ADM5170AN-ADM5170AP-ADM5170JN-ADM5170JP Fast Delivery |IC PHOENIX CO.,LIMITED

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ADM5170AN-ADM5170AP-ADM5170JN-ADM5170JP
Octal, RS-232/RS-423 Line Driver
Octal, RS-232/RS-423 Line Driver
Truth TableMinimum Output Level
FEATURES
Eight Single Ended Line Drivers in One Package
Meets EIA Standard RS-232E, RS-423A and
CCITT V.10/X.26
Resistor Programmable Slew Rate
Wide Supply Voltage Range
Low Power CMOS
3-State Outputs
TTL/CMOS Compatible Inputs
Output Short Circuit Protection
Available in 28-Pin DIP/PLCC
Low Power Replacement for UC5170C
APPLICATIONS
High Speed Communication
Computer I-O Ports Peripherals
High Speed Modems
Printers
Logic Level Translation
FUNCTIONAL BLOCK DIAGRAM
MS+
MS–
SRA
GENERAL DESCRIPTION
The ADM5170 is an octal line driver suitable for digital communi-
cation systems with data rates up to 116 kB/s. Input TTL or
CMOS signal levels are inverted and translated into either EIA
RS-232E or RS-423A signal levels depending on the status of the
Mode Select inputs MS+ and MS–. With both Mode Select inputs
at GND, RS-423 operation is selected while with MS+ connected
to VDD and MS– connected to VSS, RS-232 operation is selected.
The output slew rates may be controlled using an external resistor
connected between the SRA (Slew Rate Adjust) pin and GND.
Resistor values between 2 kΩ and 10 kΩ may be selected giving a
slew rate which can be adjusted from 10 V/μs to 2.2 V/μs. This
adjustment of the slew rate allows tailoring of the output character-
istics to suit the interface cable being used.
The outputs may be disabled using the EN (Enable Input). This
feature permits sharing of a common output line.
The ADM5170 is fabricated on an advanced CMOS process
featuring low power consumption. In the disabled state the power
consumption reduces from 500 mW to 40 mW. The ADM5170 is
available in both 28-pin DIP and 28-lead PLCC packages.
DIGITAL INPUTS
OUTPUTS
Specifications subject to change without notice.
ADM5170–SPECIFICATIONS
TIMING CHARACTERISTICS
( VDD = +10 V ± 10%, VSS = –10 V ± 10%, MS+ = MS– = 0 V. All Specifications TMIN to TMAX
unless otherwise noted.)
( VDD = +10 V ± 10%, VSS = –10 V ± 10% V, MS+ = MS– = 0 V, RSRA =
10 kΩ. All Specifications TMIN to TMAX unless otherwise noted.)
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS*
(TA= 25°C unless otherwise noted)
VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+15 V
VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–15 V
Input Voltages
VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–0.3 to (VDD + 0.3 V)
Ouput Voltages
VOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–12 V to +12 V
Output Short Circuit Duration . . . . . . . . . . . . . . . . . .Continuous
Power Dissipation Plastic DIP . . . . . . . . . . . . . . . . . . . .1250 mW
(Derate at 12.5 mW/°C above +50°C)
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . . .75°C/W
Power Dissipation PLCC . . . . . . . . . . . . . . . . . . . . . . .1000 mW
(Derate at 10 mW/°C above +50°C)
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . . .80°C/W
Operating Temperature Range
Commercial (J Version) . . . . . . . . . . . . . . . . . . . .0°C to +70°C
Industrial (A Version) . . . . . . . . . . . . . . . . . . . .–40°C to +85°C
Lead Temperature (Soldering 10 sec) . . . . . . . . . . . . . . . .+300°C
Vapour Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . .+215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+220°C
*This is a stress rating only and functional operation of the device at these or any
other conditions above those indicated in the operation sections of this specifica-
tion is not implied. Exposure to absolute maximum rating conditions for extended
periods of time may affect reliability.
ORDERING GUIDE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADM5170 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
MS–
SRA
VIN
Figure 1. Timing Test Circuit
VIN
VOUT
Figure 3.Enable/Disable Timing Waveforms
Slew Rate Programming
The slew rate for the ADM5170 is controlled by a single resistor
connected between the SRA pin and GND. The slew rate is
approximately.
Slew Rate (V/μs) = 20/RSRA (kΩ)
Resistors between 2 kΩ and 10 kΩ may be used providing a slew
rate which may be varied from 10 V/μs to 2.2 V/μs. Figure 5 in the
Typical Performance Characteristics section shows how the slew
rate varies with RSRA while Figure 8 shows how the transition time
(10% to 90%) varies with RSRA. Waveshaping of the output allows
the user to control the level of interference (near-end crosstalk)
which may be coupled to adjacent circuits in an interconnection.
The recommended output characteristics for cable length and data
rate are given in the EIA RS-423A specifications.
Maximum Data Rate (kB/s) = 300/t (for rates from 1 kB/s to
100 kB/s).
Cable Length (feet) = 100 X t (Max Length = 4000 ft.)
where t is the transition time (in μs) for the output to swing from
10% to 90% of its steady state values. The absolute maximum data
rateis100 kB/sandthemaximumcable length is limited to 4000 ft.
Output Mode Programming
The ADM5170 has two programmable output modes which
provide different output voltage levels. The low output mode meets
the specifications of EIA standards RS-423A while the high output
mode meets the RS-232 specifications. The high output mode
provides greater output swings and is suitable for driving lines
where higher attenuation levels must be tolerated. This mode is
selected by connecting the mode select pins to the supplies, MS+ to
VDD and MS– to VSS. The low output mode is selected by connect-
ing both mode select pins MS+ and MS– to GND. This mode
provides a controlled output swing with lower output levels.
1Minimum Output Level.
Typical Application Circuit
A typical application circuit using a single driver in the ADM5170
is shown in Figure 4. This circuit is suitable for either RS-232 or
RS-423 communication. An ADM5180 octal receiver is used to
translate the signal back to CMOS logic level at the receiving end.
VSS
TIE TO GND
INPUT
RS-232/RS-422A
TRANSMISSION
RSL
PIN FUNCTION DESCRIPTION
VSS
GND
MS+, MS–
SRA
ADM5170
PIN CONFIGURATIONS
DIP
GND
NC = NO CONNECT EOVDDMS+
VSS
SRAMS–NCNC
PLCC
NC = NO CONNECT
VDD
MS+
VSS
SRANC
MS–GNDNC
Figure 8.Typical Rise/Fall Times (RS-423A Mode) vs.SRA
Figure 5.Typical Slew Rate vs. RSRA64
ΩRSRA – kΩ
TRANSITION TIME – 64
ΩRSRA – kΩ
SLEW RATE – V/µ
Figure 9.Slew Rate (RSRA = 10 kΩ)Figure 6.Slew Rate (RSRA = 2 kΩ)
VDD/VSS – V
DRIVER OUTPUT VOLTAGE – V9131211
Figure 10.VOH/VOL vs. VDD/VSS (RS-423 Mode)Figure 7.VOH/VOL vs. VDD/VSS (RS-232 Mode)
ADM51701510
OUTPUT CURRENT – ˙mA
DRIVER OUTPUT VOLTAGE – 1510
OUTPUT CURRENT – ˙mA
DRIVER OUTPUT VOLTAGE –
Figure 11.Driver Output Voltage vs. Output Current
(RS-232 Mode)
Figure 12.Driver Output Voltage vs. Output Current
(RS-423 Mode)
PIN
0.015 (0.381)
0.008 (0.204)
0.195 (4.95)
(6.35)
MAX
0.022 (0.558)
0.014 (0.356)
(2.54)
BSC
0.200 (5.05)
0.125 (3.18)
0.070 (1.77)
MAX
0.060 (1.52)
0.015 (0.38)
1.565 (39.70)
1.380 (35.10)
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
28-Lead Plastic DIP28-Lead Plastic Leaded Chip Carrier (PLCC)
(N Suffix)(P Suffix)
C1853–7.5–10/93
PRINTED IN U.S.A.

Partno	Mfg	Dc	Qty	Available	Descript
ADM5170AN	AD	N/a	32	avai	Octal, RS-232/RS-423 Line Driver
ADM5170AP	AD	N/a	32	avai	Octal, RS-232/RS-423 Line Driver
ADM5170JN		N/a	7	avai	Octal, RS-232/RS-423 Line Driver
ADM5170JP		N/a	112	avai	Octal, RS-232/RS-423 Line Driver