC 7. Output Voltage Swing vs. Temperature
(Small Signal)
TPC 8. Voltage Gain vs. Temperature
TPC 9. Output Voltage to Supply Rail vs. Load Current
TPC 10. Supply Current/Amplifier vs. Temperature
TPC 11. Slew Rate vs. Temperature
TPC 12. Supply Current/Amplifier vs. Supply Voltage
TPC 13. Resistive Loading vs. Frequency Response
TPC 14. Capacitive Loading vs. Frequency Response
TPC 15. Closed-Loop Output Impedance vs. Frequency
TPC 16. Closed-Loop Output Swing vs. Frequency
TPC 17. Power Supply Rejection Ratio vs. Frequency,
VS = 16 V
TPC 18. Power Supply Rejection Ratio vs. Frequency,
VS = 4.5 V
ADP3041TPC 19. Voltage Noise Density vs. Frequency
TPC 20. Channel Separation vs. Frequency
TPC 21. Small Signal Overshoot vs. Load Capacitance,
VS = 16 V
TPC 22. Small Signal Overshoot vs. Load Capacitance,
VS = 4.5 V
TPC 23. Step Size vs. Settling Time
TPC 24. Large Signal Transient Response, VS = 16 V
